Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Subtotal Item Cu Cr Sn Zn Subtotal Ag Item Sn TQFP - EP 12 X 12 80 Pb-Free Molding Compound % of Compound 88 11.5 0.5 Weight (g) 2.11 E-01 2.75 E-02 1.20 E-03 2.39 E-01 PPM 556661 72746 3163 632570 Weight (g) 1.07 E-01 3.23 E-04 2.69 E-04 2.15 E-04 1.08 E-01 PPM 282236 854 711 568 284369 Internal Leadframe Plating Weight (g) % of Plating 9.60 E-04 100 PPM 2537 External Leadframe Plating % of Plating Weight (g) 100 7.37 E-03 PPM 19474 Leadframe % of Leadframe 99.25 0.3 0.25 0.2 Au Bond Wires % of Wire 99.99 Weight (g) 1.66 E-03 PPM 4395 Si Chip % of Chip 100 Weight (g) 1.74 E-02 PPM 46094 Weight (g) 2.80 E-03 7.99 E-04 4.00 E-04 4.00 E-03 PPM 7392 2112 1057 10560 Item Ag Filler Resin Anhydride Subtotal Die Attach % of Die Attach 70 20 10 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3050B. ICP-AES. EN 1122:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. Analysis was performed by GC/MS. Analysis was performed by GC/MS. Package Totals PPM Weight (g) 1000000 3.78 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Item Cu Cr Sn Zn TQFP - EP 12 X 12 80 SnPb Molding Compound % of Compound 88 11.5 0.5 Leadframe % of Leadframe 99.25 0.3 0.25 0.2 Weight (g) 2.08 E-01 2.71 E-02 1.18 E-03 2.36 E-01 PPM 546110 71367 3103 620580 Weight (g) 1.07 E-01 3.23 E-04 2.69 E-04 2.15 E-04 1.08 E-01 PPM 280823 849 707 565 282945 Internal Leadframe Plating Weight (g) % of Plating 9.60 E-04 100 Ag Item Sn Pb External Leadframe Plating % of Plating Weight (g) 85 6.78 E-03 15 1.20 E-03 7.98 E-03 PPM Weight (g) 1.66 E-03 PPM Si Chip % of Chip 100 Weight (g) 2.16 E-02 PPM 56723 Weight (g) 3.16 E-03 9.04 E-04 4.52 E-04 4.52 E-03 PPM Die Attach % of Die Attach 70 20 10 Molding Compound Method USEPA 3050B. ICP-AES. EN 1122:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. Analysis was performed by GC/MS. Analysis was performed by GC/MS. PPM 17825 3145 20970 Bond Wires % of Wire 99.99 Item PPM None Detected None Detected None Detected None Detected None Detected None Detected 2524 Au Ag Filler Resin Anhydride Item Pb Cd Hg Cr+6 PBB PBDE 4373 8320 2377 1189 11885 Package Totals PPM Weight (g) 1000000 3.80 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary