Not recommended for new designs – Please use 25AA040A or 25LC040A. 25AA040/25LC040/25C040 4K SPI Bus Serial EEPROM Max. Clock Frequency Temp. Ranges 25AA040 1.8-5.5V 1 MHz I 25LC040 2.5-5.5V 2 MHz I 25C040 4.5-5.5V 3 MHz I,E Package Types PDIP Features: • Low-power CMOS technology: - Write current: 3 mA, typical - Read current: 500 μA, typical - Standby current: 500 nA, typical • 512 x 8-bit organization • 16 byte page • Write cycle time: 5 ms max. • Self-timed Erase and Write cycles • Block write protection: - Protect none, 1/4, 1/2 or all of array • Built-in write protection: - Power on/off data protection circuitry - Write enable latch - Write-protect pin • Sequential read • High reliability: - Endurance: 1M cycles - Data retention: > 200 years - ESD protection: > 4000V • 8-pin PDIP, SOIC and TSSOP packages • Temperature ranges supported: - Industrial (I): -40°C to +85°C - Automotive (E) (25C040): -40°C to +125°C SOIC 1 8 VCC SO 2 7 HOLD WP 3 6 SCK VSS 4 5 SI CS 1 8 VCC 7 HOLD 6 SCK 5 SI SO 2 WP 3 VSS 4 TSSOP HOLD 1 VCC 2 CS 3 SO 4 © 2006 Microchip Technology Inc. SCK 7 SI 6 VSS 5 WP STATUS Register I/O Control Logic HV Generator Memory Control Logic EEPROM Array XDEC Page Latches SI SO Y Decoder CS SCK Sense Amp. R/W Control HOLD WP *25XX040 is used in this document as a generic part number for the 25AA040/25LC040/25C040 devices. 8 Block Diagram Description: The Microchip Technology Inc. 25AA040/25LC040/ 25C040 (25XX040*) is a 4 Kbit serial Electrically Erasable PROM. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input. CS 25XX040 VCC Range 25XX040 Part Number Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. Also, write operations to the device can be disabled via the write-protect pin (WP). 25XX040 Device Selection Table VCC VSS DS21204E-page 1 25AA040/25LC040/25C040 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS .......................................................................................................... -0.6V to VCC+1.0V Storage temperature .................................................................................................................................-65°C to 150°C Ambient temperature under bias ...............................................................................................................-65°C to 125°C ESD protection on all pins ......................................................................................................................................... 4 KV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability TABLE 1-1: DC CHARACTERISTICS DC CHARACTERISTICS Param. No. Sym. Characteristic Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Automotive (E): TA = -40°C to +125°C VCC = 4.5V to 5.5V (25C040 only) Min. Max. Units Test Conditions 2.0 VCC+1 V VCC ≥ 2.7V (Note) 0.7 VCC VCC+1 V VCC< 2.7V (Note) -0.3 0.8 V VCC ≥ 2.7V (Note) -0.3 0.3 VCC V VCC < 2.7V (Note) Low-level output voltage — 0.4 V IOL = 2.1 mA — 0.2 V IOL = 1.0 mA, VCC < 2.5V VOH High-level output voltage VCC -0.5 — V IOH =-400 μA D008 ILI Input leakage current — ±1 μA CS = VCC, VIN = VSS TO VCC D009 ILO Output leakage current — ±1 μA CS = VCC, VOUT = VSS TO VCC D010 CINT Internal Capacitance (all inputs and outputs) — 7 pF TA = 25°C, CLK = 1.0 MHz, VCC = 5.0V (Note) D011 ICC Read Operating Current — — 1 500 mA μA VCC = 5.5V; FCLK = 3.0 MHz; SO = Open VCC = 2.5V; FCLK = 2.0 MHz; SO = Open D012 ICC Write — — 5 3 mA mA VCC = 5.5V VCC = 2.5V D013 ICCS — — 5 1 μA μA CS = VCC = 5.5V, Inputs tied to VCC or VSS CS = VCC = 2.5V, Inputs tied to VCC or VSS D001 VIH1 D002 VIH2 D003 VIL1 D004 VIL2 D005 VOL D006 VOL D007 Note: High-level input voltage Low-level input voltage Standby Current This parameter is periodically sampled and not 100% tested. DS21204E-page 2 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param No. Sym. Characteristic Industrial (I): Automotive (E): TA = -40°C to +85°C TA = -40°C to +125°C VCC = 1.8V to 5.5V VCC = 4.5V to 5.5V (25C040 only) Min. Max. Units Test Conditions — — — 3 2 1 MHz MHz MHz VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 1 FCLK Clock Frequency 2 TCSS CS Setup Time 100 250 500 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 3 TCSH CS Hold Time 150 250 475 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 4 TCSD CS Disable Time 500 — ns — 5 TSU Data Setup Time 30 50 50 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 6 THD Data Hold Time 50 100 100 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V (Note 1) 7 TR CLK Rise Time — 2 μs 8 TF CLK Fall Time — 2 μs (Note 1) 9 THI Clock High Time 150 230 475 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 10 TLO Clock Low Time 150 230 475 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 11 TCLD Clock Delay Time 50 — ns — 12 TCLE Clock Enable Time 50 — ns — 13 TV Output Valid from Clock Low — — — 150 230 475 ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 14 THO Output Hold Time 0 — ns (Note 1) 15 TDIS Output Disable Time — — — 200 250 500 ns ns ns VCC = 4.5V to 5.5V (Note 1) VCC = 2.5V to 4.5V (Note 1) VCC = 1.8V to 2.5V (Note 1) 16 THS HOLD Setup Time 100 100 200 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 17 THH HOLD Hold Time 100 100 200 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V 18 THZ HOLD Low to Output High-Z 100 150 200 — — — ns ns ns VCC = 4.5V to 5.5V (Note 1) VCC = 2.5V to 4.5V (Note 1) VCC = 1.8V to 2.5V (Note 1) 19 THV HOLD High to Output Valid 100 150 200 — — — ns ns ns VCC = 4.5V to 5.5V VCC = 2.5V to 4.5V VCC = 1.8V to 2.5V — 20 TWC Internal Write Cycle Time — 5 ms 21 — Endurance 1M — E/W Cycles Note 1: 2: (Note 2) This parameter is periodically sampled and not 100% tested. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from our web site: www.microchip.com. © 2006 Microchip Technology Inc. DS21204E-page 3 25AA040/25LC040/25C040 FIGURE 1-1: HOLD TIMING CS 17 16 17 16 SCK 18 SO n+2 SI n+2 n+1 n 19 High-impedance n 5 Don’t Care n+1 n-1 n n n-1 HOLD FIGURE 1-2: SERIAL INPUT TIMING 4 CS 2 7 Mode 1,1 12 11 8 3 SCK Mode 0,0 5 SI 6 MSB in LSB in High-impedance SO FIGURE 1-3: SERIAL OUTPUT TIMING CS 9 3 10 Mode 1,1 SCK Mode 0,0 13 14 SO SI DS21204E-page 4 MSB out 15 ISB out Don’t Care © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 TABLE 1-3: AC TEST CONDITIONS FIGURE 1-4: AC Waveform: AC TEST CIRCUIT AC VCC VLO = 0.2V — VHI = VCC - 0.2V (Note 1) VHI = 4.0V (Note 2) Timing Measurement Reference Level 2.25 KΩ SO Input 0.5 VCC Output 0.5 VCC 1.8 KΩ 100 pF Note 1: For VCC ≤ 4.0V 2: For VCC > 4.0V © 2006 Microchip Technology Inc. DS21204E-page 5 25AA040/25LC040/25C040 2.0 PIN DESCRIPTIONS 2.4 PIN FUNCTION TABLE The SI pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the serial clock. 2.5 The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Name PDIP SOIC TSSOP CS 1 1 3 Chip Select Input Description SO 2 2 4 Serial Data Output WP 3 3 5 Write-Protect Pin VSS 4 4 6 Ground SI 5 5 7 Serial Data Input SCK 6 6 8 Serial Clock Input HOLD 7 7 1 Hold Input VCC 8 8 2 Supply Voltage 2.1 Chip Select (CS) A low level on this pin selects the device. A high level deselects the device and forces it into Standby mode. However, a programming cycle which is already initiated or in progress will be completed, regardless of the CS input signal. If CS is brought high during a program cycle, the device will go in Standby mode as soon as the programming cycle is complete. When the device is deselected, SO goes into the high-impedance state, allowing multiple parts to share the same SPI bus. A low-to-high transition on CS after a valid write sequence initiates an internal write cycle. After powerup, a low level on CS is required prior to any sequence being initiated. 2.2 Serial Input (SI) Serial Clock (SCK) The SCK is used to synchronize the communication between a master and the 25XX040. Instructions, addresses or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin is updated after the falling edge of the clock input. 2.6 Hold (HOLD) The HOLD pin is used to suspend transmission to the 25XX040 while in the middle of a serial sequence without having to retransmit the entire sequence again at a later time. It must be held high any time this function is not being used. Once the device is selected and a serial sequence is underway, the HOLD pin may be pulled low to pause further serial communication without resetting the serial sequence. The HOLD pin must be brought low while SCK is low, otherwise the HOLD function will not be invoked until the next SCK high-to-low transition. The 25XX040 must remain selected during this sequence. The SI, SCK and SO pins are in a high-impedance state during the time the part is paused and transitions on these pins will be ignored. To resume serial communication, HOLD must be brought high while the SCK pin is low, otherwise serial communication will not resume. Lowering the HOLD line at any time will tri-state the SO line. Serial Output (SO) The SO pin is used to transfer data out of the 25XX040. During a read cycle, data is shifted out on this pin after the falling edge of the serial clock. 2.3 Write-Protect (WP) This pin is a hardware write-protect input pin. When WP is low, all writes to the array or STATUS register are disabled, but any other operation functions normally. When WP is high, all functions, including nonvolatile writes operate normally. WP going low at any time will reset the write enable latch and inhibit programming, except when an internal write has already begun. If an internal write cycle has already begun, WP going low will have no effect on the write. See Table 3-3 for Write-Protect Functionality Matrix. DS21204E-page 6 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 3.0 FUNCTIONAL DESCRIPTION 3.1 Principles of Operation 3.3 The 25XX040 is a 512 byte Serial EEPROM designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today’s popular microcontroller families, including Microchip’s PIC16C6X/7X microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using discrete I/O lines programmed properly with the software. The 25XX040 contains an 8-bit instruction register. The part is accessed via the SI pin, with data being clocked in on the rising edge of SCK. The CS pin must be low and the HOLD pin must be high for the entire operation. The WP pin must be held high to allow writing to the memory array. Table 3-1 contains a list of the possible instruction bytes and format for device operation. The Most Significant address bit (A8) is located in the instruction byte. All instructions, addresses, and data are transferred MSB first, LSB last. Data is sampled on the first rising edge of SCK after CS goes low. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input and place the 25XX040 in ‘HOLD’ mode. After releasing the HOLD pin, operation will resume from the point when the HOLD was asserted. 3.2 Read Sequence The part is selected by pulling CS low. The 8-bit READ instruction with the A8 address bit is transmitted to the 25XX040 followed by the lower 8-bit address (A7 through A0). After the correct READ instruction and address are sent, the data stored in the memory at the selected address is shifted out on the SO pin. The data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses. The internal Address Pointer is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached (01FFh), the address counter rolls over to address 0000h allowing the read cycle to be continued indefinitely. The read operation is terminated by raising the CS pin (Figure 3-1). TABLE 3-1: Write Sequence Prior to any attempt to write data to the 25XX040, the write enable latch must be set by issuing the WREN instruction (Figure 3-4). This is done by setting CS low and then clocking out the proper instruction into the 25XX040. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write enable latch. If the write operation is initiated immediately after the WREN instruction without CS being brought high, the data will not be written to the array because the write enable latch will not have been properly set. Once the write enable latch is set, the user may proceed by setting the CS low, issuing a WRITE instruction, followed by the address, and then the data to be written. Keep in mind that the Most Significant address bit (A8) is included in the instruction byte. Up to 16 bytes of data can be sent to the 25XX040 before a write cycle is necessary. The only restriction is that all of the bytes must reside in the same page. A page address begins with XXXX 0000 and ends with XXXX 1111. If the internal address counter reaches XXXX 1111 and the clock continues, the counter will roll back to the first address of the page and overwrite any data in the page that may have been written. For the data to be actually written to the array, the CS must be brought high after the least significant bit (D0) of the nth data byte has been clocked in. If CS is brought high at any other time, the write operation will not be completed. Refer to Figure 3-2 and Figure 3-3 for more detailed illustrations on the byte write sequence and the page write sequence respectively. While the write is in progress, the STATUS register may be read to check the status of the WIP, WEL, BP1 and BP0 bits (Figure 3-6). A read attempt of a memory array location will not be possible during a write cycle. When the write cycle is completed, the write enable latch is reset. INSTRUCTION SET Instruction Name Instruction Format READ 0000 A8011 Read data from memory array beginning at selected address WRITE 0000 A8010 Write data to memory array beginning at selected address WRDI 0000 0100 Reset the write enable latch (disable write operations) WREN 0000 0110 Set the write enable latch (enable write operations) RDSR 0000 0101 Read STATUS register WRSR 0000 0001 Write STATUS register Note: Description A8 is the 9th address bit necessary to fully address 512 bytes. © 2006 Microchip Technology Inc. DS21204E-page 7 25AA040/25LC040/25C040 FIGURE 3-1: READ SEQUENCE CS 0 1 2 3 4 5 6 7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 8 SCK Instruction 0 SI 0 0 Lower Address Byte A8 0 0 1 A7 1 6 5 4 3 2 1 A0 Don’t Care Data Out High-impedance 7 SO FIGURE 3-2: 6 5 4 3 2 1 0 BYTE WRITE SEQUENCE CS TWC 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCK Instruction SI 0 0 0 A8 0 Data Byte Lower Address Byte 0 1 0 A7 6 5 4 3 2 1 7 A0 6 5 4 3 2 1 0 High-impedance SO FIGURE 3-3: PAGE WRITE SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 10 11 13 14 15 16 17 18 19 20 21 22 23 24 SCK Instruction SI 0 0 0 0 A8 Lower Address Byte 0 1 0 A7 6 5 3 4 2 Data Byte 1 1 0 7 6 5 4 7 6 3 2 1 0 CS 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 SCK Data Byte 2 SI 7 DS21204E-page 8 6 5 4 3 Data Byte n (16 max) Data Byte 3 2 1 0 7 6 5 4 3 2 1 0 5 4 3 2 1 0 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 3.4 Write Enable (WREN) and Write Disable (WRDI) The following is a list of conditions under which the write enable latch will be reset: • • • • • The 25XX040 contains a write enable latch. See Table 3-3 for the Write-Protect Functionality Matrix. This latch must be set before any write operation will be completed internally. The WREN instruction will set the latch, and the WRDI will reset the latch. FIGURE 3-4: Power-up WRDI instruction successfully executed WRSR instruction successfully executed WRITE instruction successfully executed WP line is low WRITE ENABLE SEQUENCE CS 0 1 2 3 4 5 6 7 SCK SI 0 0 0 0 0 1 1 0 High-impedance SO FIGURE 3-5: WRITE DISABLE SEQUENCE CS 0 1 2 3 4 5 6 7 SCK SI 0 0 0 0 0 1 10 0 High-impedance SO © 2006 Microchip Technology Inc. DS21204E-page 9 25AA040/25LC040/25C040 3.5 Read Status Register (RDSR) 3.6 The RDSR instruction provides access to the STATUS register. The STATUS register may be read at any time, even during a write cycle. The STATUS register is formatted as follows: 7 X 6 X 5 X 4 X 3 BP1 2 BP0 1 WEL Write Status Register (WRSR) The WRSR instruction allows the user to select one of four levels of protection for the array by writing to the appropriate bits in the STATUS register. The array is divided up into four segments. The user has the ability to write-protect none, one, two, or all four of the segments of the array. The partitioning is controlled as illustrated in Table 3-2. 0 WIP The Write-In-Process (WIP) bit indicates whether the 25XX040 is busy with a write operation. When set to a ‘1’, a write is in progress, when set to a ‘0’, no write is in progress. This bit is read-only. See Figure 3-7 for WRSR timing sequence. TABLE 3-2: The Write Enable Latch (WEL) bit indicates the status of the write enable latch. When set to a ‘1’, the latch allows writes to the array, when set to a ‘0’, the latch prohibits writes to the array. The state of this bit can always be updated via the WREN or WRDI commands regardless of the state of write protection on the STATUS register. This bit is read-only. ARRAY PROTECTION BP1 BP0 Array Addresses Write-Protected 0 0 none 0 1 upper 1/4 (0180h-01FFh) 1 0 upper 1/2 (0100h-01FFh) 1 1 all (0000h-01FFh) The Block Protection (BP0 and BP1) bits indicate which blocks are currently write-protected. These bits are set by the user issuing the WRSR instruction. These bits are nonvolatile. See Figure 3-6 for RDSR timing sequence. FIGURE 3-6: READ STATUS REGISTER SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK Instruction SI 0 0 0 0 0 1 0 1 Data from STATUS register High-impedance 7 SO FIGURE 3-7: 6 5 4 3 2 1 0 10 11 12 13 14 15 WRITE STATUS REGISTER SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 SCK Instruction SI 0 0 0 0 0 Data to STATUS register 0 0 1 7 6 5 4 3 2 1 0 High-impedance SO DS21204E-page 10 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 3.7 Data Protection 3.8 The following protection has been implemented to prevent inadvertent writes to the array: • The write enable latch is reset on power-up • A write enable instruction must be issued to set the write enable latch • After a byte write, page write or STATUS register write, the write enable latch is reset • CS must be set high after the proper number of clock cycles to start an internal write cycle • Access to the array during an internal write cycle is ignored and programming is continued • The write enable latch is reset when the WP pin is low TABLE 3-3: Power-On State The 25XX040 powers on in the following state: • The device is in low-power Standby mode (CS = 1) • The write enable latch is reset • SO is in high-impedance state • A low level on CS is required to enter active state WRITE-PROTECT FUNCTIONALITY MATRIX WP WEL Protected Blocks Unprotected Blocks STATUS Register Low X Protected Protected Protected High 0 Protected Protected Protected High 1 Protected Writable Writable © 2006 Microchip Technology Inc. DS21204E-page 11 25AA040/25LC040/25C040 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead PDIP (300 mil) 25AA040 I/P e3 1L7 0601 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN 8-Lead TSSOP XXXX YYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: DS21204E-page 12 Example: Example: 25AA040I/ SN e3 0601 1L7 Example: 5A4X 0601 1L7 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p INCHES* NOM 8 .100 .155 .130 MAX MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX Number of Pins Pitch Top to Seating Plane A .140 .170 4.32 Molded Package Thickness A2 .115 .145 3.68 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 8.26 Molded Package Width E1 .240 .250 .260 6.60 Overall Length D .360 .373 .385 9.78 Tip to Seating Plane L .125 .130 .135 3.43 c Lead Thickness .008 .012 .015 0.38 Upper Lead Width B1 .045 .058 .070 1.78 Lower Lead Width B .014 .018 .022 0.56 Overall Row Spacing § eB .310 .370 .430 10.92 α Mold Draft Angle Top 5 10 15 15 β Mold Draft Angle Bottom 5 10 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 © 2006 Microchip Technology Inc. MIN MIN DS21204E-page 13 25AA040/25LC040/25C040 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 h α 45° c A2 A φ β L Units Dimension Limits n p INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff § A1 .004 .010 0.25 Overall Width E .228 .244 6.20 Molded Package Width E1 .146 .157 3.99 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 φ Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 α Mold Draft Angle Top 0 15 15 β Mold Draft Angle Bottom 0 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21204E-page 14 MIN A1 MIN © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 e D 2 1 n b α c ϕ A β L Units Dimension Limits Number of Pins n Pitch e Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Molded Package Length D Foot Length L Foot Angle ϕ Lead Thickness c Lead Width b Mold Draft Angle Top α Mold Draft Angle Bottom β A2 A1 MIN – .031 .002 .169 .114 .018 0° .004 .007 INCHES NOM 8 .026 BSC – .039 – .252 BSC .173 .118 .024 – – – 12° REF 12° REF MAX .047 .041 .006 .177 .122 .030 8° .008 .012 MILLIMETERS* NOM MAX 8 0.65 BSC – – 1.20 0.80 1.00 1.05 0.05 – 0.15 6.40 BSC 4.30 4.40 4.50 2.90 3.00 3.10 0.45 0.60 0.75 0° – 8° 0.09 – 0.20 0.19 – 0.30 12° REF 12° REF MIN *Controlling Parameter Notes: 1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M Drawing No. C04-086 Revised 7-25-06 © 2006 Microchip Technology Inc. DS21204E-page 15 25AA040/25LC040/25C040 APPENDIX A: REVISION HISTORY Revision D Corrections to Section 1.0, Electrical Characteristics. Revision E (8/2006) Added note to page 1 header (Not recommended for new designs). Added note to package drawings. Updated document format DS21204E-page 16 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2006 Microchip Technology Inc. DS21204E-page 17 25AA040/25LC040/25C040 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: 25AA040/25LC040/25C040 Literature Number: DS21204E Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21204E-page 18 © 2006 Microchip Technology Inc. 25AA040/25LC040/25C040 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) c) Device: Temperature Range: Package: 25AA040: 4096-bit 1.8V SPI Serial EEPROM 25AA040T: 4096-bit 1.8V SPI Serial EEPROM (Tape and Reel) 25XX040X: 4096-bit 1.8V SPI Serial EEPROM in alternate pinout (ST only) 25AA040XT:4096-bit 1.8V SPI Serial EEPROM in alternate pinout Tape and Reel (ST only) 25LC040: 4096-bit 2.5V SPI Serial EEPROM 25LC040T: 4096-bit 2.5V SPI Serial EEPROM (Tape and Reel) 25LC040X: 4096-bit 2.5V SPI Serial EEPROM in alternate pinout (ST only) 25LC040XT:4096-bit 2.5V SPI Serial EEPROM in alternate pinout Tape and Reel (ST only) 25C040: 4096-bit 5.0V SPI Serial EEPROM 25C040T: 4096-bit 5.0V SPI Serial EEPROM (Tape and Reel) 25C040X: 4096-bit 5.0V SPI Serial EEPROM in alternate pinout (ST only) 25C040XT: 4096-bit 5.0V SPI Serial EEPROM in alternate pinout Tape and Reel (ST only) I E P SN ST -40 °C to+85 °C -40 °C to +125 °C = = = = = Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead Plastic TSSOP (4.4 mm body), 8-lead d) e) f) g) h) i) j) k) l) m) n) o) p) q) r) s) t) © 2006 Microchip Technology Inc. 25AA040-I/P: Industrial Temp., PDIP package 25AA040-I/SN: Industrial Temp., SOIC package 25AA040T-I/SN: Tape and Reel, Industrial Temp., SOIC package 25AA040X-I/ST: Alternate Pinout, Industrial Temp., TSSOP package 25AA040XT-I/ST: Alternate Pinout, Tape and Reel, Industrial Temp., TSSOP package 25LC040-I/P: Industrial Temp., PDIP package 25LC040-I/SN: Industrial Temp., SOIC package 25LC040T-I/SN: Tape and Reel, Industrial Temp., SOIC package 25LC040X-I/ST: Alternate Pinout, Industrial Temp., TSSOP package 25LC040XT-I/ST: Alternate Pinout, Tape and Reel, Industrial Temp., TSSOP package 25C040-I/P: Industrial Temp., PDIP package 25C040-I/SN: Industrial Temp., SOIC package 25C040T-I/SN: Tape and Reel, Industrial Temp., SOIC package 25C040X-I/ST: Alternate Pinout, Industrial Temp., TSSOP package 25C040XT-I/ST: Alternate Pinout, Tape and Reel, Industrial Temp., TSSOP package 25C040-E/P: Extended Temp., PDIP package 25C040-E/SN: Extended Temp., SOIC package 25C040T-E/SN: Tape and Reel, Extended Temp., SOIC package 25C040X-E/ST: Alternate Pinout, Extended Temp., TSSOP package 25C040XT-E/ST: Alternate Pinout, Tape and Reel, Extended Temp., TSSOP package DS21204E-page 19 25AA040/25LC040/25C040 NOTES: DS21204E-page 20 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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