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16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-3)
Dimensions shown in millimeters
2.000
1.960 SQ
1.920
4
3
2
1
A
BALL A1
IDENTIFIER
B
1.50
REF
C
TOP VIEW
0.50
BSC
(BALL SIDE DOWN)
SEATING
PLANE
BOTTOM VIEW
(BALL SIDE UP)
SIDE VIEW
COPLANARITY
0.05
0.340
0.320
0.300
0.270
0.240
0.210
10-17-2012-B
0.640
0.595
0.540
D