Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 4 X 4 x 0.85 mm 20 Pb Free Molding Compound % of Compound 84.0 16.0 Weight (g) 1.33 E-02 2.53 E-03 1.58 E-02 PPM 323499 61613 385112 Weight (g) 2.18 E-02 5.24 E-04 2.70 E-05 7.00 E-06 2.23 E-02 PPM 529492 12756 657 170 543076 Internal Leadframe Plating Weight (g) % of Plating 4.36 E-04 100 PPM 10614 External Leadframe Plating % of Plating Weight (g) 100 2.30 E-04 PPM 5599 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Au Bond Wires % of Wire 99.99 Weight (g) 4.17 E-04 PPM 10151 Si Chip % of Chip 100 Weight (g) 1.38 E-03 PPM 33594 Weight (g) 3.40 E-04 1.02 E-04 1.50 E-05 1.50 E-05 1.50 E-05 4.87 E-04 PPM 8277 2483 365 365 365 11855 Item Ag Filler Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA3060A & 7196 A. UV-VIS None Detected EPA Method 3540C/3550C. GC/MS None Detected EPA Method 3540C/3550C. GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES 3 EPA3060A & 7196 A. UV-VIS None Detected EPA Method 3540C/3550C. GC/MS None Detected EPA Method 3540C/3550C. GC/MS Package Totals PPM Weight (g) 1000000 4.11 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn Pb LFCSP 4 X 4 x 0.85 mm 20 Sn/Pb Molding Compound % of Compound Weight (g) 84.0 1.33 E-02 16.0 2.53 E-03 1.58 E-02 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 PPM 323349 61585 384934 Weight (g) 2.18 E-02 5.24 E-04 2.70 E-05 7.00 E-06 2.23 E-02 PPM 529247 12750 657 170 542824 Internal Leadframe Plating Weight (g) % of Plating 4.36 E-04 100 PPM 10609 External Leadframe Plating % of Plating Weight (g) 85.0 2.12 E-04 15.0 3.70 E-05 2.49 E-04 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES 3 EPA3060A & 7196 A. UV-VIS None Detected EPA Method 3540C/3550C. GC/MS None Detected EPA Method 3540C/3550C. GC/MS 5158 900 6059 Bond Wires % of Wire 99.99 Weight (g) 4.17 E-04 PPM 10146 Si Chip % of Chip 100 Weight (g) 1.38 E-03 PPM 33578 Weight (g) 3.40 E-04 1.02 E-04 1.50 E-05 1.50 E-05 1.50 E-05 4.87 E-04 PPM Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Molding Compound Method PPM None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA3060A & 7196 A. UV-VIS None Detected EPA Method 3540C/3550C. GC/MS None Detected EPA Method 3540C/3550C. GC/MS PPM Au Item Ag Filler Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 8273 2482 365 365 365 11850 Package Totals PPM Weight (g) 1000000 4.11 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary