Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 4 X 4 X 0.75 (2.5 EP) 24 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 3.35E-02 4.92E-03 1.19E-04 3.85E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 45.31 6.66 0.16 52.14 PPM 453115 66630 1616 521361 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Weight (g) 2.84 E-02 6.84 E-04 3.49 E-05 8.73 E-06 2.91 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.39 0.93 0.05 0.01 39.38 PPM 383928 9254 473 118 393772 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 1.18 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.60 PPM 15981 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 1.96 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.65 PPM 26461 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 1.34 E-04 1.36 E-06 1.36 E-04 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.18 0.00 0.18 PPM 1816 18 1834 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon 7440-21-3 2.30 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.12 PPM 31177 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Weight (g) 5.42 E-04 2.17 E-05 2.17 E-05 2.17 E-05 2.17 E-05 2.17 E-05 2.17 E-05 2.17 E-05 3.62 E-06 6.97 E-04 Weight (g) 7.39 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.73 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.005 0.94 Percentage (%) 100 PPM 7329 293 293 293 293 293 293 293 49 9432 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 4 X 4 X 0.75 (2.5 EP) 24 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 3.48E-02 2.27E-03 1.44E-03 2.27E-03 1.03E-03 4.18E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.00 832500 54200 34500 54200 24600 1000000 47.09 3.07 1.95 3.07 1.39 56.57 PPM 470913 30659 19515 30659 13915 565661 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.89 0.94 0.05 0.01 39.89 2.87 E-02 6.93 E-04 3.54 E-05 8.84 E-06 2.95 E-02 PPM 388942 9375 479 120 398915 Internal / External Leadframe Plating Component Level Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 97.3 2.2 0.5 100.00 973000 22000 5000 1000000 0.96 0.02 0.00 0.99 7.11 E-04 1.61 E-05 3.66 E-06 7.31 E-04 PPM 9626 218 49 9893 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.21 1.57 E-04 PPM 2128 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.76 1.30 E-03 PPM 17552 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Thermoset Other organic materials Others Others Subtotal Package Totals Substance Silver Acrylic resin Acrylate Polybutadiene derivative Epoxy resin Butadiene Copolymer Additive Peroxide CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 77.00 7.00 5.50 4.50 2.50 1.50 1.50 0.50 100.0 770000 70000 55000 45000 25000 15000 15000 5000 1000000 0.45 0.04 0.03 0.03 0.01 0.009 0.009 0.003 0.59 3.33 E-04 3.03 E-05 2.38 E-05 1.95 E-05 1.08 E-05 6.49 E-06 6.49 E-06 2.16 E-06 4.32 E-04 Weight (g) 7.39 E-02 Percentage (%) 100.00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 4505 410 322 263 146 88 88 29 5851 PPM 1000000