Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Subtotal Item Cu FE Zn P Subtotal Ag Item Sn TQFP - EP 14 X 14 X 1.0 80 Pb-free Molding Compound % of Compound 88 11.5 0.5 Weight (g) 2.80 E-01 3.65 E-02 1.59 E-03 3.18 E-01 PPM 514410 67224 2923 584558 Weight (g) 1.77 E-01 4.37 E-03 2.18 E-04 5.50 E-05 1.82 E-01 PPM 326086 8031 401 101 334619 Internal Leadframe Plating % of Plating Weight (g) 8.00 E-04 100 PPM 1472 External Leadframe Plating Weight (g) % of Plating 100 1.39 E-02 PPM 25570 Leadframe % of Leadframe 97.45 2.4 0.12 0.03 Au Bond Wires % of Wire 99.99 Weight (g) 2.80 E-03 PPM 5151 Si Chip % of Chip 100 Weight (g) 2.21 E-02 PPM 40625 Weight (g) 3.05 E-03 8.70 E-04 4.35 E-04 4.35 E-03 PPM 5604 1601 800 8005 Item Ag Filler Resin Anhydride Subtotal Die Attach % of Die Attach 70 20 10 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES or USEPA 7473. Hg Analyzer. USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. Analysis was performed by GC/MS. Analysis was performed by GC/MS. Package Totals PPM Weight (g) 1000000 5.44 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary