v00.0506 LP2 (E) – 2 x 2 mm DUAL FLATPACK NO-LEAD (DFN) PLASTIC PACKAGE PACKAGE OUTLINES LP2 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. PAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Suffix Package Body Material Lead Finish MSL Rating LP2 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 LP2E RoHS Compliant Mold Compound 100% matte Sn MSL1 Package Marking [3][4] [1] NNN XXX [2] NNN XXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN B-4 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v00.0506 LP2 (E) – 2 x 2 mm DUAL FLATPACK NO-LEAD (DFN) PLASTIC PACKAGE PACKAGE OUTLINES Suggested LP2 (E) PCB Land Pattern NOTES: 1. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE. 3. SOLDERMASK ON FAR SIDE SHOULD TENT OR PLUG VIA HOLES. B-4 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com