Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor The MLN SurgeArray™ Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. SurgeArray™ devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArray devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. The inherent capacitance of the SurgeArray Suppressor permits it to function as a filter/suppressor, thereby replacing separate zener/ capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. The MLN can also be provided in a Dual version. Contact Littelfuse for information. Features Size • RoHS Compliant • Four Individual Devices in One Chip • ESD Rated to IEC 61000-4-2 (Level 4) • AC Characterized for Impedance and Capacitance • Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ) • Low Leakage • Operating Voltage up to 18VM(DC) • -55oC to 125oC Operating Temperature Range • Low-Profile, PCMCIA Compatible Applications • Data, Diagnostic I/O Ports • Analog Signal/Sensor Lines • Portable/Hand-Held Products • Mobile Communications/Cellular Phones • Computer/DSP Products • Industrial Instruments Including Medical 180 w w w. l i t t e l f u s e . c o m Metric EIA 2012 3216 0805 1206 Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor RoHS Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. Continuous: Steady State Applied Voltage: DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 Storage Temperature Range (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 V C O C O Device Ratings and Specifications Any Single Section PART NUMBER MAXIMUM NONREPETITIVE MAXIMUM SURGE CONTINUOUS CURRENT WORKING (8/20µs) VOLTAGE MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) MAXIMUM CLAMPING VOLTAGE (AT NOTED 8/20µs) CURRENT TYPICAL ESD SUPPRESSION VOLTAGE (NOTE 1) WTM VC (NOTE 2) (NOTE 3) 8kV CONTACT 15kV AIR ITM VM(DC) PERFORMANCE SPECIFICATIONS (25 oC) Peak Clamp NEW VN(DC) MIN VN(DC) MAX CAPACITANCE AT 1MHz (1V p-p) 3 (NOTE 4) C TYP MAX (V) (A) (J) (V) (V) (V) (V) (V) (V) (pF) (pF) V5.5MLN40805 5.5 20 0.05 19 at 1A 140 40 90 7.1 10.8 220 300 V5.5MLN41206 5.5 30 0.1 15.5 at 2A 60 35 45 7.1 10.8 430 520 9 30 0.1 23 at 2A 95 50 75 11.0 16.0 250 300 30 at 2A 110 55 85 15.9 20.3 140 175 V9MLN41206 NEW Peak NOMINAL VOLTAGE AT 1mA DC CURRENT SURFACE MOUNT VARISTORS MAX RATINGS (125 oC) V14MLN41206 14 30 0.1 V18MLN40805 18 20 0.05 50 at 1A 260 100 170 22.0 28.0 75 100 V18MLN41206 18 30 0.1 40 at 2A 165 63 100 22.0 28.0 100 125 V18MLN41206L 18 30 0.05 50 at 1A 200 95 130 25.0 35.0 45 75 NOTES: Temperature Derating For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1. PERCENT OF RATED VALUE 100 90 80 70 PERCENT OF PEAKVALUE 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. 2. Direct discharge to device terminals (IEC preffered test method). 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. 100 90 50 10 O1 60 50 t t1 TIME t2 40 30 20 10 0 -55 50 60 70 80 90 100 110 120 130 140 150 O1 = VIRTUAL ORIGIN OFWAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUALTIME TO HALFVALUE (IMPULSE DURATION) AMBIENT TEMPERATURE ( oC) EXAMPLE: FOR AN 8/20µs CURRENT WAVEFORM: 8µs = t1 = VIRTUAL FRONT TIME 20µs = t2 = VIRTUAL TIME TO HALF VALUE FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE F w w w. l i t t e l f u s e . c o m 181 Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor RoHS Typical Performance Curves Any Single Section 100 25 V18 V18 MAXIMUM CLAMP VOLTAGE MAXIMUM STANDBY V5.5 V14 15 Varistor Voltage (V) NOMINAL VOLTAGE VNOM (V) 20 V9 10 V5.5 10 5 0 0 10 100 1000 10000 1 0.00001 0.0001 NUMBER OF DISCHARGES 0.001 0.01 0.1 1 10 100 Current (A) FIGURE 3. NOMINAL VOLTAGE STABILITYTO IEC 1000-4-2 (8kV CONTACT METHOD, ONE SECTION) FIGURE 4. V-I CHARACTERISTIC, 0805 SIZE 100 100 V18L MAXIMUM CLAMP VOLTAGE V18 NUMBER OF SURGES MAXIMUM STANDBY V14 1 V9 Varistor Voltage (V) 100 2 SSurge Current (A) V5.5 V18L V18 V14 10 V9 10 103 10 1 V5.5 ∞ 104 105 106 1 0.00001 0.1 10 0.0001 0.001 0.01 0.1 1 10 100 100 1000 10000 Square Wave Impulse Duration (µs) Current (A) FIGURE 6. 0805 SIZE PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) FIGURE 5. V-I CHARACTERISTIC, 1206 SIZE 100 500 NUMBER OF SURGES V5.5 1 400 100 10 103 Capacitance (pF) Surge Current (A) 2 10 1 300 V9 200 V14 ∞ V18 104 105 100 106 V18L 0.1 10 100 1000 10000 0 0.1 FIGURE 7. 1206 SIZE PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) 182 1 10 100 Frequency (MHz) Square Wave Impulse Duration (µs) w w w. l i t t e l f u s e . c o m FIGURE 8. CAPACITANCE vs FREQUENCY 1000 Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor Typical Performance Curves Any Single Section (Continued) 10000 400E-12 350E-12 1000 5.5V 250E-12 200E-12 150E-12 100E-12 18V 100 5.5V 10 18V 3 1 50E-12 000E+0 1.0E+06 1.0E+07 1.0E+08 0.1 1.0E+06 1.0E+09 1.0E+07 1.0E+08 1.0E+09 1.0E+10 Frequency (Hz) Frequency (Hz) FIGURE 9. CAPACITANCE VS. FREQUENCY, 0805 SIZE FIGURE 10. IMPEDENCE VS FREQUENCY, 0805 SIZE SURFACE MOUNT VARISTORS Parallel Capacitance, Cp (F) Parallel Capacitance, Cp (F) 300E-12 1000 OHMS 100 10 1 0.1 1MHz 10MHz 100MHz 1GHz 10GHz Frequency FIGURE 11. CAPACITANCE VS FREQUENCY, 1206 SIZE 10000 0 -20 Crosstalk (dB) Impeance |Z| (Ω) 1000 100 V5.5 V9 10 V14 -40 -60 V18L V14 V9 -80 V18 V5.5 V18L VIN = 1VRMS Z = 50Ω 1 -100 0.1 0.1 1 10 V18 100 1000 -120 0.001 Frequency (MHz) 0.01 0.1 1 10 100 1000 Frequency (MHz) FIGURE 12. IMPEDANCE vs FREQUENCY, 1206 SIZE FIGURE 13. ADJACENT CHANNEL CROSSTALK w w w. l i t t e l f u s e . c o m 183 Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor Soldering Recommendations 230 230 Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-flow & Wave soldering. Typical profiles are shown in Figures 14 & 15 The recommended solder for the MLN SurgeArray suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. FIGURE 14. REFLOW SOLDER PROFILE FIGURE 14. REFLOW SOLDER PROFILE When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solderís peak temperature is essential to minimize thermal shock. 300 MAXIMUM WAVE 260 oC 250 MAXIMUM WAVE 260 oC 250 TEMPERATURE TEMPERATURE ( oC)( oC) Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50˚C before cleaning. 300 200 200 150 SECOND PREHEAT 150 SECOND PREHEAT 100 100 FIRST PREHEAT 50 FIRST PREHEAT 50 Lead-Free (Pb-free) Soldering Recommendations 0 00.0 0.5 1.0 1.5 3.0 3.5 4.0 4.5 0.0 0.5 1.0 1.5 TIME 2.0(MINUTES) 2.5 3.0 TIME (MINUTES) 3.5 4.0 4.5 Littelfuse offers the 0805 array as the preferred solution for lead-free soldering conditions. 2.0 2.5 FIGURE 15. WAVE SOLDER PROFILE FIGURE 15. WAVE SOLDER PROFILE The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes & fluxes available with which the nickel barrier parts should be compatible. MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C RAMP RATE <3˚C/s 60 - 150 SEC RAMP RATE 217˚C <3˚C/s 60 > - 150 SEC > 217˚C The reflow profile must be constrained by maximums shown in Figure16. For Pb-free Wave soldering, Figure 15 still applies. Note: the Pb-free paste, flux & profile were used for evaluation purposes by Littelfuse, based upon industry standards & practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. PREHEAT ZONE PREHEAT ZONE 5.0 5.0 6.0 6.0 7.0 7.0 FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE 184 w w w. l i t t e l f u s e . c o m Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor RoHS Mechanical Dimensions W T X P L BW S L W T 0.080 ±0.008 0.050 ±0.008 0.038 Max 2.03 ±0.2 1.27 ±0.2 1.10 Max 0.126 ±0.008 0.063 ±0.008 0.053 Max 3.2 ±0.2 1.6 ±0.2 1.35 Max Units Size Inch BW BL 0.012 ±0.004 0.007 +0.01/- 0.002 P X 0.020 Ref 0.030 ±0.004 S 0.508 Ref 0.76 ±0.1 0.030 Ref 0.045 ±0.004 0.015 ±0.004 0.76 Ref 1.14 ±0.1 0.38 ±0.1 0.010 ±0.004 0805 Millimeter Inch 0.30 ±0.1 0.18 +0.25/-0.05 0.016 ±0.004 0.007 +0.01/- 0.002 0.254 ±0.1 1206 Millimeter 0.41 ±0.1 0.18 +0.25/-0.05 Recommended Pad Outline E D A B C TABLE 1. PAD LAYOUT DIMENSIONS Size 0805 1206 Units A B C D E Millimeters 0.90 1.30 2.20 0.35 0.50 Inches 0.035 0.051 0.087 0.014 0.02 Millimeters 0.89 1.65 2.54 0.46 0.79 Inches 0.035 0.065 0.100 0.018 0.030 w w w. l i t t e l f u s e . c o m 185 SURFACE MOUNT VARISTORS 3 BL Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor Ordering Information VXXMLN TYPES V 18 ML 4 N W 1206 T DEVICE FAMILY TVSS Device PACKING OPTIONS A: 2500 Piece Bulk Pack H: 7in (178mm) Diameter Reel (Note) T: 13in (330mm) Diameter Reel (Note) MAXIMUM DC WORKING VOLTAGE NOTE: See Standard Shipping Quantities table. MULTILAYER DESIGNATOR SERIES DESIGNATOR N: Array END TERMINATION OPTION W: Ag/Pd/Pt (1206 only) DEVICE SIZE: 0805: 80mil x 50mil 1206: 120mil x 60mil N: Nickel barrier (0805 only) NUMBER OF SECTIONS Tape and Reel Specifications • Conforms to EIA - 481, Revision A • Can be Supplied to IEC Publication 286 - 3 SYMBOL DESCRIPTION MILLIMETERS A0 Width of Cavity Dependent on Chip Size to Minimize Rotation. B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation. W Width of Tape F Distance Between Drive Hole Centers and Cavity Centers 3.5 ±0.5 1.75 ±0.1 8 ±0.2 E Distance Between Drive Hole Centers and Tape Edge P1 Distance Between Cavity Center 4 ±0.1 P2 Axial Distance Between Drive Hole Centers and Cavity Centers 2 ±0.1 4 ±0.1 P0 Axial Distance Between Drive Hole Centers D0 Drive Hole Diameter 1.55 ±0.05 D1 Diameter of Cavity Piercing 1.05 ±0.05 t1 Embossed Tape Thickness 0.3 Max t2 Top Tape Thickness 0.1 Max NOTE: Dimensions in millimeters. t1 D0 P0 PRODUCT IDENTIFYING LABEL P2 PLASTIC CARRIER TAPE E F K0 W B0 t2 D1 P1 EMBOSSMENT TOP TAPE A0 8mm NOMINAL 178mm OR 330mm DIA. REEL Standard Shipping Quantities 186 DEVICE SIZE “13” INCH REEL (“T” OPTION) “7” INCH REEL (“H”OPTION) BULK PACK (“A” OPTION) 0805 and 1206 10,000 2,500 2,500 w w w. l i t t e l f u s e . c o m