Data Sheet

PCA8886
Dual channel capacitive proximity switch with
auto-calibration and large voltage operating range
Rev. 3 — 14 March 2014
Product data sheet
1. General description
The PCA8886 is a low power dual channel capacitive proximity switch that uses a
patented (EDISEN) digital method to detect a change in capacitance on remote sensing
plates. Changes in the static capacitance (as opposed to dynamic capacitance changes)
are automatically compensated using continuous auto-calibration. Remote sensing plates
(for example, conductive foil) can be connected directly to the IC1 or remotely using a
coaxial cable.
2. Features and benefits














Dynamic proximity switch
Digital processing method
Automatic calibration
Adjustable sensitivity, can be made very high
Adjustable response time
Wide input capacitance range (10 pF to 60 pF)
A large distance (several meters) between the sensing plate and the IC is possible
Open-drain output (P-type MOSFET, external load between pin and ground)
Output configurable as push-button, toggle, or pulse
Wide voltage operating range (VDD = 3 V to 9 V)
Designed for battery powered applications (IDD = 6 A, typical)
Large temperature operating range (Tamb = 40 C to +85 C)
AEC-Q100 compliant for automotive applications
Available in TSSOP16
3. Applications
 Proximity detection
 Proximity sensing in
 Door locks and grips
 Portable entertainment units
 Computing tablets
 Switch for medical applications
 Dashboard: switch to toggle menus and resetting trip counter
 Switch for use in explosive environments
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration





Vandal proof switches
Transportation: Switches in or under upholstery, leather, handles, mats, and glass
Buildings: switch in or under carpets, glass, or tiles
Sanitary applications: use of standard metal sanitary parts (for example, tap) as switch
Hermetically sealed keys on a keyboard
4. Ordering information
Table 1.
Ordering information
Type number
Package
PCA8886TS
Name
Description
Version
TSSOP16
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
PCA8886
4.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCA8886TS/Q900/1
PCA8886TS/Q900/1,1
tape and reel, 13 inch
1
935297325118
5. Marking
Table 3.
PCA8886
Product data sheet
Marking codes
Product type number
Marking code
PCA8886TS/Q900/1
PCA8886
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
6. Block diagram
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The PCA8886 integrates two identical capacitive proximity switches which can be configured
separately.
Fig 1.
PCA8886
Product data sheet
Block diagram of PCA8886
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
7. Pinning information
7.1 Pinning
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Top view. For mechanical details, see Figure 16.
Fig 2.
Pin configuration of PCA8886TS (TSSOP16)
7.2 Pin description
Table 4.
Pin description
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Symbol
Pin
Type
Description
TSSOP16
(PCA8886TS)
IN1
1
analog input/output
sensor input 1
TYPE1
2
input
select output configuration of pin OUT1
CPC1
3
analog input/output
sensitivity setting 1
VSS1
4
supply
ground supply voltage 1
IN2
5
analog input/output
sensor input 2
TYPE2
6
input
select output configuration of pin OUT2
CPC2
7
analog input/output
sensitivity setting 2
VSS2
8
supply
ground supply voltage 2
VDD2
9
supply
supply voltage 2
OUT2
10
output
switch output 2
CLIN2
11
analog input/output
sampling rate setting 2
VDD(INTREGD)2[1]
12
supply
internal regulated supply voltage
output 2
VDD1
13
supply
supply voltage 1
OUT1
14
output
switch output 1
CLIN1
15
analog input/output
sampling rate setting 1
VDD(INTREGD)1[1]
16
supply
internal regulated supply voltage
output 1
[1]
PCA8886
Product data sheet
The internal regulated supply voltage outputs must be decoupled with a decoupling capacitor to VSS[1:2].
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
8. Functional description
Figure 3 and Figure 4 show the functional principle of one channel of the PCA8886.
The discharge time (tdch) of a chip-internal RC timing circuit, to which the external sensing
plates are connected via pins IN[1:2], is compared to the discharge time (tdch(ref)) of a
second chip-internal reference RC timing circuit. Both RC timing circuits are periodically
charged from VDD(INTREGD)[1:2] via identical switches and then discharged via a resistor to
ground (VSS). Both switches are synchronized.
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Fig 3.
Functional diagram of the sensor logic (one channel)
The charge-discharge cycle is governed by the sampling rate (fs). If the voltage of one of
the RC timing circuits falls below the internal reference voltage Vref, the respective
comparator output becomes LOW. The logic following the comparators determines which
comparator switches first. If the upper (reference) comparator switches, then a pulse is
given on CUP. If the lower (input) comparator switches first, then a pulse is given on CDN
(see Figure 3).
The pulses control the charge on the external capacitor CCPC on pins CPC[1:2]. Every
time a pulse is given on CUP, capacitor CCPC is charged from VDD(INTREGD) for a fixed time
causing the voltage on CCPC to rise. Likewise when a pulse occurs on CDN, capacitor
CCPC is connected to a current sink to ground for a fixed time causing the voltage on CCPC
to fall.
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
If the capacitance on pins IN[1:2] increases, the discharge time tdch increases too.
Therefore it takes longer for the voltage on the corresponding comparator to drop below
Vref. Only once this happens, the comparator output becomes LOW and this results in a
pulse on CDN discharging the external capacitor CCPC slightly. Thus most pulses will now
be given by CUP. Without further action, capacitor CCPC would then fully charge.
However, a chip-internal automatic calibration mechanism that is based on a voltage
controlled sink current (Isink) connected to pins IN[1:2] attempts to equalize the discharge
time tdch with the internal reference discharge time tdch(ref). The current source is
controlled by the voltage on CCPC which causes the capacitance on pins IN[1:2] to be
discharged more quickly in the case that the voltage on CCPC is rising, thereby
compensating for the increase in capacitance on input pins IN[1:2]. This arrangement
constitutes a closed-loop control system that constantly attempts to equalize the
discharge time tdch with tdch(ref). This allows compensating for slow changes in
capacitance on input pins IN[1:2]. Fast changes due to an approaching hand for example
will not be compensated. In the equilibrium state, the discharge times are equal and the
pulses alternate between CUP and CDN.
From this also follows, that an increase in capacitor value CCPC results in a smaller
voltage change per pulse CUP or CDN. Thus the compensation due to internal current
sink source Isink is slower and therefore the sensitivity of the sensor increases. Likewise a
decrease in capacitor CCPC results in a lower sensitivity. (For further information see
Section 14.)
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CSENS = sensing plate capacitance.
CCABLE = cable capacitance.
RC = external pull-down resistor.
RF = low pass filter resistor.
CF = low pass filter capacitor.
Fig 4.
Functional principle of one channel of the PCA8886
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
The counter, following the sensor logic depicted in Figure 3, counts the pulses of CUP or
CDN respectively. The counter is reset every time the pulse sequence changes from CUP
to CDN or the other way around. Pins OUT[1:2] will only be activated when enough
consecutive CUP or CDN pulses occur. Low-level interference or slow changes in the
input capacitance do not cause the output to switch.
Various measures, such as asymmetrical charge and discharge steps, are taken to
ensure that the output switches off correctly. A special start-up circuit ensures that the
device reaches equilibrium quickly when the supply is attached.
Pins OUT[1:2] are open-drain outputs capable of pulling an external load Rext
(at maximum current of 20 mA) up to VDD. The load resistor must be dimensioned
appropriately, taking the maximum expected VDD voltage into account. The output will be
automatically deactivated (short circuit protection) for loads in excess of 30 mA. Pins
OUT[1:2] can also drive CMOS inputs without connection of the external load.
A small internal 150 nA current sink Isink enables a full voltage swing to take place on pins
OUT[1:2], even if no load resistor is connected. This is useful for driving purely capacitive
CMOS inputs. The falling slope can be fairly slow in this mode, depending on load
capacitance.
The sampling rate (fs) corresponds to half of the frequency used in the RC timing circuit.
The sampling rate can be adjusted within a specified range by selecting the value of
CCLIN. The oscillator frequency is internally modulated by 4 % using a pseudo random
signal. This prevents interference caused by local AC-fields.
8.1 Output switching modes
The output switching behavior can be selected using pins TYPE[1:2] (see Figure 5)
• Push-button (TYPE[1:2] connected to VSS[1:2]): The output OUT is active as long as
the capacitive event2 lasts.
• Toggle (TYPE[1:2] connected to VDD(INTREGD)[1:2]): The output OUT is activated by the
first capacitive event and deactivated by a following capacitive event.
• Pulse (CTYPE connected between TYPE[1:2] and VSS[1:2]): The output OUT is
activated for a defined time at each capacitive event. The pulse duration is
determined by the value of CTYPE and is approximately 2.5 ms/nF.
A typical value for CTYPE is 4.7 nF which results in an output pulse duration of about
10 ms. The maximum value of CTYPE is 470 nF which results in a pulse duration of
about 1 s. Capacitive events are ignored that occur during the time the output is active.
Figure 5 illustrates the switching behavior for the output switching modes. Additionally the
graph illustrates, that short-term disturbances on the sensor are suppressed by the circuit.
2.
A capacitive event is a dynamic increase of capacitance at the sensor input pins IN[1:2].
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
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Fig 5.
Switching modes timing diagram of PCA8886
8.2 Voltage regulator
The PCA8886 implements a chip-internal voltage regulator supplied by pins VDD[1:2] that
provides an internal supply (VDD(INTREGD)), limited to a maximum of 4.6 V. Figure 6 shows
the relationship between VDD[1:2] and VDD(INTREGD)[1:2].
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Integrated voltage regulator
9. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
10. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
VI
input voltage
IO
output current
ISS
ground supply current
II
input current
Ptot
total power dissipation
VESD
electrostatic discharge
voltage
Conditions
Min
Max
Unit
0.5
+9
V
on pins IN[1:2], TYPE[1:2],
CPC[1:2]
0.5
VDD(INTREGD) + 0.5
V
on pins OUT[1:2]
10
+50
mA
10
+50
mA
on any other pin
10
+10
mA
-
100
mW
HBM
[1]
-
2500
V
CDM
[2]
-
1000
V
-
100
mA
60
+125
C
40
+85
C
Ilu
latch-up current
[3]
Tstg
storage temperature
[4]
Tamb
ambient temperature
operating device
[1]
Pass level; Human Body Model (HBM) according to Ref. 7 “JESD22-A114”.
[2]
Pass level; Charged-Device Model (CDM), according to Ref. 8 “JESD22-C101”.
[3]
Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max) = +85 C).
[4]
According to the store and transport requirements (see Ref. 12 “UM10569”) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
11. Static characteristics
Table 6.
Static characteristics
VDD = 5 V, Tamb = +25 C; unless otherwise specified.
Symbol
Parameter
Conditions
[1]
VDD
supply voltage
VDD(INTREGD)
internal regulated supply voltage
VDD(INTREGD) internal regulated supply voltage regulator voltage drop
variation
IDD
supply current
Min
Typ
Max
Unit
3.0
-
9.0
V
3.0
4.0
4.6
V
-
10
50
mV
idle state;
fs = 1 kHz
[2]
-
6
10
A
idle state;
fs = 1 kHz;
VDD = 3.0 V
[2]
-
4.4
7
A
Isink
sink current
internal constant current
to VSS[1:2]
-
150
-
nA
VO
output voltage
on pins OUT[1:2];
pull-up voltage
0
VDD
9.0
V
IO
output current
P-MOS
Vsat
saturation voltage
[3]
0
10
20
mA
short circuit protection
VO  0.6 V
20
30
50
mA
on pins OUT[1:2];
IO = +10 mA
0.1
0.2
0.4
V
on pins OUT[1:2];
IO = +10 mA;
VDD = 3.0 V
0.1
0.3
0.5
V
nF
Cdec
decoupling capacitance
on pins VDD(INTREGD)[1:2]
VI
input voltage
on pins CPC[1:2]
[4]
100
-
220
0.6
-
VDD(INTREGD)  0.5 V
[1]
When the input capacitance range is limited to 10 pF  Ci  40 pF or an external pull-down resistor RC is used, the device can be
operated down to VDD = 3.0 V over the full temperature range.
[2]
Idle state is the steady state after completed power-on without any activity on the sensor plate and the voltage on the reservoir capacitor
CCPC settled.
[3]
For reliability reasons, the average output current must be limited to 4.6 mA at 70 C and 3.0 mA at 85 C.
[4]
External ceramic chip capacitor recommended (see Figure 15).
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
12. Dynamic characteristics
Table 7.
Dynamic characteristics
VDD = 5 V, CCLIN = 22 pF, CCPC = 470 nF, Tamb = +25 C; unless otherwise specified.
Symbol
Parameter
Conditions
CCLIN
capacitance on pin CLIN
CCPC
capacitance on pin CPC
Min
Typ
Max
Unit
0
22
100
pF
90
470
2500
nF
-
14
-
bit
0.1
-
470
nF
sensing plate and connecting cable
10
-
60
pF
sensing plate and connecting cable;
Tamb = 40 C to +85 C;
VDD = 3.0 V
10
-
40
pF
X7R ceramic chip capacitor
Nres(dig)eq equivalent digital resolution
CTYPE
capacitance on pin TYPE
Ci
input capacitance
tstartup
start-up time
until normal operation is established
-
0.5
-
s
tp
pulse duration
on pins OUT[1:2];
in pulse mode;
CTYPE  10 nF
-
2.5
-
ms/nF
fs
sampling frequency
CCLIN = 0 pF
-
3.3
-
kHz
tsw
switching time
CCLIN = 22 pF (typical value)
-
1
-
kHz
CCLIN = 100 pF
-
275
-
Hz
at fs = 1 kHz
-
64
-
ms
13. Characteristic curves
13.1 Power consumption
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Fig 7.
PCA8886
Product data sheet
IDD with respect to VDD
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
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Fig 8.
IDD with respect to temperature
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Fig 9.
PCA8886
Product data sheet
IDD with respect to sampling frequency (fs)
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
13.2 Typical reaction time
DDN
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Fig 10. Switching time (tsw) with respect to sampling frequency (fs)
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VDD = 6 V; Tamb = 25 C.
Fig 11. Switching time (tsw) with respect to capacitor (CCLIN) on pins CLIN[1:2]
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
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Fig 12. Switching time (tsw) with respect to temperature
13.3 Reservoir capacitor voltage
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VI(CPC) = input voltage on pins CPC[1:2].
CIN = capacitor on pins IN[1:2].
Fig 13. Input voltage on pins CPC[1:2] (VI(CPC)) with respect to capacitor (CIN) on
pins IN[1:2]
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
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VI(CPC) = input voltage on pins CPC[1:2]
Fig 14. Input voltage (VI(CPC)) on pins CPC[1:2] with respect to temperature
14. Application information
Figure 15 shows the typical connections for a general application3. The positive supply is
connected to pins VDD[1:2]. It is recommended to connect smoothing capacitors to ground
to both VDD[1:2] and VDD(INTREGD)[1:2] (values for Cdec, see Table 6).
3.
For further information, see Ref. 2 “AN10832”. Information about the appropriate evaluation board can be found in Ref. 11
“UM10505”.
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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15 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
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CSENS = sensing plate capacitance.
The coaxial cable is optional.
Fig 15. Typical application
The sampling rate is determined by the capacitance CCLIN on pins CLIN[1:2]. A higher
sampling rate reduces the reaction time and increases the current consumption.
The sensing plate capacitance CSENS may consist of a small metal area, for example
behind an isolating layer. The sensing plate can be connected to a coaxial cable (CCABLE)
which in turn is connected to the input pins IN[1:2]. Alternatively, the sensing plate can be
directly connected to the input pins IN[1:2]. An internal low pass filter is used to reduce RF
interference. An additional low pass filter consisting of a resistor RF and capacitor CF can
be added to the input to further improve RF immunity as required. For good performance,
the total amount of capacitance on the input (CSENS + CCABLE + CF) should be in the
proper range, the optimum point being around 30 pF. These conditions allow the control
loop to adapt to the static capacitance on CSENS and to compensate for slow changes in
the sensing plate capacitance. A higher capacitive input loading is possible if an additional
discharge resistor RC is placed as shown in Figure 15. Resistor RC simply reduces the
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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PCA8886
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Dual channel capacitive proximity switch with auto-calibration
discharge time such that the internal timing requirements are fulfilled.
The sensitivity of the sensor can be influenced by the sensing plate area and capacitor
CCPC. The sensitivity is significantly reduced when CCPC is reduced. When maximum
sensitivity is desired CCPC can be increased, but this also increases sensitivity to
interference. Pins CPC[1:2] has high-impedance and is sensitive to leakage currents.
Remark: CCPC should be a high-quality foil or ceramic capacitor, for example an
X7R type.
For the choice of proper component values for a given application, the component
specifications in Table 6 and Table 7 must be followed.
15. Test information
15.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
PCA8886
Product data sheet
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Rev. 3 — 14 March 2014
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Dual channel capacitive proximity switch with auto-calibration
16. Package outline
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H[SRVHG
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'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV
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,VVXHGDWH
Fig 16. Package outline of PCA8886TS (TSSOP16)
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
18 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
18. Packing information
18.1 Tape and reel information
7239,(:
‘'
3
:
%
3
$
‘'
.
GLUHFWLRQRIIHHG
2ULJLQDOGLPHQVLRQVDUHLQPP
)LJXUHQRWGUDZQWRVFDOH
DDD
Fig 17. Carrier tape details for PCA8886
Table 8.
Carrier tape dimensions of PCA8886
Symbol
Description
Value
Unit
A0
pocket width in x direction
6.9
mm
B0
pocket width in y direction
5.6
mm
K0
pocket depth
1.5 to 1.6
mm
P1
pocket hole pitch
8
mm
D1
pocket hole diameter
1.5 to 1.6
mm
Compartments
Overall dimensions
PCA8886
Product data sheet
W
tape width
12
mm
D0
sprocket hole diameter
1.5 to 1.55
mm
P0
sprocket hole pitch
4
mm
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
20 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
19. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
19.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
19.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
19.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
21 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
19.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 10.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18.
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
22 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
20. Abbreviations
Table 11.
PCA8886
Product data sheet
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
HBM
Human Body Model
IC
Integrated Circuit
MM
Machine Model
MOS
Metal Oxide Semiconductor
MOSFET
Metal–Oxide–Semiconductor Field-Effect Transistor
MSL
Moisture Sensitivity Level
PCB
Printed-Circuit Board
RC
Resistance-Capacitance
RF
Radio Frequency
SMD
Surface Mount Device
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
23 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
21. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10832 — PCF8883 - capacitive proximity switch with auto-calibration
[3]
AN11122 — Water and condensation safe touch sensing with the NXP
capacitive touch sensors
[4]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[5]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[6]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[7]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[8]
JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[9]
JESD78 — IC Latch-Up Test
[10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[11] UM10505 — OM11057 quick start guide
[12] UM10569 — Store and transport requirements
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
24 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
22. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA8886 v.3
20140314
Product data sheet
-
PCA8886 v.2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Emphasized the X7R statement (Section 14)
Added Section 9
Added Input or input/output statement in Table 4
Enhanced ordering information in Table 2
Corrected Figure 6
PCA8886 v.2
20120920
Product data sheet
-
PCA8886 v.1
PCA8886 v.1
20111123
Objective data sheet
-
-
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
25 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
23.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
23.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCA8886
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
26 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
23.4 Licenses
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
This NXP Semiconductors IC is made under license to European Patent
No. 0723339, owned by EDISEN - SENSOR SYSTEME GmbH & CO KG
and counterparts. Any license fee is included in the purchase price.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
23.5 Trademarks
ICs with capacitive sensing functionality
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
27 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
25. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9
Static characteristics . . . . . . . . . . . . . . . . . . . .10
Dynamic characteristics . . . . . . . . . . . . . . . . . . 11
Carrier tape dimensions of PCA8886 . . . . . . .20
SnPb eutectic process (from J-STD-020D) . . .22
Lead-free process (from J-STD-020D) . . . . . .22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .23
Revision history . . . . . . . . . . . . . . . . . . . . . . . .25
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
28 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
26. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Block diagram of PCA8886 . . . . . . . . . . . . . . . . . .3
Pin configuration of PCA8886TS (TSSOP16) . . . .4
Functional diagram of the sensor logic (one
channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Functional principle of one channel
of the PCA8886 . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Switching modes timing diagram of PCA8886. . . .8
Integrated voltage regulator . . . . . . . . . . . . . . . . . .8
IDD with respect to VDD . . . . . . . . . . . . . . . . . . . . 11
IDD with respect to temperature . . . . . . . . . . . . . .12
IDD with respect to sampling frequency (fs) . . . . .12
Switching time (tsw) with respect to sampling
frequency (fs) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Switching time (tsw) with respect to capacitor
(CCLIN) on pins CLIN[1:2] . . . . . . . . . . . . . . . . . .13
Switching time (tsw) with respect to temperature .14
Input voltage on pins CPC[1:2] (VI(CPC))
with respect to capacitor (CIN) on pins IN[1:2] . .14
Input voltage (VI(CPC)) on pins CPC[1:2]
with respect to temperature . . . . . . . . . . . . . . . . .15
Typical application . . . . . . . . . . . . . . . . . . . . . . . .16
Package outline of PCA8886TS (TSSOP16). . . .18
Carrier tape details for PCA8886 . . . . . . . . . . . . .20
Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
PCA8886
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
29 of 30
PCA8886
NXP Semiconductors
Dual channel capacitive proximity switch with auto-calibration
27. Contents
1
2
3
4
4.1
5
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
13
13.1
13.2
13.3
14
15
15.1
16
17
18
18.1
19
19.1
19.2
19.3
19.4
20
21
22
23
23.1
23.2
23.3
23.4
23.5
24
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Output switching modes . . . . . . . . . . . . . . . . . . 7
Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 8
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Static characteristics. . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Characteristic curves . . . . . . . . . . . . . . . . . . . 11
Power consumption . . . . . . . . . . . . . . . . . . . . 11
Typical reaction time . . . . . . . . . . . . . . . . . . . . 13
Reservoir capacitor voltage . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Quality information . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 19
Packing information . . . . . . . . . . . . . . . . . . . . 20
Tape and reel information . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Contact information. . . . . . . . . . . . . . . . . . . . . 27
25
26
27
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 March 2014
Document identifier: PCA8886
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