Datasheet Download

R5011FNX
Nch 500V 11A Power MOSFET
Datasheet
l Outline
VDSS
500V
RDS(on)(Max.)
0.52Ω
ID
±11A
PD
59W
TO-220FM
l Inner circuit
l Features
1) Fast reverse recovery time(trr).
2) Low on-resistance.
3) Fast switching speed.
4) Gate-source voltage (VGSS) guaranteed to
be ±30V.
5) Drive circuits can be simple.
6) Parallel use is easy.
l Packaging specifications
Packing
l Application
Type
Switching
Reel size (mm)
Bulk
-
Tape width (mm)
-
Basic ordering unit (pcs)
Taping code
500
-
Marking
R5011FNX
l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)
Parameter
Drain - Source voltage
Symbol
VDSS
Value
500
Unit
V
TC = 25°C
ID*1
±11
A
TC = 100°C
ID*1
±5.4
A
Pulsed drain current
IDP*2
±44
A
Gate - Source voltage
VGSS
±30
V
Avalanche current, repetitive
IAR*3
5.5
A
Avalanche energy, single pulse
EAS*3
8.1
mJ
Avalanche energy, repetitive
Power dissipation (TC = 25°C)
EAR*5
3.5
mJ
PD*4
59
W
Tj
150
℃
Tstg
-55~ +150
℃
Continuous drain current
Junction temperature
Operating junction and storage temperature range
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20160324 - Rev.001 R5011FNX
Datasheet
l Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Conditions
Values
Unit
Reverse diode dv/dt
dv/dt
-
15
V/ns
Drain - Source voltage slope
dv/dt
VDS = 400V, Tj = 125℃
50
V/ns
l Thermal resistance
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Thermal resistance, junction - case
RthJC
-
-
2.10
℃/W
Thermal resistance, junction - ambient
RthJA
-
-
70
℃/W
Soldering temperature, wavesoldering for 10s
Tsold
-
-
265
℃
l Electrical characteristics (T a = 25°C)
Parameter
Drain - Source breakdown
voltage
Zero gate voltage
drain current
Gate - Source leakage current
Gate threshold voltage
Static drain - source
on - state resistance
Gate resistance
Symbol
Conditions
Unit
Min.
Typ.
Max.
500
-
-
VDS = 500V, VGS = 0V
Tj = 25°C
-
1
100
Tj = 125°C
-
-
10000
IGSS
VGS = ±30V, VDS = 0V
-
-
±100
nA
VGS(th)
VDS = 10V, ID = 1mA
2.0
-
4.0
V
VGS = 10V, ID = 5.5A
-
0.40
0.52
Tj = 125°C
-
0.85
-
f =1MHz, open drain
-
8.8
-
V(BR)DSS VGS = 0V, ID = 1mA
IDSS
RDS(on)*6 Tj = 25°C
RG
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© 2016 ROHM Co., Ltd. All rights reserved.
Values
2/12
V
μA
Ω
Ω
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
4.5
-
-
Forward Transfer
Admittance
|Yfs| *6
Input capacitance
Ciss
VGS = 0V
-
950
-
Output capacitance
Coss
VDS = 25V
-
580
-
Reverse transfer capacitance
Crss
f = 1MHz
-
30
-
Effective output capacitance,
energy related
Co(er)
-
50.8
-
Co(tr)
Turn - on delay time
td(on)*6
Fall time
VGS = 0V
VDS = 0V to 400V
pF
pF
-
51.2
-
VDD ⋍ 250V,VGS = 10V
-
26
-
ID = 5.5A
-
28
-
td(off)*6
RL ⋍ 45.5Ω
-
75
-
tf*6
RG = 10Ω
-
30
-
tr*6
Turn - off delay time
S
Effective output capacitance,
time related
Rise time
VDS = 10V, ID = 5.5A
ns
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Total gate charge
Qg*6
Gate - Source charge
Qgs*6
Gate - Drain charge
Qgd*6
Gate plateau voltage
Conditions
VDD ⋍ 250V,
ID = 11A,
VGS = 10V
V(plateau) VDD = 250V, ID = 11A
Unit
Min.
Typ.
Max.
-
30
-
-
7
-
-
12
-
-
5.9
-
nC
V
*1 Limited only by maximum channel temperature allowed.
*2 Pw ≤ 10μs, Duty cycle ≤ 1%
*3 L≒500μH, VDD=50V, RG=25Ω, STARTING Tj=25℃
*4 TC=25℃
*5 L≒500μH, VDD=50V, RG=25Ω, STARTING Tj=25℃, f=10kHz
*6 Pulsed
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© 2016 ROHM Co., Ltd. All rights reserved.
3/12
20160324 - Rev.001
R5011FNX
Datasheet
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Parameter
Symbol
Continuous forward
current
Values
Conditions
IS*1
Unit
Min.
Typ.
Max.
-
-
11
A
-
-
44
A
-
-
1.5
V
55
85
115
ns
-
0.33
-
μC
-
7.4
-
A
Tc = 25℃
Pulse forward current
ISP*2
Forward voltage
VSD*6
VGS = 0V, IS = 11A
trr*6
Reverse recovery time
Reverse recovery charge
Qrr*6
Peak reverse recovery current
Imm*6
IS = 11A, VGS=0V
di/dt = 100A/μs
l Typical Transient Thermal Characteristics
Symbol
Value
Unit
Rth1
0.178
Rth2
0.853
Rth3
2.36
K/W
Symbol
Value
Cth1
0.00269
Cth2
0.0273
Cth3
0.463
Unit
Ws/K
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© 2016 ROHM Co., Ltd. All rights reserved.
4/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Avalanche Energy Derating
Curve vs. Junction Temperature
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5/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Tj = 150°C Typical Output
Characteristics (I)
Fig.8 Tj = 150°C Typical Output
Characteristics (II)
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6/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.9 Breakdown Voltage vs.
Junction Temperature
Fig.10 Typical Transfer Characteristics
Fig.11 Gate Threshold Voltage vs.
Junction Temperature
Fig.12 Forward Transfer Admittance vs.
Drain Current
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7/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.13 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Fig.14 Static Drain - Source On - State
Resistance vs. Junction Temperature
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current
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8/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.16 Typical Capacitance vs.
Drain - Source Voltage
Fig.17 Coss Stored Energy
Fig.18 Switching Characteristics
Fig.19 Dynamic Input Characteristics
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9/12
20160324 - Rev.001
R5011FNX
Datasheet
l Electrical characteristic curves
Fig.20 Inverse Diode Forward Current
vs. Source - Drain Voltage
Fig.21 Reverse Recovery Time vs.
Inverse Diode Forward Current
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© 2016 ROHM Co., Ltd. All rights reserved.
10/12
20160324 - Rev.001
R5011FNX
Datasheet
l Measurement circuits
Fig.1-1 Switching Time
Circuit
Measurement
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement
Circuit
Fig.2-2 Gate Charge
Waveform
Fig.3-1 Avalanche Measurement
Circuit
Fig.3-2 Avalanche Waveform
Fig.4-1 dv/dt Measurement
Circuit
Fig.4-2 dv/dt Waveform
Fig.5-1 dv/dt Measurement
Circuit
Fig.5-2 dv/dt Waveform
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© 2016 ROHM Co., Ltd. All rights reserved.
11/12
20160324 - Rev.001
R5011FNX
Datasheet
l Dimensions
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© 2016 ROHM Co., Ltd. All rights reserved.
12/12
20160324 - Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
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responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
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Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
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