Materials Declaration Package Body Size LeadCount Option Item Silica Fused Epoxy, Cresol Novolac Phenol Resin Antimony Trioxide Brominated Epoxy Resin Carbon Black Item Cu Ni Si Mg MQFP 10 X 10 x 2.0 (+3.9) 52 Pb Free Molding Compound % of Compound 72.61 19.36 4.84 1.45 1.45 0.29 Weight (g) 2.72 E-01 7.24 E-02 1.81 E-02 5.42 E-03 5.42 E-03 1.09 E-03 PPM 526073 140267 35066 10506 10506 2102 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Weight (g) 1.00 E-01 6.80 E-04 3.14 E-03 1.57 E-04 PPM 193867 1317 6083 304 Internal Leadframe Plating % of Plating 100.0 Weight (g) 1.04 E-03 PPM Ag Sn External Leadframe Plating % of Plating 100.0 Weight (g) 5.53 E-03 PPM 10704 Bond Wires % of Wire 99.99 Weight (g) 1.45 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 2.78 E-02 PPM 53861 Die Attach % of Die Attach 72.5 7.5 5.0 5.0 5.0 5.0 Weight (g) 1.70 E-03 1.75 E-04 1.17 E-04 1.17 E-04 1.17 E-04 1.17 E-04 PPM Item Item Ag Epoxy Resin Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Mixed aryl glycidyl compound Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 3 None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS 2009 2803 8361J 3284 339 227 227 227 227 Package Totals PPM Weight (g) 1000000 5.16 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary 6650 STS-S-B Materials Declaration Package Body Size LeadCount Option Item Silica Fused Epoxy, Cresol Novolac Phenol Resin Antimony Trioxide Brominated Epoxy Resin Carbon Black Item Cu Ni Si Mg MQFP 10 X 10 x 2.0 (+3.9) 52 Sn/Pb Molding Compound % of Compound 72.61 19.36 4.84 1.45 1.45 0.29 Weight (g) 2.72 E-01 7.24 E-02 1.81 E-02 5.42 E-03 5.42 E-03 1.09 E-03 PPM 526073 140267 35066 10506 10506 2102 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Weight (g) 1.00 E-01 6.80 E-04 3.14 E-03 1.57 E-04 PPM 193867 1317 6083 304 Weight (g) 1.04 E-03 PPM Ag Internal Leadframe Plating % of Plating 100.0 Sn Pb External Leadframe Plating % of Plating Weight (g) 85 4.70 E-03 15 8.29 E-04 Item Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3.00 US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS None Detected None Detected Analysis was performed by GC/MS PPM 9098 1606 Bond Wires % of Wire 99.99 Weight (g) 1.45 E-03 PPM Weight (g) 2.78 E-02 PPM Si Chip % of Chip 100.0 Die Attach % of Die Attach 72.5 7.5 5.0 5.0 5.0 5.0 Weight (g) 1.70 E-03 1.75 E-04 1.17 E-04 1.17 E-04 1.17 E-04 1.17 E-04 PPM Package Totals Weight (g) 5.16 E-01 Molding Compound Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS 2009 Au Item Ag Epoxy Resin Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Mixed aryl glycidyl compound Item Pb Cd Hg Cr+6 PBB PBDE 2803 53861 3284 339 227 227 227 227 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary STS-S-A