Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52277 Rev. 8, 09/2009 MCF52277 LQFP–176 24 mm x 24 mm MCF5227x ColdFire® Microprocessor Data Sheet Features • Version 2 ColdFire® Core with EMAC • Up to 159 Dhrystone 2.1 MIPS @ 166.67 MHz • 8 Kbytes configurable cache (instruction only, data only, or split instruction/data) • 128 Kbytes internal SRAM • Support for booting from SPI-compatible flash, EEPROM, and FRAM devices • Crossbar switch technology (XBS) for concurrent access to peripherals or RAM from multiple bus masters • 16 channel DMA controller • 16- or 32-bit SDR/DDR controller • USB 2.0 On-the-Go controller • Liquid crystal display controller with support up to 800 × 600 pixels • ADC and touchscreen controller • FlexCAN module • 4 32-bit timers with DMA support • DMA supported serial peripheral interface (DSPI) • 3 UARTs • I2C bus interface • Synchronous serial interface (SSI) • Plus-width modulator (PWM) • Real-time clock (RTC) • Two programmable interrupt controllers (PIT) Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2009. All rights reserved. MAPBGA–196 15mm x 15mm Table of Contents 1 2 3 4 5 MCF5227x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . .4 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5 3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3.3 ADC Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3.4 Supply Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . .6 3.4.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .6 3.4.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .6 3.5 Power Consumption Specifications. . . . . . . . . . . . . . . . .7 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .9 4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4.2 Pinout—176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.3 Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .15 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .17 5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .18 5.5 5.6 5.7 6 7 8 Oscillator and PLL Electrical Characteristics. . . . . . . . ASP Electrical Characteristics . . . . . . . . . . . . . . . . . . . External Interface Timing Specifications . . . . . . . . . . . 5.7.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.2 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 5.9 Reset and Configuration Override Timing . . . . . . . . . . 5.10 LCD Controller Timing Specifications . . . . . . . . . . . . . 5.11 USB On-The-Go Specifications. . . . . . . . . . . . . . . . . . 5.12 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 5.13 I2C Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 5.14 DMA Timer Timing Specifications . . . . . . . . . . . . . . . . 5.15 DSPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 5.16 SBF Timing Specifications. . . . . . . . . . . . . . . . . . . . . . 5.17 JTAG and Boundary Scan Timing Specifications . . . . 5.18 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 20 21 21 23 29 29 30 33 34 36 38 38 39 40 42 43 43 44 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 2 Freescale Semiconductor MCF52277 JTAG Oscillator Version 2 ColdFire Core 8K Configurable Cache PLL Serial Boot Facility BDM Hardware Divide 128K SRAM EMAC USB OTG LCD Controller eDMA Crossbar Switch (XBS) Peripheral Bridge FlexBus Touch Screen DSPI RTC SSI FlexCAN GPIO EPORT I2C INTC 2 PITs 3 UARTs 4 DMA Timers SDRAM Controller PWM LEGEND BDM DSPI eDMA EMAC EPORT GPIO I2 C INTC JTAG – Background debug module – DMA serial peripheral interface – Enhanced direct memory access – Enchanced multiply-accumulate unit – Edge port module – General purpose input/output module – Inter-intergrated circuit – Interrupt controller – Joint Test Action Group interface LCD PIT PLL PWM RTC SSI UART USB OTG – Liquid-crystal display – Programmable interrupt timer – Phase-locked loop module – Pulse-width modulator – Real time clock – Synchronous serial interface – Universal asynchronous receiver/transmitter – Universal Serial Bus On-the-Go controller Figure 1. MCF52277 Block Diagram MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 3 MCF5227x Family Comparison 1 MCF5227x Family Comparison The following table compares the various device derivatives available within the MCF5227x family. Table 1. MCF5227x Family Configurations Module MCF52274 MCF52277 • • Core (System) Clock up to 120 MHz up to 166.67 MHz Peripheral and External Bus Clock (Core clock ÷ 2) up to 60 MHz up to 83.33 MHz Performance (Dhrystone/2.1 MIPS) up to 114 up to 159 ColdFire Version 2 Core with EMAC (Enhanced Multiply-Accumulate Unit) Static RAM (SRAM) 128 Kbytes Configurable Cache 8 Kbytes ASP Touchscreen Controller • • 12-bit color 18-bit color USB 2.0 On-the-Go • • FlexBus External Interface • • SDR/DDR SDRAM Controller • • FlexCAN 2.0B communication module • • Real Time Clock • • Watchdog Timer • • 16-channel Direct Memory Access (DMA) • • Interrupt Controllers (INTC) 1 1 Synchronous Serial Interface (SSI) • • • • DSPI • • UARTs 3 3 32-bit DMA Timers 4 4 Periodic Interrupt Timers (PIT) 2 2 PWM Module • • Edge Port Module (EPORT) • • General Purpose I/O Module (GPIO) • • • • 176 LQFP 196 MAPBGA LCD Controller I 2C ® JTAG - IEEE 1149.1 Test Access Port Package MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 4 Freescale Semiconductor Ordering Information 2 Ordering Information Table 2. Orderable Part Numbers Freescale Part Number Description Package Speed Temperature MCF52274CLU120 MCF52274 RISC Microprocessor 176 LQFP 120 MHz –40° to +85° C MCF52277CVM160 MCF52277 RISC Microprocessor 196 MAPBGA 166.67 MHz –40° to +85° C 3 Hardware Design Considerations 3.1 PLL Power Filtering To further enhance noise isolation, an external filter is strongly recommended for PLL analog VDD pins. The filter shown in Figure 2 should be connected between the board VDD and the PLLVDD pins. The resistor and capacitors should be placed as close to the dedicated PLLVDD pin as possible. 10 Ω Board IVDD PLL VDD Pin 10 µF 0.1 µF GND Figure 2. System PLL VDD Power Filter 3.2 USB Power Filtering To minimize noise, external filters are required for each of the USB power pins. The filter shown in Figure 3 should be connected between the board EVDD and the USBVDD pin. The resistor and capacitors should be placed as close to the dedicated USBVDD pin as possible. 0Ω Board EVDD USB VDD Pin 10 µF 0.1 µF GND Figure 3. USB VDD Power Filter NOTE In addition to the above filter circuitry, a 0.01 F capacitor is also recommended in parallel with those shown. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 5 Hardware Design Considerations 3.3 ADC Power Filtering To minimize noise, an external filters is required for the ADCVDD power pin. The filter shown in Figure 4 should be connected between the board EVDD and the ADCVDD pin. The resistor and capacitors should be placed as close to the dedicated ADCVDD pin as possible. 0Ω Board EVDD ADC VDD Pin 10 µF 0.1 µF GND Figure 4. ADC VDD Power Filter 3.4 Supply Voltage Sequencing The relationship between SDVDD and EVDD is non-critical during power-up and power-down sequences. Both SDVDD (2.5V or 3.3V) and EVDD are specified relative to IVDD. 3.4.1 Power Up Sequence If EVDD/SDVDD are powered up with IVDD at 0 V, then the sense circuits in the I/O pads will cause all pad output drivers connected to the EVDD/SDVDD to be in a high impedance state. There is no limit on how long after EVDD/SDVDD powers up before IVDD must powered up. IVDD should not lead the EVDD, SDVDD or PLLVDD by more than 0.4 V during power ramp-up, or there will be high current in the internal ESD protection diodes. The rise times on the power supplies should be slower than 500 us to avoid turning on the internal ESD protection clamp diodes. 3.4.2 Power Down Sequence If IVDD/PLLVDD are powered down first, then sense circuits in the I/O pads will cause all output drivers to be in a high impedance state. There is no limit on how long after IVDD and PLLVDD power down before EVDD or SDVDD must power down. IVDD should not lag EVDD, SDVDD, or PLLVDD going low by more than 0.4 V during power down or there will be undesired high current in the ESD protection diodes. There are no requirements for the fall times of the power supplies. The recommended power down sequence is as follows: 1. 2. Drop IVDD/PLLVDD to 0 V. Drop EVDD/SDVDD supplies. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 6 Freescale Semiconductor Hardware Design Considerations 3.5 Power Consumption Specifications All application power consumption data is lab data measured on an M52277EVB running the Freescale Linux BSP. Table 3. MCF52277 Application Power Consumption1 Core Freq. 160 MHz 1 Idle (LCD image) Idle (audio image) Button Demo Slideshow Demo MP3 Playback USB FS File Copy IVDD 61.4 59.2 84.7 96.5 89.2 89.5 EVDD 28.87 25.73 35.3 34.6 33.46 29.86 SDVDD 18.8 18.57 21.8 23.9 22.66 22.2 Total Power 221.211 207.135 282.78 301.95 285.006 272.748 Units mA mW All voltage rails at nominal values: IVDD = 1.5 V, EVDD = 3.3 V, and SDVDD = 1.8 V. 350 Total Power (mW) 300 250 200 150 100 50 0 Idle (LCD image) Idle (Audio Image) Button Demo Slideshow Demo MP3 Playback USB FS File Copy Figure 5. Power Consumption in Various Applications All current consumption data is lab data measured on a single device using an evaluation board. Table 4 shows the typical power consumption in low-power modes. These current measurements are taken after executing a STOP instruction. Table 4. Current Consumption in Low-Power Modes1,2 System Frequency Mode RUN WAIT 80MHz 64MHz 48MHz 32MHz 4MHz (LIMP mode) IVDD (mA) 75.1 62.7 49.2 36.6 3.5 Power (mW) 112.65 94.05 73.80 54.90 5.25 IVDD (mA) 61.9 52.8 42.0 31.7 2.9 Power (mW) 92.85 79.20 63.00 47.55 4.35 Voltage Supply MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 7 Hardware Design Considerations Table 4. Current Consumption in Low-Power Modes1,2 (continued) System Frequency Mode 80MHz 64MHz 48MHz 32MHz 4MHz (LIMP mode) IVDD (mA) 57.0 48.8 38.9 29.7 2.7 Power (mW) 85.50 73.20 58.35 44.55 4.05 IVDD (mA) 16.1 15.1 13.4 12.5 1.3 Power (mW) 24.15 22.65 20.10 18.75 1.95 IVDD (mA) 15.9 14.9 13.2 12.4 1.3 Power (mW) 23.85 22.35 19.80 18.60 1.95 IVDD (mA) 1.8 1.8 1.8 1.8 1.3 Power (mW) 2.70 2.70 2.70 2.70 1.95 IVDD (mA) 0.5 0.5 0.5 0.5 0.5 Power (mW) 0.75 0.75 0.75 0.75 0.75 Voltage Supply DOZE STOP 0 STOP 1 STOP 2 STOP 3 1 All values are measured on an M52277EVB with nominal core voltage(IVDD = 1.5 V). Tests performed at room temperature. All peripheral clocks on prior to entering low-power mode 2 Refer to the Power Management chapter in the MCF52277 Reference Manual for more information on low-power modes. IVDD Power Consumption (mW) 120 100 RUN 80 WAIT DOZE STOP 0 60 STOP 1 STOP 2 40 STOP 3 20 0 80 64 48 32 4 (LIMP) System Frequency (MHz) Figure 6. IVDD Power Consumption in Low-Power Modes MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 8 Freescale Semiconductor Pin Assignments and Reset States 4 Pin Assignments and Reset States 4.1 Signal Multiplexing The following table lists all the MCF5227x pins grouped by function. The direction column is the direction for the primary function of the pin only. Refer to Section 4, “Pin Assignments and Reset States,” for package diagrams. For a more detailed discussion of the MCF5227x signals, consult the MCF52277 Reference Manual (MCF52277RM). NOTE In this table and throughout this document a single signal within a group is designated without square brackets (i.e., FB_A23), while designations for multiple signals within a group use brackets (i.e., FB_A[23:21]) and is meant to include all signals within the two bracketed numbers when these numbers are separated by a colon. NOTE The primary functionality of a pin is not necessarily its default functionality. Most pins that are muxed with GPIO will default to their GPIO functionality. See Table 5 for a list of the exceptions. Table 5. Special-Case Default Signal Functionality Pin Default Signal FB_BE/BWE[3:0] FB_BE/BWE[3:0] FB_CS[3:0] FB_CS[3:0] FB_OE FB_OE FB_TA FB_TA FB_R/W FB_R/W FB_TS FB_TS Pull-up (U)1 Pull-down (D) Direction2 Voltage Domain Table 6. MCF5227x Signal Information and Muxing MCF52274 176 LQFP RESET — — — U I EVDD 103 J11 RSTOUT — — — — O EVDD 102 K11 — — I EVDD 106 F14 — 3 U O EVDD 105 G14 — I EVDD 110, 109 G10, H10 Signal Name GPIO Alternate 1 Alternate 2 MCF52277 196 MAPBGA Reset Clock EXTAL XTAL — — — — Mode Selection BOOTMOD[1:0] — — — MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 9 Pin Assignments and Reset States Pull-up (U)1 Pull-down (D) Direction2 Voltage Domain Table 6. MCF5227x Signal Information and Muxing (continued) MCF52274 176 LQFP FB_A[23:22] — FB_CS[5:4] — — O SDVDD 143, 142 FB_A[21:16] — — — — O SDVDD 141–139, 137–135 Signal Name GPIO Alternate 1 Alternate 2 MCF52277 196 MAPBGA C11, D11 FlexBus A12, B12, C12, B13, A13, A14 FB_A[15:14] — SD_BA[1:0] — — O SDVDD 131, 130 B14, C13 FB_A[13:11] — SD_A[13:11] — — O SDVDD 129–127 C14, D12, D13 FB_A10 — — — O SDVDD 126 D14 FB_A[9:0] — SD_A[9:0] — O SDVDD 125–116 E11–E14, F11–F13, G11, G12, H11 FB_D[31:16] — SD_D[31:16] — I/O SDVDD 30–37, 49–56 J4, K1–K4, L1–L3, M3, N3, P3,M4, N4, P4, L5, M5 FB_D[15:0] — FB_D[31:16] — I/O SDVDD 19–26, 60–67 G1–G4, H1–H4, M6, N6, P6, L7, M7, N7, P7, L8 FB_CLK — — — O SDVDD 42 P1 FB_BE/BWE[3:0] PBE[3:0] SD_DQM[3:0] — — O SDVDD 29, 57, 27, 59 J3, N5, J1, L6 FB_CS[3:2] PCS[3:2] — — — O SDVDD — B11, A11 FB_CS1 PCS1 SD_CS1 — — O SDVDD 144 D10 FB_CS0 PCS0 — — — O SDVDD 145 C10 FB_OE PFBCTL3 — — — O SDVDD 69 N8 FB_TA PFBCTL2 — — U I SDVDD 115 H12 FB_R/W PFBCTL1 — — — O SDVDD 68 M8 FB_TS PFBCTL0 DACK0 — — O SDVDD 15 F4 SDRAM Controller SD_A10 — — — — O SDVDD 46 L4 SD_CAS — — — — O SDVDD 47 N2 SD_CKE — — — — O SDVDD 17 F2 SD_CLK — — — — O SDVDD 40 M1 SD_CLK — — — — O SDVDD 41 N1 SD_CS0 — — — — O SDVDD 18 F1 SD_DQS[3:2] — — — — I/O SDVDD 28, 58 J2, P5 SD_RAS — — — — O SDVDD 48 P2 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 10 Freescale Semiconductor Pin Assignments and Reset States Alternate 1 Alternate 2 SD_SDR_DQS — — — — SD_WE — — — — Voltage Domain GPIO Direction2 Signal Name Pull-up (U)1 Pull-down (D) Table 6. MCF5227x Signal Information and Muxing (continued) MCF52274 176 LQFP MCF52277 196 MAPBGA O SDVDD 38 M2 O SDVDD 16 F3 I EVDD 162 D7 I EVDD 161 C7 External Interrupts Port4 IRQ7 PIRQ7 — — — IRQ4 PIRQ4 DREQ0 DSPI_PCS4 5 IRQ1 PIRQ1 USB_CLKIN SSI_CLKIN — I EVDD 160 B7 LCD Controller6 LCD_D[17:16]6 PLCDDH[1:0] LCD_D[11:10] — — O EVDD 9, 8 E3, E4 LCD_D[15:14]6 PLCDDM[7:6] LCD_D[9:8] — — O EVDD 7, 6 D1, D2 LCD_D13 PLCDDM5 CANTX — — O EVDD — C1 LCD_D12 PLCDDM4 CANRX — — O EVDD — C2 LCD_D[11:8]6 PLCDDM[3:0] LCD_D[7:4] — — O EVDD 5–2 D3, C3, D4, B1 LCD_D7 PLCDDL7 PWM7 — — O EVDD — B2 LCD_D6 PLCDDL6 PWM5 — — O EVDD — A1 LCD_D[5:2]6 PLCDDL[5:2] LCD_D[3:0] — — O EVDD 175–172 A2, A3, B3, A4 LCD_D1 PLCDDL1 PWM3 — — O EVDD — B4 LCD_D0 PLCDDL0 PWM1 — — O EVDD — C4 LCD_ACD/ LCD_OE PLCDCTL3 LCD_SPL_SPR — — O EVDD 169 B5 LCD_FLM/ LCD_VSYNC PLCDCTL2 — — — O EVDD 10 E2 LCD_LP/ LCD_HSYNC PLCDCTL1 — — — O EVDD 11 E1 LCD_LSCLK PLCDCTL0 — — — O EVDD 170 A5 — O USB 149 A9 150 A10 USB On-the-Go USB_DM — — — VDD USB_DP — — — — O USB VDD Real Time Clock RTC_EXTAL — — — — I EVDD 100 J14 RTC_XTAL — — — — O EVDD 99 K14 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 11 Pin Assignments and Reset States Alternate 1 Alternate 2 Voltage Domain GPIO Direction2 Signal Name Pull-up (U)1 Pull-down (D) Table 6. MCF5227x Signal Information and Muxing (continued) MCF52274 176 LQFP — I VDD_ 82–85, 87–90 MCF52277 196 MAPBGA Touchscreen Controller ADC_IN[7:0] — — — ADC P12, N12, P13, N13, P14, N14, M13, M14 ADC_REF — — — — I VDD_ 86 M12 ADC I2C I2C_SCL PI2C1 CANTX U2TXD U I/O EVDD 168 C5 I2C_SDA PI2C0 CANRX U2RXD U I/O EVDD 167 D5 — U I/O EVDD 152 B9 I EVDD 155 D8 DSPI7 DSPI_PCS0/SS PDSPI3 U2RTS DSPI_SIN PDSPI2 U2RXD SBF_DI 8 DSPI_SOUT PDSPI1 U2TXD SBF_D0 — O EVDD 154 D9 DSPI_SCK PDSPI0 U2CTS SBF_CK — I/O EVDD 153 C9 UARTs U1CTS PUART7 SSI_BCLK LCD_CLS — I EVDD 156 C8 U1RTS PUART6 SSI_FS LCD_PS — O EVDD 157 B8 U1TXD PUART5 SSI_TXD — — O EVDD 159 A7 U1RXD PUART4 SSI_RXD — — I EVDD 158 A8 U0CTS PUART3 DT1OUT USB_VBUS_EN — I EVDD 97 K12 U0RTS PUART2 DT1IN USB_VBUS_OC — O EVDD 98 J12 U0TXD PUART1 CANTX — — O EVDD 95 L12 U0RXD PUART0 CANRX — — I EVDD 96 K13 DMA Timers DT3IN PTIMER3 DT3OUT SSI_MCLK — I EVDD 163 D6 DT2IN/SBF_CS7 PTIMER2 DT2OUT DSPI_PCS2 — I EVDD 164 C6 DT1IN PTIMER1 DT1OUT LCD_CONTRAST — I EVDD 165 B6 DT0IN PTIMER0 DT0OUT LCD_REV — I EVDD 166 A6 BDM/JTAG9 PST[3:0] — — — — O EVDD — L9, M9, N9, P9 DDATA[3:0] — — — — O EVDD — L10, M10, N10, P10 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 12 Freescale Semiconductor Pin Assignments and Reset States Voltage Domain MCF52274 176 LQFP MCF52277 196 MAPBGA O EVDD 76 — I EVDD 79 K10 U O EVDD 74 P8 — U I EVDD 78 M11 TDO — — O EVDD 81 L11 — TMS — U I EVDD 80 N11 — TRST — U I EVDD 77 P11 — D I EVDD 134 E10 — — — 39, 75, 114, 138, K5, F10, E5, J10 Signal Name GPIO Alternate 1 Alternate 2 Pull-up (U)1 Pull-down (D) Direction2 Table 6. MCF5227x Signal Information and Muxing (continued) ALLPST — — — — JTAG_EN — — — D PSTCLK — TCLK — DSI — TDI DSO — BKPT DSCLK Test TEST — — Power Supplies IVDD — — — 171 EVDD — — — — — — 12, 72, 73, 94, 111, E6, E7, F5, F6, G5, 148, 176 SD_VDD 1 2 3 4 5 6 7 8 — — — — — — H9, J9, K8, K9 14, 43, 44, 70, 113, E8, E9, F9, G9, H5, 132, 146 J5, J6, K6, K7 VDD_OSC — — — — — — 108 G13 VDD_PLL — — — — — — 104 H14 VDD_USB — — — — — — 151 B10 VDD_RTC — — — — — — 101 J13 VDD_ADC — — — — — — 91 L13 VSS — — — — — — 1, 13, 45, 71, 93, F7, F8, G6–G8, 112, 133, 147 H6–H8, J7, J8 VSS_OSC — — — — — — 107 H13 VSS_ADC — — — — — — 92 L14 Pull-ups are generally only enabled on pins with their primary function, except as noted. Refers to pin’s primary function. Enabled only in oscillator bypass mode (internal crystal oscillator is disabled). GPIO functionality is determined by the edge port module. The GPIO module is only responsible for assigning the alternate functions. Pull-up when DREQ controls the pin. The 176 LQFP device only supports a 12-bit LCD data bus. DSPI or SBF signal functionality is controlled by RESET. When asserted, these pins are configured for serial boot; when negated, the pins are configured for DSPI. Pull-up when the serial boot facility (SBF) controls the pin. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 13 Pin Assignments and Reset States If JTAG_EN is asserted, these pins default to alternate 1 (JTAG) functionality. The GPIO module is not responsible for assigning these pins. 4.2 Pinout—176 LQFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 • SD_VDD FB_A15 FB_A14 FB_A13 FB_A12 FB_A11 FB_A10 FB_A9 FB_A8 FB_A7 FB_A6 FB_A5 FB_A4 FB_A3 FB_A2 FB_A1 FB_A0 FB_TA IVDD SD_VDD VSS EVDD BOOTMOD1 BOOTMOD0 VDD_OSC VSS_OSC EXTAL XTAL VDD_PLL RESET RSTOUT VDD_RTC RTC_EXTAL RTC_XTAL U0RTS U0CTS U0RXD U0TXD EVDD VSS VSS_ADC VDD_ADC ADC_IN0 ADC_IN1 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 VSS LCD_D8 LCD_D9 LCD_D10 LCD_D11 LCD_D14 LCD_D15 LCD_D16 LCD_D17 LCD_FLM/VSYNC LCD_LP/HSYNC EVDD VSS SD_VDD FB_TS SD_WE SD_CKE SD_CS0 FB_D15 FB_D14 FB_D13 FB_D12 FB_D11 FB_D10 FB_D9 FB_D8 FB_BE/BWE1 SD_DQS3 FB_BE/BWE3 FB_D31 FB_D30 FB_D29 FB_D28 FB_D27 FB_D26 FB_D25 FB_D24 SD_SDR_DQS IVDD SD_CLK SD_CLK FB_CLK SD_VDD SD_VDD 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 EVDD LCD_D5 LCD_D4 LCD_D3 LCD_D2 IVDD LCD_LSCLK LCD_ACD/OE I2C_SCL I2C_SDA T0IN T1IN T2IN T3IN IRQ7 IRQ4 IRQ1 U1TXD U1RXD U1RTS U1CTS DSPI_SIN DSPI_SOUT DSPI_SCK DSPI_PCS0 VDD_USB USB_DP USB_DM EVDD VSS SD_VDD FB_CS0 FB_CS1 FB_A23 FB_A22 FB_A21 FB_A20 FB_A19 IVDD FB_A18 FB_A17 FB_A16 TEST VSS The pinout for the MCF52274 package is shown below. VSS SD_A10 SD_CAS SD_RAS FB_D23 FB_D22 FB_D21 FB_D20 FB_D19 FB_D18 FB_D17 FB_D16 FB_BE/BWE2 SD_DQS2 FB_BE/BWE0 FB_D7 FB_D6 FB_D5 FB_D4 FB_D3 FB_D2 FB_D1 FB_D0 FB_R/W FB_OE SD_VDD VSS EVDD EVDD PSTCLK IVDD ALLPST DSCLK DSI JTAG_EN BKPT DSO ADC_IN7 ADC_IN6 ADC_IN5 ADC_IN4 ADC_REF ADC_IN3 ADC_IN2 9 Figure 7. MCF52274 Pinout (176 LQFP) MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 14 Freescale Semiconductor Electrical Characteristics 4.3 Pinout—196 MAPBGA The pinout for the MCF52277 package is shown below. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A LCD_D6 LCD_D5 LCD_D4 LCD_D2 LCD_ LSCLK T0IN U1TXD U1RXD USB_DM USB_DP FB_CS2 FB_A21 FB_A17 FB_A16 A B LCD_D8 LCD_D7 LCD_D3 LCD_D1 LCD_ ACD/OE T1IN IRQ_1 U1RTS DSPI_ PCS0 VDD_ USB FB_CS3 FB_A20 FB_A18 FB_A15 B C LCD_D13 LCD_D12 LCD_D10 LCD_D0 I2C_SCL T2IN IRQ_4 U1CTS DSPI_ SCK FB_CS0 FB_A23 FB_A19 FB_A14 FB_A13 C D LCD_D15 LCD_D14 LCD_D11 LCD_D9 I2C_SDA T3IN IRQ_7 DSPI_SIN DSPI_ SOUT FB_CS1 FB_A22 FB_A12 FB_A11 FB_A10 D E LCD_LP/ LCD_FLM/ LCD_D17 LCD_D16 HSYNC VSYNC IVDD EVDD EVDD SDVDD SDVDD TEST FB_A9 FB_A8 FB_A7 FB_A6 E F SD_CS0 SD_CKE SD_WE FB_TS EVDD EVDD VSS VSS SDVDD IVDD FB_A5 FB_A4 FB_A3 EXTAL F G FB_D15 FB_D14 FB_D13 FB_D12 EVDD VSS VSS VSS SDVDD BOOT MOD1 FB_A2 FB_A1 VDD_ OSC XTAL G H FB_D11 FB_D10 FB_D9 FB_D8 SDVDD VSS VSS VSS EVDD BOOT MOD0 FB_A0 FB_TA VSS_ OSC VDD_ PLL H J FB_BE/ BWE1 SD_DQS3 FB_BE/ BWE3 FB_D31 SDVDD SDVDD VSS VSS EVDD IVDD RESET U0RTS VDD_ RTC RTC_ EXTAL J K FB_D30 FB_D29 FB_D28 FB_D27 IVDD SDVDD SDVDD EVDD EVDD U0CTS U0RXD RTC_ XTAL K L FB_D26 FB_D25 FB_D24 SD_A10 FB_D17 FB_BE/ BWE0 FB_D4 FB_D0 PST3 DDATA3 TDO U0TXD VDD_ ADC VSS_ ADC L M SD_CLK SD_ SDR_DQS FB_D23 FB_D20 FB_D16 FB_D7 FB_D3 FB_R/W PST2 DDATA2 TDI ADC_ REF N SD_CLK SD_CAS FB_D22 FB_D19 FB_BE/ BWE2 FB_D6 FB_D2 FB_OE PST1 DDATA1 P FB_CLK SD_RAS FB_D21 FB_D18 SD_ DQS0 FB_D5 FB_D1 TCLK PST0 1 2 3 4 5 6 7 8 9 JTAG_EN RSTOUT ADC_IN1 ADC_IN0 M TMS ADC_IN6 ADC_IN4 ADC_IN2 N DDATA0 TRST ADC_IN7 ADC_IN5 ADC_IN3 P 10 11 12 13 14 Figure 8. MCF52277 Pinout (196 MAPBGA) 5 Electrical Characteristics This document contains electrical specification tables and reference timing diagrams for the MCF5227x microprocessor. This section contains detailed information on DC/AC electrical characteristics and AC timing specifications. The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle, however for production silicon these specifications will be met. Finalized specifications will be published after complete characterization and device qualifications have been completed. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 15 Electrical Characteristics NOTE The parameters specified in this MCU document supersede any values found in the module specifications. 5.1 Maximum Ratings Table 7. Absolute Maximum Ratings1, 2 Characteristic Symbol Value Unit Core Supply Voltage IVDD –0.5 to +2.0 V CMOS Pad Supply Voltage EVDD –0.3 to +4.0 V SDVDD –0.3 to +4.0 V Oscillator Supply Voltage OSCVDD –0.3 to +4.0 V PLL Supply Voltage PLLVDD –0.3 to +2.0 V RTC Supply Voltage RTCVDD –0.5 to +2.0 V Digital Input Voltage 3 VIN –0.3 to +3.6 V Instantaneous Maximum Current Single pin limit (applies to all pins) 3, 4, 5 ID 25 mA TA (TL – TH) –40 to +85 °C Tstg –55 to +150 °C DDR/Memory Pad Supply Voltage Operating Temperature Range (Packaged) Storage Temperature Range 1 2 3 4 5 Functional operating conditions are given in Section 5.4, “DC Electrical Specifications.” Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Continued operation at these levels may affect device reliability or cause permanent damage to the device. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either VSS or EVDD). Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two values. All functional non-supply pins are internally clamped to VSS and EVDD. Power supply must maintain regulation within operating EVDD range during instantaneous and operating maximum current conditions. If positive injection current (Vin > EVDD) is greater than IDD, the injection current may flow out of EVDD and could result in external power supply going out of regulation. Insure external EVDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power (ex; no clock). Power supply must maintain regulation within operating EVDD range during instantaneous and operating maximum current conditions. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 16 Freescale Semiconductor Electrical Characteristics 5.2 Thermal Characteristics Table 8. Thermal Characteristics Characteristic Symbol 196 MAPBGA 176 LQFP Unit Junction to ambient, natural convection Four layer board (2s2p) θJA 381,2 481,2 °C/W Junction to ambient (@200 ft/min) Four layer board (2s2p) θJMA 341,2 421,2 °C/W 37 3 °C/W 4 °C/W °C/W Junction to board θJB Junction to case θJC 17 14 Junction to top of package Ψjt 41,5 31,5 Maximum operating junction temperature Tj 105 105 1 2 3 4 5 3 27 4 o C θJA, θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale recommends the use of θJmA and power dissipation specifications in the system design to prevent device junction temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2. Per JEDEC JESD51-6 with the board horizontal. Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance with Psi-JT. The average chip-junction temperature (TJ) in °C can be obtained from: T J = T A + ( P D × Θ JMA ) Eqn. 1 Where: TA QJMA PD PINT PI/O = = = = = Ambient Temperature, °C Package Thermal Resistance, Junction-to-Ambient, °C/W PINT + PI/O IDD × IVDD, Watts - Chip Internal Power Power Dissipation on Input and Output Pins — User Determined For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is: K P D = --------------------------------( T J + 273 ° C ) Eqn. 2 Solving equations 1 and 2 for K gives: 2 K = P D × ( T A × 273°C ) + Q JMA × P D Eqn. 3 where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively for any value of TA. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 17 Electrical Characteristics 5.3 ESD Protection Table 9. ESD Protection Characteristics1,2 Characteristic ESD Target for Human Body Model Symbol Value Unit HBM 2000 V 1 All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. 2 A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification requirements. Complete DC parametric and functional testing is performed per applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. 5.4 DC Electrical Specifications Table 10. DC Electrical Specifications Characteristic Symbol Min Max Unit Core Supply Voltage IVDD 1.4 1.6 V PLL Supply Voltage PLLVDD 1.4 1.6 V RTC Supply Voltage RTCVDD 1.4 1.6 V EVDD 3.0 3.6 V 1.7 2.25 3.0 1.95 2.75 3.6 CMOS Pad Supply Voltage SDRAM and FlexBus Supply Voltage Mobile DDR/Bus Pad Supply Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) V SDVDD USB Supply Voltage USBVDD 3.0 3.6 V Oscillator Supply Voltage OSCVDD 3.0 3.6 V CMOS Input High Voltage EVIH 2 EVDD + 0.3 V CMOS Input Low Voltage EVIL VSS – 0.3 0.8 V CMOS Output High Voltage IOH = –5.0 mA EVOH EVDD – 0.4 — V CMOS Output Low Voltage IOL = 5.0 mA EVOL — 0.4 V SDRAM and FlexBus Input High Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) SDVIH 1.35 1.7 2 SDVDD + 0.3 SDVDD + 0.3 SDVDD + 0.3 SDRAM and FlexBus Input Low Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) SDVIL VSS – 0.3 VSS – 0.3 VSS – 0.3 0.45 0.8 0.8 V V MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 18 Freescale Semiconductor Electrical Characteristics Table 10. DC Electrical Specifications (continued) Characteristic Symbol Min Max 1.4 2.1 2.4 — — — — — — 0.3 0.3 0.5 Iin –1.0 1.0 μA Weak Internal Pull-Up Device Current, tested at VIL Max.1 IAPU –10 –130 μA Input Capacitance 2 All input-only pins All input/output (three-state) pins Cin — — 7 7 Symbol Min Max Unit fref_crystal fref_ext 16 16 251 66.671 MHz MHz fsys 166.67 83.33 MHz MHz SDRAM and FlexBus Output High Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) IOH = –5.0 mA for all modes SDVOH SDRAM and FlexBus Output Low Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) IOL = 5.0 mA for all modes SDVOL Input Leakage Current Vin = VDD or VSS, Input-only pins 1 Unit V V pF Refer to the signals section for pins having weak internal pull-up devices. This parameter is characterized before qualification rather than 100% tested. 2 5.5 Oscillator and PLL Electrical Characteristics Table 11. PLL Electrical Characteristics Num 1 Characteristic PLL Reference Frequency Range Crystal reference External reference Core/system frequency CLKOUT Frequency fsys/2 512 Hz2 256 Hz2 3 Crystal Start-up Time3,4 tcst — 10 ms 4 EXTAL Input High Voltage Crystal Mode5 All other modes (External, Limp) VIHEXT VIHEXT VXTAL + 0.4 EVDD/2 + 0.4 — — V V EXTAL Input Low Voltage Crystal Mode5 All other modes (External, Limp) VILEXT VILEXT — — VXTAL – 0.4 EVDD/2 – 0.4 V V tlpll — 50000 CLKIN tdc 40 60 % IXTAL 1 3 mA 2 5 7 PLL Lock Time 3,6 3 8 Duty cycle of reference 9 XTAL Current 10 Total on-chip stray capacitance on XTAL CS_XTAL — 1.5 pF 11 Total on-chip stray capacitance on EXTAL CS_EXTAL — 1.5 pF 12 Crystal capacitive load CL See crystal spec MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 19 Electrical Characteristics Table 11. PLL Electrical Characteristics (continued) Num Characteristic Symbol Min Max Unit 13 Discrete load capacitance for XTAL Discrete load capacitance for EXTAL CL_XTAL CL_EXTAL — 2 × (CL – CS_XTAL – CS_EXTAL – CS_PCB)7 pF 14 Frequency un-LOCK Range fUL –4.0 4.0 % fsys 15 Frequency LOCK Range fLCK –2.0 2.0 % fsys — — 10 TBD % fsys/2 % fsys/2 350 540 MHz 17 19 1 2 3 4 5 6 7 8 4, 5, 8 CLKOUT period jitter measured at fsys max Peak-to-peak jitter (Clock edge to clock edge) Long-term jitter Cjitter VCO frequency (fvco = fref × PFDR) fvco Although these are the allowable frequency ranges, do not violate the VCO frequency range of the PLL. See the MCF5227x Reference Manual for more details. The minimum system frequency is the minimum input clock divided by the maximum low-power divider (16 MHz ÷ 32,768). When the PLL is enabled, the minimum system frequency (fsys) is 37.5 MHz. This parameter is guaranteed by characterization before qualification rather than 100% tested. Applies to external clock reference only. Proper PC board layout procedures must be followed to achieve specifications. This parameter is guaranteed by design rather than 100% tested. This specification is the PLL lock time only and does not include oscillator start-up time.. CS_PCB is the measured PCB stray capacitance on EXTAL and XTAL. Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fsys. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the PLL circuitry via PLL VDD, EVDD, and VSS and variation in crystal oscillator frequency increase the Cjitter percentage for a given interval. 5.6 ASP Electrical Characteristics Table 12 lists the electrical specifications for the ASP module. Table 12. ASP Electrical Characteristics Characteristic Symbol Min Typical Max Unit ASP Analog Supply Voltage VDDA 3.0 — 3.6 V Input Voltage Range VADIN 0 — VDDA V Operating Current Consumption IDDA_ON — 700 — uA Power-down Current Consumption IDDA_OFF — 1 — uA RES — — 12 bits — — 125 kS/s Resolution Sampling rate Integral Non-linearity INL — ±8 ±24 lsb1 Differential Non-linearity DNL — ±2 ±24 lsb1 ADC Internal Clock Frequency tAIC 2 — 8 MHz Conversion Range RAD 0 — VDDA V MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 20 Freescale Semiconductor Electrical Characteristics Table 12. ASP Electrical Characteristics (continued) Characteristic Symbol Min Typical Max Unit Conversion Time tADC 15 — 32 tAIC cycles Sample Time tADS 3 — 20 tAIC cycles Multiplexer Settling Time tAMS — — 3 tAIC cycles Zero-scale Error ZE — ±4 ±12 lsb1 Full-scale Error FE — ±320 ±370 lsb1 CAIN — — 34 pF Input Capacitance 1 A least significant bit (lsb) is a unit of voltage equal to the smallest resolution of the ADC. This unit of measure approximately relates the error voltage to the observed error in conversion (code error), and is useful for systemic errors such as differential non-linearity. A 2.56-V input on an ADC with ± 3 lsb of error could read between 0x1FD and 0x203. This unit is by far the most common terminology and will be the preferred unit used for error representation. A bit is a unit equal to the log (base2) of the error voltage normalized to the resolution of the ADC. An error of N bits corresponds to 2N lsb of error. This measure is easily confused with lsb and is hard to extrapolate between integer values. 5.7 5.7.1 External Interface Timing Specifications FlexBus A multi-function external bus interface called FlexBus is provided with basic functionality to interface to slave-only devices up to a maximum bus frequency of 66MHz. It can be directly connected to asynchronous or synchronous devices such as external boot ROMs, flash memories, gate-array logic, or other simple target (slave) devices with little or no additional circuitry. For asynchronous devices a simple chip-select based interface can be used. All processor bus timings are synchronous; that is, input setup/hold and output delay are given in respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be the same as the internal system bus frequency or an integer divider of that frequency. The following timing numbers indicate when data will be latched or driven onto the external bus, relative to the Flexbus output clock, FB_CLK. All other timing relationships can be derived from these values. Table 13. FlexBus AC Timing Specifications Num Characteristic Symbol Min Max Unit Notes — 83.33 MHz fsys/2 tFBCK 12.0 — ns tcyc Frequency of Operation FB1 Clock Period (FB_CLK) FB2 Address, Data, and Control Output Valid (FB_A[23:0], FB_D[31:0], FB_CS[5:0], FB_R/W, FB_TS, FB_BE/BWE[3:0] and FB_OE) tFBCHDCV — 7.0 ns 1 FB3 Address, Data, and Control Output Hold (FB_A[23:0], FB_D[31:0], FB_CS[5:0], FB_R/W, FB_TS, FB_BE/BWE[3:0], and FB_OE) tFBCHDCI 1 — ns 1, 2 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 21 Electrical Characteristics Table 13. FlexBus AC Timing Specifications (continued) Num Characteristic Symbol Min Max Unit FB4 Data Input Setup tDVFBCH 3.5 — ns FB5 Data Input Hold tDIFBCH 0 — ns FB6 Transfer Acknowledge (TA) Input Setup tCVFBCH 4 — ns FB7 Transfer Acknowledge (TA) Input Hold tCIFBCH 0 — ns Notes 1 Timing for chip selects only applies to the FB_CS[5:0] signals. Please see Section 22.214.171.124, “DDR SDRAM AC Timing Specifications,” for SD_CS[3:0] timing. 2 The FlexBus supports programming an extension of the address hold. Please consult the device reference manual for more information. NOTE The processor drives the data lines during the first clock cycle of the transfer with the full 32-bit address. This may be ignored by standard connected devices using non-multiplexed address and data buses. However, some applications may find this feature beneficial. The address and data busses are muxed between the FlexBus and SDRAM controller. At the end of the read and write bus cycles the address signals are indeterminate. S0 S1 S2 S3 FB_CLK FB1 FB3 ADDR[23:0] FB_A[23:0] FB_D[31:X] FB2 FB5 ADDR[31:X] DATA FB4 FB_R/W FB_TS FB_CSn, FB_OE, FB_BE/BWEn FB6 FB7 FB_TA Figure 9. FlexBus Read Timing MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 22 Freescale Semiconductor Electrical Characteristics S0 S1 S2 S3 FB_CLK FB1 FB3 ADDR[23:0] FB_A[23:0] FB2 FB_D[31:X] ADDR[31:X] DATA FB_R/W FB_TS FB_CSn, FB_BE/BWEn FB_OE FB6 FB7 FB_TA Figure 10. Flexbus Write Timing 5.7.2 SDRAM Bus The SDRAM controller supports accesses to main SDRAM memory from any internal master. It supports either standard SDRAM or double data rate (DDR) SDRAM, but it does not support both at the same time. 126.96.36.199 SDR SDRAM AC Timing Specifications The following timing numbers indicate when data will be latched or driven onto the external bus, relative to the memory bus clock, when operating in SDR mode on write cycles and relative to SD_DQS on read cycles. The device’s SDRAM controller is a DDR controller that has an SDR mode. Because it is designed to support DDR, a DQS pulse must still be supplied to the device for each data beat of an SDR read. The processor accomplishes this by asserting a signal named SD_SDR_DQS during read cycles. Care must be taken during board design to adhere to the following guidelines and specs with regard to the SD_SDR_DQS signal and its usage. Table 14. SDR Timing Specifications Num Characteristic Symbol Frequency of Operation Min Max Unit Notes 60 83.33 MHz 1 SD1 Clock Period tSDCK 12.0 16.67 ns 2 SD2 Pulse Width High tSDCKH 0.45 0.55 SD_CLK 3 SD3 Pulse Width Low tSDCKH 0.45 0.55 SD_CLK 3 SD4 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA, SD_CS[1:0] - Output Valid tSDCHACV — 0.5 × SD_CLK + 1.0 ns SD5 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA, SD_CS[1:0] - Output Hold tSDCHACI 2.0 — ns tDQSOV — Self timed ns 4 tDQVSDCH 0.25 × SD_CLK 0.40 × SD_CLK ns 5 SD6 SD_SDR_DQS Output Valid SD7 SD_DQS[3:2] input setup relative to SD_CLK MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 23 Electrical Characteristics Table 14. SDR Timing Specifications (continued) Num Characteristic Symbol Min Max Unit SD8 SD_DQS[3:2] input hold relative to SD_CLK tDQISDCH SD9 Data (D[31:0]) Input Setup relative to SD_CLK (reference only) tDVSDCH 0.25 × SD_CLK — ns SD10 Data Input Hold relative to SD_CLK (reference only) tDISDCH 1.0 — ns SD11 Data (D[31:0]) and Data Mask(SD_DQM[3:0]) Output Valid tSDCHDMV — 0.5 × SD_CLK +2 ns SD12 Data (D[31:0]) and Data Mask (SD_DQM[3:0]) Output Hold tSDCHDMI 1.5 — ns 1 2 3 4 5 6 7 Does not apply. 0.5×SD_CLK fixed width. Notes 6 7 The device supports same frequency of operation for both FlexBus and SDRAM clock operates as that of the internal bus clock. Please see the PLL chapter of the device reference manual for more information on setting the SDRAM clock rate. SD_CLK is one SDRAM clock in ns. Pulse width high plus pulse width low cannot exceed min and max clock period. SD_SDR_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This is a guideline only. Subtle variation from this guideline is expected. SD_SDR_DQS will only pulse during a read cycle and one pulse will occur for each data beat. SD_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This spec is a guideline only. Subtle variation from this guideline is expected. SD_DQS will only pulse during a read cycle and one pulse will occur for each data beat. The SD_DQS pulse is designed to be 0.5 clock in width. The timing of the rising edge is most important. The falling edge does not affect the memory controller. Since a read cycle in SDR mode still uses the DQS circuit within the device, it is critical that the data valid window be centered 1/4 clk after the rising edge of DQS. Ensuring that this happens will result in successful SDR reads. The input setup spec is provided as guidance. SD2 SD1 SD_CLK SD3 SD5 SD_CSn SD_RAS SD_CAS SD_WE A[23:0] SD_BA[1:0] CMD SD4 ROW COL SD11 SDDM SD12 D[31:0] WD1 WD2 WD3 WD4 Figure 11. SDR Write Timing MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 24 Freescale Semiconductor Electrical Characteristics SD2 SD1 SD_CLK SD5 SD_CSn, SD_RAS, SD_CAS, SD_WE SD3 CMD 3/4 MCLK Reference SD4 A[23:0], SD_BA[1:0] ROW COL tDQS SDDM SD6 SD_SDR_DQS (Measured at Output Pin) Board Delay SD_DQS[3:2] SD8 (Measured at Input Pin) SD7 Board Delay Delayed SD_CLK SD9 D[31:0] from Memories WD1 NOTE: Data driven from memories relative to delayed memory clock. WD2 WD3 WD4 SD10 Figure 12. SDR Read Timing 188.8.131.52 DDR SDRAM AC Timing Specifications When using the SDRAM controller in DDR mode, the following timing numbers must be followed to properly latch or drive data onto the memory bus. All timing numbers are relative to the two DQS byte lanes. Table 15. DDR Timing Specifications Num Characteristic Symbol Min Max Unit Notes Frequency of Operation tDDCK 60 83.33 MHz 1 DD1 Clock Period tDDSK 12.0 16.67 ns 2 DD2 Pulse Width High tDDCKH 0.45 0.55 SD_CLK 3 DD3 Pulse Width Low tDDCKL 0.45 0.55 SD_CLK 3 DD4 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Valid tSDCHACV — 0.5 × SD_CLK + 1.0 ns 4 DD5 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Hold tSDCHACI 2.0 — ns DD6 Write Command to first DQS Latching Transition tCMDVDQ — 1.25 SD_CLK DD7 Data and Data Mask Output Setup (DQ→DQS) Relative to DQS (DDR Write Mode) tDQDMV 1.5 — ns 5 6 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 25 Electrical Characteristics Table 15. DDR Timing Specifications (continued) Num Characteristic Symbol Min Max Unit Notes DD8 Data and Data Mask Output Hold (DQS→DQ) Relative to DQS (DDR Write Mode) tDQDMI 1.0 — ns 7 DD9 Input Data Skew Relative to DQS (Input Setup) tDVDQ — 1 ns 8 tDIDQ 0.25 × SD_CLK + 0.5ns — ns 9 0.5 — ns DD10 Input Data Hold Relative to DQS DD11 DQS falling edge from SDCLK rising (output hold time) tDQLSDCH 1 2 3 4 5 6 7 8 9 The frequency of operation is either 2x or 4x the FB_CLK frequency of operation. FlexBus and SDRAM clock operate at the same frequency as the internal bus clock. SD_CLK is one SDRAM clock in ns. Pulse-width high plus pulse-width low cannot exceed minimum or maximum clock period. Command output valid should be one-half the memory bus clock (SD_CLK) plus some minor adjustments for process, temperature, and voltage variations. This specification relates to the required input setup time of today’s DDR memories. The device’s output setup should be larger than the input setup of the DDR memories. If it is not larger, then the input setup on the memory will be in violation. MEM_DATA[31:24] is relative to MEM_DQS, MEM_DATA[23:16] is relative to MEM_DQS, MEM_DATA[15:8] is relative to MEM_DQS, and MEM_DATA[7:0] is relative MEM_DQS. The first data beat will be valid before the first rising edge of DQS and after the DQS write preamble. The remaining data beats will be valid for each subsequent DQS edge. This specification relates to the required hold time of today’s DDR memories. MEM_DATA[31:24] is relative to MEM_DQS, MEM_DATA[23:16] is relative to MEM_DQS, MEM_DATA[15:8] is relative to MEM_DQS, and MEM_DATA[7:0] is relative MEM_DQS. Data input skew is derived from each DQS clock edge. It begins with a DQS transition and ends when the last data line becomes valid. This input skew must include DDR memory output skew and system-level board skew (due to routing or other factors). Data input hold is derived from each DQS clock edge. It begins with a DQS transition and ends when the first data line becomes invalid. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 26 Freescale Semiconductor Electrical Characteristics DD1 DD2 SD_CLK DD3 SD_CLK DD5 SD_CSn, SD_WE, SD_RAS, SD_CAS CMD DD4 A[13:0] ROW COL DD11 SD_DQS[3:2] DD6 DD7 SD_DM[3:2] D[31:16] WD1 WD2 WD3 WD4 DD8 Figure 13. DDR Write Timing MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 27 Electrical Characteristics DD1 DD2 SD_CLK DD3 SD_CLK CL=2 DD5 SD_CSn,SD_WE, SD_RAS, SD_CAS CMD CL=2.5 DD4 A[13:0] ROW COL DD9 DQS Read Postamble DQS Read Preamble CL = 2 SD_DQS3/SD_DQS2 DD10 D[31:24]/D[23:16] WD1 DQS Read Preamble CL = 2.5 SD_DQS3/SD_DQS2 WD2 WD3 WD4 DQS Read Postamble D[31:24]/D[23:16] WD1 WD2 WD3 WD4 Figure 14. DDR Read Timing Table 16. DDR Clock Crossover Specifications Symbol 1 Characteristic Min Max Unit VMP Clock output mid-point voltage 1.05 1.45 V VOUT Clock output voltage level –0.3 SD_VDD + 0.3 V VID Clock output differential voltage (peak to peak swing) 0.7 SD_VDD + 0.6 V VIX Clock crossing point voltage1 1.05 1.45 V The clock crossover voltage is only guaranteed when using the highest drive strength option for the SDCLK[1:0] and SDCLK[1:0] signals. SD_CLK VIX VMP VIX VID SD_CLK Figure 15. SD_CLK and SD_CLK Crossover Timing MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 28 Freescale Semiconductor Electrical Characteristics 5.8 General Purpose I/O Timing Table 17. GPIO Timing1 Num 1 Characteristic Symbol Min Max Unit G1 FB_CLK High to GPIO Output Valid tCHPOV — 10 ns G2 FB_CLK High to GPIO Output Invalid tCHPOI 1.5 — ns G3 GPIO Input Valid to FB_CLK High tPVCH 9 — ns G4 FB_CLK High to GPIO Input Invalid tCHPI 1.5 — ns These general purpose specifications apply to the following signals: IRQn, all UART signals, FlexCAN signals, PWM signals, DACKn and DREQn, and all signals configured as GPIO. FB_CLK G1 G2 GPIO Outputs G3 G4 GPIO Inputs Figure 16. GPIO Timing 5.9 Reset and Configuration Override Timing Table 18. Reset and Configuration Override Timing Num 1 Characteristic Symbol Min Max Unit R1 RESET Input valid to FB_CLK High tRVCH 9 — ns R2 FB_CLK High to RESET Input invalid tCHRI 1.5 — ns tRIVT 5 — tCYC 1 R3 RESET Input valid Time R4 FB_CLK High to RSTOUT Valid tCHROV — 10 ns R5 RSTOUT valid to Config. Overrides valid tROVCV 0 — ns R6 Configuration Override Setup Time to RSTOUT invalid tCOS 20 — tCYC R7 Configuration Override Hold Time after RSTOUT invalid tCOH 0 — ns R8 RSTOUT invalid to Configuration Override High Impedance tROICZ — 1 tCYC During low power STOP, the synchronizers for the RESET input are bypassed and RESET is asserted asynchronously to the system. Thus, RESET must be held a minimum of 100 ns. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 29 Electrical Characteristics FB_CLK R1 R2 R3 RESET R4 R4 RSTOUT R8 R5 R6 R7 Configuration Overrides*: (RCON, Override pins) Figure 17. RESET and Configuration Override Timing NOTE Refer to the CCM chapter of the MCF52277 Reference Manual for more information. 5.10 LCD Controller Timing Specifications This sections lists the timing specifications for the LCD Controller. Table 19. LCD_LSCLK Timing Num Characteristic Min Max Unit T1 LCD_LSCLK Period 25 2000 ns T2 Pixel data setup time 11 — ns T3 Pixel data up time 11 — ns Note: The pixel clock is equal to LCD_LSCLK / (PCD + 1). When it is in CSTN, TFT, or monochrome mode with bus width = 1, LCD_LSCLK is equal to the pixel clock. When it is in monochrome with other bus width settings, LCD_LSCLK is equal to the pixel clock divided by bus width. The polarity of LCD_LSCLK and LCD_D signals can also be programmed. T1 LCD_LSCLK LCD_D[17:0] T2 T3 Figure 18. LCD_LSCLK to LCD_D[17:0] timing diagram MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 30 Freescale Semiconductor Electrical Characteristics Non-display Region LCD_VSYNC Display Region T3 T1 T4 T2 LCD_HSYNC LCD_OE LCD_D[17:0] Line Y Line 1 T5 T6 Line Y XMAX T7 LCD_HSYNC LCD_LSCLK LCD_OE LCD_D[15:0] (1,1) (1,2) (1,X) Figure 19. 4/8/12/16/18 Bit/Pixel TFT Color Mode Panel Timing Table 20. 4/8/12/16/18 Bit/Pixel TFT Color Mode Panel Timing Num Characteristic Min Value Unit T5 + T6 + T7 – 1 (VWAIT1 × T2) + T5 + T6 + T7 – 1 Ts T1 End of LCD_OE to beginning of LCD_VSYNC T2 LCD_HSYNC period — XMAX+T5+T6+T7 Ts T3 LCD_VSYNC pulse width T2 VWIDTH × T2 Ts T4 End of LCD_VSYNC to beginning of LCD_OE 1 (VWAIT2 × T2)+1 Ts T5 LCD_HSYNC pulse width 1 HWIDTH + 1 Ts T6 End of LCD_HSYNC to beginning to LCD_OE 3 HWAIT2 + 3 Ts T7 End of LCD_OE to beginning of LCD_HSYNC 1 HWAIT1 + 1 Ts Note: Ts is the LCD_LSCLK period. LCD_VSYNC, LCD_HSYNC, and LCD_OE can be programmed as active high or active low. In Figure 19, all 3 signals are active low. LCD_LSCLK can be programmed to be deactivated during the LCD_VSYNC pulse or the LCD_OE deasserted period. In Figure 19, LCD_LSCLK is always active. Note: XMAX is defined in number of pixels in one line. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 31 Electrical Characteristics XMAX LCD_LSCLK LCD_D D1 D320 D2 D320 T1 LCD_SPL_SPR T2 T3 T2 LCD_HSYNC T4 T4 LCD_CLS T5 LCD_PS T6 T7 T7 LCD_REV Figure 20. Sharp TFT Panel Timing Table 21. Sharp TFT Panel Timing Num Characteristic Min Value Unit T1 LCD_SPL/LCD_SPR pulse width — 1 Ts T2 End of LCD_D of line to beginning of LCD_HSYNC 1 HWAIT1+1 Ts T3 End of LCD_HSYNC to beginning of LCD_D of line 4 HWAIT2 + 4 Ts T4 LCD_CLS rise delay from end of LCD_D of line 3 CLS_RISE_DELAY+1 Ts T5 LCD_CLS pulse width 1 CLS_HI_WIDTH+1 Ts T6 LCD_PS rise delay from LCD_CLS negation 0 PS_RISE_DELAY Ts T7 LCD_REV toggle delay from last LCD_D of line 1 REV_TOGGLE_DELAY+1 Ts Note: Falling of LCD_SPL/LCD_SPR aligns with first LCD_D of line. Note: Falling of LCD_PS aligns with rising edge of LCD_CLS. Note: LCD_REV toggles in every LCD_HSYN period. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 32 Freescale Semiconductor Electrical Characteristics T1 T1 LCD_VSYNC T3 T2 T4 XMAX T2 LCD_HSYNC LCD_LSCLK Ts LCD_D[15:0] Figure 21. Non-TFT Mode Panel Timing Table 22. Non-TFT Mode Panel Timing Num Characteristic Min Value Unit T1 LCD_HSYNC to LCD_VSYNC delay 2 HWAIT2 + 2 Tpix T2 LCD_HSYNC pulse width 1 HWIDTH + 1 Tpix T3 LCD_VSYNC to LCD_LSCLK — 0 ≤ T3 ≤ Ts — T4 LCD_LSCLK to LCD_HSYNC 1 HWAIT1 + 1 Tpix Note: Ts is the LCD_LSCLK period while Tpix is the pixel clock period. LCD_VSYNC, LCD_HSYNC, and LCD_LSCLK can be programmed as active high or active low. In Figure 21, all these 3 signals are active high. When it is in CSTN mode or monochrome mode with bus width = 1, T3 = Tpix = Ts. When it is in monochrome mode with bus width = 2, 4 and 8, T3 = 1, 2 and 4 Tpix respectively. 5.11 USB On-The-Go Specifications The MCF5227x device is compliant with industry standard USB 2.0 specification. Table 23. USB On-Chip Transceiver DC Characteristics Characteristic Condition Symbol Min Typ Max Unit Driven VIH 2.0 — — V VIL — — 0.8 V VID 200 — 00 mV Differential Common Mode Range VCM 0.8 — 2.5 V Single Ended Receive Threshold VSETHR 0.8 — 2.0 V Single Ended Receive Hysteresis VSEHYS — 400 — mV Input High Input Low Input Differential (DP – DM) Output High Driven VOH 0.0 — 300 mV Output Low Driven VOL 2.8 — 2.0 V DP = DM VCRS 1.3 — 2.0 V Differential Output Crossover MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 33 Electrical Characteristics Table 23. USB On-Chip Transceiver DC Characteristics (continued) Characteristic Condition Symbol Min Typ Max Unit P side Impedance Driven ZP 6.25 8.25 11.25 Ω M side Impedance Driven ZM 6.25 8.25 11.25 Ω ZMatching — 0.17 0.23 Ω RPD 30k 50k 70k Ω Impedance Matching P/M Pulldown Resistance1 1 The pulldown resistors are included to provide a method to keep DP and DM signals in a known quiescent state if desired when the USB port is not being used or when the USB cable is not connected. These on-chip resistors should not be used to provide the 15-kΩ host-mode pulldowns called for in Chapter 7 of the USB Specification, Rev. 1.1 or Rev. 2.0. Table 24. USB On-Chip Transceiver Full Speed AC Characteristics Characteristic Condition Symbol Min Typ Max Unit Rise Time 10–90% tLH 7 11 17.5 ns Fall Time 90–10% tHL 7 11 17.5 ns Rise/Fall Matching — t LH -------- Matching t HL 20 40 60 ps Rise/Fall Matching, DP and DM — t LH -------- Pad-to-Pad t HL 330 360 640 ps TIme Skew Between DP and DM — tSKE 100 140 210 ps Table 25. USB On-Chip Transceiver Low Speed AC Characteristics Characteristic Condition Symbol Min Typ Max Unit Rise Time 10–90% tLH 75 — 300 ns Fall Time 90–10% tHL 75 — 300 ns t LH -------t HL t LH -------- Matching t HL 80 — 125 % Rise/Fall Matching 5.12 SSI Timing Specifications This section provides the AC timings for the SSI in master (clocks driven) and slave modes (clocks input). All timings are given for non-inverted serial clock polarity (SSI_TCR[TSCKP] = 0, SSI_RCR[RSCKP] = 0) and a non-inverted frame sync (SSI_TCR[TFSI] = 0, SSI_RCR[RFSI] = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal (SSI_BCLK) and/or the frame sync (SSI_FS) shown in the figures below. Table 26. SSI Timing—Master Modes1 Num Characteristic S1 SSI_MCLK cycle time S2 SSI_MCLK pulse width high / low S3 SSI_BCLK cycle time S4 SSI_BCLK pulse width Symbol Min Max Unit Notes tMCLK 4 × 1/fSYS — ns 2 45% 55% tMCLK 4 × 1/fSYS — ns 45% 55% tBCLK tBCLK 3 MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 34 Freescale Semiconductor Electrical Characteristics Table 26. SSI Timing—Master Modes1 (continued) Num Characteristic Symbol Min Max Unit S5 SSI_BCLK to SSI_FS output valid — 10 ns S6 SSI_BCLK to SSI_FS output invalid 0 — ns S7 SSI_BCLK to SSI_TXD valid — 10 ns S8 SSI_BCLK to SSI_TXD invalid / high impedence 0 — ns S9 SSI_RXD / SSI_FS input setup before SSI_BCLK 10 — ns S10 SSI_RXD / SSI_FS input hold after SSI_BCLK 0 — ns Notes 1 All timings specified with a capactive load of 25pF. SSI_MCLK can be generated from SSI_CLKIN or a divided version of the internal system clock (SYSCLK). 3 SSI_BCLK can be derived from SSI_CLKIN or a divided version of SYSCLK. If the SYSCLK is used, the minimum divider is 6. If the SSI_CLKIN input is used, the programmable dividers must be set to ensure that SSI_BCLK does not exceed 4 x fSYS. 2 Table 27. SSI Timing—Slave Modes1 Num 1 Characteristic Symbol Min Max Unit tBCLK 4 × 1/fSYS — ns 45% 55% tBCLK S11 SSI_BCLK cycle time S12 SSI_BCLK pulse width high / low S13 SSI_FS input setup before SSI_BCLK 10 — ns S14 SSI_FS input hold after SSI_BCLK 2 — ns S15 SSI_BCLK to SSI_TXD / SSI_FS output valid — 10 ns S16 SSI_BCLK to SSI_TXD / SSI_FS output invalid / high impedence 0 — ns S17 SSI_RXD setup before SSI_BCLK 10 — ns S18 SSI_RXD hold after SSI_BCLK 2 — ns Notes All timings specified with a capactive load of 25 pF. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 35 Electrical Characteristics S1 S2 S2 SSI_MCLK (Output) S3 SSI_BCLK (Output) S4 S4 S5 S6 SSI_FS (Output) S9 S10 SSI_FS (Input) S7 S7 S8 S8 SSI_TXD S9 S10 SSI_RXD Figure 22. SSI Timing—Master Modes S11 SSI_BCLK (Input) S12 S12 S15 S16 SSI_FS (Output) S13 S14 SSI_FS (Input) S15 S16 S16 S15 SSI_TXD S17 S18 SSI_RXD Figure 23. SSI Timing—Slave Modes 5.13 I2C Timing Specifications Table 28 lists specifications for the I2C input timing parameters shown in Figure 24. Table 28. I2C Input Timing Specifications between SCL and SDA Num Characteristic Min Max Unit I1 Start condition hold time 2 — tcyc I2 Clock low period 8 — tcyc I3 I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V) — 1 ms I4 Data hold time 0 — ns MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 36 Freescale Semiconductor Electrical Characteristics Table 28. I2C Input Timing Specifications between SCL and SDA (continued) Num Characteristic Min Max Unit I5 I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V) — 1 ms I6 Clock high time 4 — tcyc I7 Data setup time 0 — ns I8 Start condition setup time (for repeated start condition only) 2 — tcyc I9 Stop condition setup time 2 — tcyc Min Max Unit Table 29 lists specifications for the I2C output timing parameters shown in Figure 24. Table 29. I2C Output Timing Specifications between SCL and SDA Num Characteristic I11 Start condition hold time 6 — tcyc I21 Clock low period 10 — tcyc I32 I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V) — — µs I41 Data hold time 7 — tcyc I53 I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V) — 3 ns I61 Clock high time 10 — tcyc I71 Data setup time 2 — tcyc I81 Start condition setup time (for repeated start condition only) 20 — tcyc I91 Stop condition setup time 10 — tcyc 1 Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Table 29. The I2C interface is designed to scale the actual data transition time to move it to the middle of the SCL low period. The actual position is affected by the prescale and division values programmed into the IFDR; however, the numbers given in Table 29 are minimum values. 2 Because I2C_SCL and I2C_SDA are open-collector-type outputs, which the processor can only actively drive low, the time I2C_SCL or I2C_SDA take to reach a high level depends on external signal capacitance and pull-up resistor values. 3 Specified at a nominal 50-pF load. Figure 24 shows timing for the values in Table 29 and Table 28. I5 I6 I2 I2C_SCL I1 I4 I7 I8 I3 I9 I2C_SDA Figure 24. I2C Input/Output Timings MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 37 Electrical Characteristics 5.14 DMA Timer Timing Specifications Table 30 lists timer module AC timings. Table 30. Timer Module AC Timing Specifications Num 5.15 Characteristic Min Max Unit T1 DT0IN / DT1IN / DT2IN / DT3IN cycle time 3 — tCYC T2 DT0IN / DT1IN / DT2IN / DT3IN pulse width 1 — tCYC DSPI Timing Specifications The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with both master and slave operations. Many of the transfer attributes are programmable. Table 31 provides DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the MCF52277 Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 31. DSPI Module AC Timing Specifications1 Num Characteristic Symbol Min Max Unit Notes 2 DS1 DSPI_SCK Cycle Time tSCK 4 x 1/fSYS — ns DS2 DSPI_SCK Duty Cycle — (tsck ÷ 2) – 2.0 (tsck ÷ 2) + 2.0 ns Master Mode DS3 DSPI_PCSn to DSPI_SCK delay tCSC (2 × 1/fSYS) – 2.0 — ns 3 DS4 DSPI_SCK to DSPI_PCSn delay tASC (2 × 1/fSYS) – 3.0 — ns 4 DS5 DSPI_SCK to DSPI_SOUT valid — — 5 ns DS6 DSPI_SCK to DSPI_SOUT invalid — –5 — ns DS7 DSPI_SIN to DSPI_SCK input setup — 9 — ns DS8 DSPI_SCK to DSPI_SIN input hold — 0 — ns Slave Mode DS9 DSPI_SCK to DSPI_SOUT valid — — 4 ns DS10 DSPI_SCK to DSPI_SOUT invalid — 0 — ns DS11 DSPI_SIN to DSPI_SCK input setup — 2 — ns DS12 DSPI_SCK to DSPI_SIN input hold — 7 — ns DS13 DSPI_SS active to DSPI_SOUT driven — — 20 ns DS14 DSPI_SS inactive to DSPI_SOUT not driven — — 18 ns 1 Timings shown are for DMCR[MTFE] = 0 (classic SPI) and DCTARn[CPHA] = 0. Data is sampled on the DSPI_SIN pin on the odd-numbered DSPI_SCK edges and driven on the DSPI_SOUT pin on even-numbered DSPI edges. 2 When in master mode, the baud rate is programmable in DCTARn[PBR] and DCTARn[BR]. 3 The DSPI_PCSn to DSPI_SCK delay is programmable in DCTARn[PCSSCK] and DCTARn[CSSCK]. 4 The DSPI_SCK to DSPI_PCSn delay is programmable in DCTARn[PASC] and DCTARn[ASC]. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 38 Freescale Semiconductor Electrical Characteristics DS3 DS4 DSPI_PCSn DS1 DS2 DSPI_SCK (DCTARn[CPOL] = 0) DS2 DSPI_SCK (DCTARn[CPOL] = 1) DS7 DS8 DSPI_SIN First Data Data DS6 DSPI_SOUT Last Data DS5 First Data Data Last Data Figure 25. DSPI Classic SPI Timing—Master Mode DSPI_SS DS1 DSPI_SCK (DCTARn[CPOL] = 0) DS2 DS2 DSPI_SCK (DCTARn[CPOL] = 1) DS13 DSPI_SOUT DS10 First Data DS11 DSPI_SIN DS9 Data Last Data Data Last Data DS14 DS12 First Data Figure 26. DSPI Classic SPI Timing—Slave Mode 5.16 SBF Timing Specifications The Serial Boot Facility (SBF) provides a means to read configuration information and system boot code from a broad array of SPI-compatible EEPROMs, flashes, FRAMs, nVSRAMs, etc. Table 32 provides the AC timing specifications for the SBF. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 39 Electrical Characteristics Table 32. SBF AC Timing Specifications Num 1 Characteristic Symbol Min Max Unit Notes tSBFCK 30 — ns 1 SB1 SBF_CK Cycle Time SB2 SBF_CK High/Low Time — 30% — tSBFCK SB3 SBF_CS to SBF_CK delay — tSBFCK – 2.0 — ns SB4 SBF_CK to SBF_CS delay — tSBFCK – 2.0 — ns SB5 SBF_CK to SBF_DO valid — — 12 ns SB6 SBF_CK to SBF_DO invalid — 0 — ns SB7 SBF_DI to SBF_SCK input setup — 6 — ns SB8 SBF_CK to SBF_DI input hold — 0 — ns At reset, the SBF_CK cycle time is tREF × 67. The first byte of data read from the serial memory contains a divider value that is used to set the SBF_CK cycle time for the duration of the serial boot process. SB1 SB2 SB4 SB2 SBF_CK SB3 SBF_CS SB7 SBF_DI SB8 First Data Data SB6 SBF_DO First Data Last Data SB5 Data Last Data Figure 27. SBF Timing 5.17 JTAG and Boundary Scan Timing Specifications Table 33. JTAG and Boundary Scan Timing Characteristic1 Num Symbol Min Max Unit J1 TCLK Frequency of Operation fJCYC DC 1/4 fsys/2 J2 TCLK Cycle Period tJCYC 4 — tCYC J3 TCLK Clock Pulse Width tJCW 26 — ns J4 TCLK Rise and Fall Times tJCRF 0 3 ns J5 Boundary Scan Input Data Setup Time to TCLK Rise tBSDST 4 — ns J6 Boundary Scan Input Data Hold Time after TCLK Rise tBSDHT 26 — ns J7 TCLK Low to Boundary Scan Output Data Valid tBSDV 0 33 ns J8 TCLK Low to Boundary Scan Output High Z tBSDZ 0 33 ns MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 40 Freescale Semiconductor Electrical Characteristics Table 33. JTAG and Boundary Scan Timing (continued) Characteristic1 Num 1 Symbol Min Max Unit J9 TMS, TDI Input Data Setup Time to TCLK Rise tTAPBST 4 — ns J10 TMS, TDI Input Data Hold Time after TCLK Rise tTAPBHT 10 — ns J11 TCLK Low to TDO Data Valid tTDODV 0 26 ns J12 TCLK Low to TDO High Z tTDODZ 0 8 ns J13 TRST Assert Time tTRSTAT 100 — ns J14 TRST Setup Time (Negation) to TCLK High tTRSTST 10 — ns JTAG_EN is expected to be a static signal. Hence, specific timing is not associated with it. J2 J3 VIH TCLK (input) J3 VIL J4 J4 Figure 28. Test Clock Input Timing TCLK VIL VIH J5 Data Inputs J6 Input Data Valid J7 Data Outputs Output Data Valid J8 Data Outputs J7 Data Outputs Output Data Valid Figure 29. Boundary Scan (JTAG) Timing MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 41 Electrical Characteristics TCLK VIL VIH J9 TDI TMS J10 Input Data Valid J11 TDO Output Data Valid J12 TDO J11 TDO Output Data Valid Figure 30. Test Access Port Timing TCLK J14 TRST J13 Figure 31. TRST Timing 5.18 Debug AC Timing Specifications Table 34 lists specifications for the debug AC timing parameters shown in Figure 32. Table 34. Debug AC Timing Specification Num 1 Characteristic Min Max Units D0 PSTCLK cycle time 1 1 1/fSYS D1 PSTCLK rising to PSTDDATA valid — 3.0 ns D2 PSTCLK rising to PSTDDATA invalid 1.5 — ns D3 DSI-to-DSCLK setup 1 — PSTCLK D41 DSCLK-to-DSO hold 4 — PSTCLK D5 DSCLK cycle time 5 — PSTCLK D6 BKPT assertion time 1 — PSTCLK DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to the rising edge of PSTCLK. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 42 Freescale Semiconductor Package Information D0 PSTCLK D2 D1 PSTDDATA[7:0] Figure 32. Real-Time Trace AC Timing D5 DSCLK D3 DSI Current Next D4 DSO Past Current Figure 33. BDM Serial Port AC Timing 6 Package Information The latest package outline drawings are available on the product summary pages on our web site: http://www.freescale.com/coldfire. The following table lists the case outline numbers per device. Use these numbers in the web page’s keyword search engine to find the latest package outline drawings. Table 35. Package Information 7 Device Package Type Mask Set Revision Case Outline Numbers MCF52274 176 LQFP All All 98ASS23479W M26H 1.1 98ASH98061A MCF52277 196 MAPBGA 2M26H, 3M26H 1.2–1.3 98ARH98390A Product Documentation Documentation is available from a local Freescale distributor, a Freescale sales office, the Freescale Literature Distribution Center, or through the Freescale world-wide web address at http://www.freescale.com/coldfire. MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 43 Revision History 8 Revision History Table 36 summarizes revisions to this document. f Table 36. MCF52277 Data Sheet Revision History Rev. No. Date of Release Summary of Changes 3 02/2008 Initial public revision. 4 05/2008 Corrected MCF52274 order number from MCF52274CAB120 to MCF52274CLU120 in Table 2 5 07/2008 Corrected MCF52277CVM166 part number to MCF52277CVM160 in Table 2. Although, this device has a maximum rated frequency of 166.67 MHz. 6 07/2008 Added data to Section 3.5, “Power Consumption Specifications.” 7 02/2009 Changed document type from Data Sheet: Advance Information to Data Sheet: Technical Data and corresponding footnote on first page Replaced tSYS with 1/fSYS throughout Changed the following specs in Table 14 and Table 15: • Minimum frequency of operation from TBD to 60MHz • Maximum clock period from TBD to 16.67 ns Added RTC and Oscillator Supply Voltage specs to Table 7 and Table 10 In Table 8: • Updated thermal characteristics for the 196 MAPBGA package • Added thermal characteristics for the 176 LQFP package that were TBD In Table 11: • Corrected maximum crystal reference frequency range from 66.67 to 25 MHz • Added footnotes to maximum crystal and external reference frequency ranges • Changed minimum core/system and CLKOUT frequencies from TBD to 512 and 256 Hz, respectively. In Table 12: • Added Typical column • Removed Internal Reference Voltage spec as it isn’t necessary • Moved Current Consumption specs from maximum column to typical column • Added INL and DNL specs that were TBD, and changed the unit footnote • Replaced Gain and Offset Error specs with Full-Scale and Zero-Scale Error • Removed Input Leakage Current and Input Current specs as they aren’t necessary Removed Gain Calculations section as it isn’t necessary 8 09/2009 Iin Table 35, added case outline number for MCF52277 masks 2M26H and 3M26H MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 44 Freescale Semiconductor Revision History MCF5227x ColdFire® Microprocessor Data Sheet, Rev. 8 Freescale Semiconductor 45 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor[email protected] Document Number: MCF52277 Rev. 8 09/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics as their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved.