Reliability Data Report Product Family R384 LTC981 / LTC986 / LTC1625 / LTC1627 / LTC1628 / LTC1629 / LTC1702 / LTC1703 / LTC1704 / LTC1705 / LTC1707 / LTC1708 / LTC1709 / LTC1729 / LTC1731 / LTC1732 / LTC1735 / LTC1736 / LTC1755 / LTC1756 / LTC1773 / LTC1778 / LTC1871 / LTC1873 / LTC1876 / LTC1909 / LTC1929 / LTC1960 / LTC3704 / LTC3707 / LTC3709 / LTC3711 / LTC3713 / LTC3714 / LTC3716 / LTC3717 / LTC3718 / LTC3719 / LTC3720 / LTC3727 / LTC3728 / LTC3729 / LTC3730 / LTC3731 / LTC3732 / LTC3733 / LTC3734 / LTC3735 / LTC3738 / LTC3770 / LTC3773 / LTC3778 / LTC3780 / LTC3783 / LTC3802 / LTC3819 / LTC3823 / LTC3826 / LTC3827 / LTC3828 / LTC3834 / LTC3835 / LTC4255 / LTC4258 / LTC4259 / LTC4412 / LTC4414 / LTC4416 Reliability Data Report Report Number: R384 Report generated on: Thu Oct 22 10:51:48 PDT 2015 OPERATING LIFE TEST PACKAGE TYPE SSOP/TSSOP SOIC/MSOP PLASTIC DIP QFN/DFN SOT Totals SAMPLE SIZE 12462 4006 51 1742 77 18,338 OLDEST DATE NEWEST DATE K DEVICE HRS 1 CODE CODE (+125°C) 9901 9827 9914 0111 1412 - 1449 1433 9914 1446 1412 - 8023 3072 51 800 0 11,946 No. of FAILURES 2,3 1 0 0 0 0 1 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals SAMPLE SIZE 1068 611 233 1,912 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) 0525 9827 0111 - 1401 1412 0748 - 3033 1580 451 5,064 0 0 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP Totals 41389 196678 27983 266,050 OLDEST DATE NEWEST DATE CODE CODE 0031 9827 9813 - 1422 1422 1421 - 4042 10081 1281 15,404 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0031 9827 9843 - 1422 1422 1420 - 12808 27457 4938 45,203 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0915 - 0915 - 5 5 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP Totals 45025 145326 37947 228,298 TEMP CYCLE FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP Totals 50 50 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =2.18 FITS (3) Mean Time Between Failure in Years = 52406.87 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning 0 0 Reliability Data Report Report Number: R384 Report generated on: Thu Oct 22 10:51:48 PDT 2015 TEMP CYCLE FROM -40 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN Totals 50 50 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0914 - 0914 - 5 5 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0031 9827 9843 - 1421 1422 1420 - 11569 23455 3204 38,228 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0634 0826 - 1407 1420 - 2014 222 2,236 0 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0719 0813 0830 - 0917 1414 1349 - 344 3723 149 4,216 0 0 0 0 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP Totals 38487 133559 23097 195,143 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP Totals 2429 222 2,651 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP Totals 394 4168 198 4,760