Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched, Stacked Die 10 X 10 X 0.85 (5.3 EP) 72 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Component Level Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Weight (g) 1.16E-01 1.71E-02 4.15E-04 1.34E-01 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 35.26 5.19 0.13 40.57 PPM 352608 51851 1258 405716 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 1.76 E-01 4.25 E-03 2.17 E-04 5.42 E-05 1.81 E-01 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 53.35 1.29 0.07 0.02 54.72 PPM 533530 12859 657 164 547210 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 1.81 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.05 PPM 547 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 3.07 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.93 PPM 9291 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.43 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.43 PPM 4335 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 9.36 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.83 PPM 28350 Die Attach 1 Component Level Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Weight (g) 7.68 E-05 7.68 E-06 7.68 E-06 3.07 E-06 3.07 E-06 3.07 E-06 3.07 E-06 1.05 E-04 Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 0.02 0.002 0.002 0.001 0.001 0.001 0.001 0.03 PPM 233 23 23 9 9 9 9 317 Die Attach 2 Homogeneous Material Level Description Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Resin Ethene, tetrafluoro-,homopolymer [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane CAS# Proprietary 9002-84-0 2530-83-8 Component Level Weight (g) 6.99 E-04 6.29 E-04 6.99 E-05 1.40 E-03 Weight (g) 3.30 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 50.0 45.0 5.0 100.0 500000 450000 50000 1000000 0.21 0.19 0.02 0.42 Percentage (%) 100 PPM 2117 1905 212 4234 PPM 1000000