PDF

v00.0902
QS24 (E) – 24 LEAD
PLASTIC QSOP PACKAGE
PACKAGE OUTLINES
QS24 (E) Package Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Suffix
Package Body Material
Lead Finish
MSL Rating
QS24
RoHS Compliant Mold Compound
Sn/Pb Solder
MSL1
QS24E
RoHS Compliant Mold Compound
100% matte Sn
MSL1
Package Marking [3][4]
[1]
HMCNNN
XXXX
[2]
HMCNNN
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
[4] 3-Digit part number NNN
B - 32
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
v00.0902
QS24 (E) – 24 LEAD
PLASTIC QSOP PACKAGE
PACKAGE OUTLINES
Suggested QS24 (E) PCB Land Pattern
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
B - 18
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com