Materials Declaration Package Body Size Lead Count Option Item Ceramics Al2O3 MnO2 TiO2 Cr2O3 Fe2O3 SiO2 Co3O4 MgO CaO Sealing Glass PbO SnO2 SiO2 B2O3 Al2O3 TiO2 MgO ZnO CaO Cr2O3 Fe2O3 MnO2 Na2O Subtotal Item Ceramics Al2O3 MnO2 SiO2 TiO2 Cr2O3 Fe2O3 MgO Co3O4 CaO Sealing glass PbO SnO2 SiO2 B2O3 Al2O3 MgO CaO ZnO Cr2O3 Fe2O3 MnO2 Subtotal Item Fe Nickel Mn Si Co Al Cr S C P Subtotal Item Silver Lead Borate glass Subtotal CerDIP 300 mils 16 SnPb Base % of Base Weight (g) 68.99 2.62 1.40 1.13 0.92 0.23 0.20 0.04 0.03 7.90 E-01 3.00 E-02 1.60 E-02 1.29 E-02 1.05 E-02 2.60 E-03 2.30 E-03 4.70 E-04 3.50 E-04 359592 13661 7286 5874 4781 1184 1047 214 159 14.817 3.844 1.738 1.431 0.961 0.818 0.511 0.201 0.051 0.031 0.031 0.010 0.002 1.70 E-01 4.40 E-02 1.99 E-02 1.64 E-02 1.10 E-02 9.36 E-03 5.85 E-03 2.30 E-03 5.85 E-04 3.50 E-04 3.50 E-04 1.17 E-04 2.34 E-05 1.14 E+00 77228 20036 9057 7459 5009 4262 2664 1047 266 159 159 53 11 521208 Caps % of Caps Weight (g) PPM PPM 62.64 2.40 2.00 1.30 1.00 0.81 0.40 0.19 0.03 4.82 E-01 1.85 E-02 1.54 E-02 1.00 E-02 7.70 E-03 6.20 E-03 3.10 E-03 1.50 E-03 2.30 E-04 219480 8415 7012 4554 3506 2823 1412 683 105 17.91 4.55 2.20 1.69 1.20 0.70 0.70 0.19 0.04 0.04 0.01 1.38 E-01 3.50 E-02 1.69 E-02 1.30 E-02 9.20 E-03 5.39 E-03 5.39 E-03 1.50 E-03 3.10 E-04 3.10 E-04 7.70 E-05 7.69 E-01 62748 15937 7695 5920 4189 2454 2454 683 141 141 35 350388 Leadframe % of Leadframe Weight (g) 58.610 1.11 E-01 40.658 7.70 E-02 0.523 9.90 E-04 0.132 2.50 E-04 0.030 5.70 E-05 0.026 5.00 E-05 0.010 1.90 E-05 0.006 1.14 E-05 0.003 5.70 E-06 0.002 3.80 E-06 1.89 E-01 PPM 50544 35062 451 114 26 23 9 5 3 2 86238 Paste % of Paste 80.0 20.0 Weight (g) 9.10 E-03 6.00 E-04 9.70 E-03 PPM 4144 273 4417 Si Chip % of Wire 100.0 Weight (g) 1.00 E-02 PPM 4554 Item Aluminum Bonding Wires % of Wire Weight (g) 3.00 E-03 100.0 PPM 1366 Item Item Tin Lead Subtotal Solder % of Solder 63.0 37.0 Weight (g) 4.40 E-02 2.59 E-02 6.99 E-02 PPM 20036 11794 31829 Package Totals Weight (g) PPM 2.20 E+00 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information.