pdf

11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP]
(CB-11-1)
Dimensions shown in millimeters
a
0.657
0.602
0.546
1.61
1.57
1.53
0.020
REF
SEATING
PLANE
0.348
0.328
0.308
3
2
1
A
BALL A1
IDENTIFIER
2.08
2.04
2.00
0.330
0.310
0.290
1.50
REF
B
0.50
REF
C
D
0.355
0.330
0.304
0.04 MAX
COPLANARITY
0.280
0.250
0.220
BOTTOM VIEW
(BALL SIDE UP)
1.00
REF
060409-A
TOP VIEW
(BALL SIDE DOWN)
0.230
0.212
0.192