Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP 4X4 16 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary 1333-86-4 1.27E-02 4.06E-04 4.06E-04 4.06E-05 1.35 E-02 Percentage (%) PPM Percentage (%) 93.7 3.0 3.0 0.3 100.00 937000 30000 30000 3000 1000000 34.37 1.10 1.10 0.11 36.68 PPM 343666 11003 11003 1100 366773 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 1.88 E-02 4.54 E-04 2.32 E-05 5.79 E-06 1.93 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 51.00 1.23 0.06 0.02 52.31 PPM 510044 12293 628 157 523122 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# Weight (g) 3.97 E-04 7440-22-4 Percentage (%) PPM Percentage (%) 100.0 1000000 1.08 PPM 10766 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) 5.69 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.54 PPM 15415 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 3.25 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.88 PPM 8808 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 2.17 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 5.87 PPM 58723 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin t-butyl phenyl glycidyl ether Phenolic hardener Butyl cellosolve acetate CAS# 7440-22-4 9003-36-5 / 30583-72-3 3101-60-8 92-88-6 112-07-2 Component Level Weight (g) 4.23 E-04 1.21 E-04 4.54 E-05 9.07 E-06 6.05 E-06 6.05 E-04 Weight (g) 3.69 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 70 20 7.5 1.5 1 100.0 700000 200000 75000 15000 10000 1000000 1.15 0.33 0.12 0.02 0.02 1.64 Percentage (%) 100 PPM 11475 3279 1230 246 164 16393 PPM 1000000