AN1984 Handling NXP Pressure Sensors

Freescale Semiconductor
Application Note
AN1984
Rev 3, 11/2006
Handling Freescale Pressure Sensors
by: William McDonald
INTRODUCTION
Smaller package outlines and higher board densities
require the need for automated placement of components.
These components are supplied in embossed carrier tape on
plastic reels to meet the increased demand and facilitate ease
of handling. This application note is intended to provide
general information and understanding for handling
Freescale’s surface mount pressure sensors. Equipment
details are not provided in this document and it is
recommended that end users contact suppliers of equipment
for specific applications.
METHODS OF HANDLING
Components can be picked from the carrier tape using
either the vacuum assist or the mechanical type pick up
heads. A vacuum assist nozzle type is most common due to
its lower cost of maintenance and ease of operation. The
recommended vacuum nozzle configuration should be
designed to make contact with the device directly on the metal
Figure 1. MPXH Series Multiple Port
Vacuum Nozzles
cover and avoid vacuum port location directly over the vent
hole in the metal cover of the device. To provide a more secure
hold on the device, contact with the plastic ridge around the
perimeter of the metal cover should be avoided to prevent loss
of vacuum pressure. Multiple vacuum ports within the nozzle
may be required to effectively handle the device and prevent
shifting during movement to placement position.
Figure 1 shows two styles of multiple port vacuum nozzles
for the MPXH series device as an example. Figure 2
represents the nozzle location on the device.
Vacuum pressure required to adequately support the
component should be approximately 25 in Hg (85kPa). This
level is typical of in-house vacuum supply.
Pick up nozzles are available in various sizes and
configurations to suit a variety of component geometries. To
select the nozzle best suited for the specific application, it is
recommended that the customer consult their pick and place
equipment supplier to determine the correct nozzle. In some
cases it may be necessary to fabricate a special nozzle
depending on the equipment and speed of operation.
Figure 2. Nozzle Location
AVAILABLE PACKAGES
Freescale offers several small outline surface mount device
families. These are MPXA, MPXH, MPXM, and MPXY series
of devices.
These devices are also available in axial ported versions to
allow pressure to be interfaced to a device via a hose
connection.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Figure 3. SSOP Axial Style Port
Pick up nozzles for these packages should be configured to
apply vacuum only to the flat surface of a port base. An access
clearance in the nozzle for a port shank is necessary to
properly handle these device configurations. See Figure 3.
SOP
MPAK
SSOP
SOIC16
Figure 2. Available Packages
Table 1. Tape and Reel Information
Case
Carrier Tape
423A
1317
1317A
1320
1320A
482
482A
1369
Chip Pak
SSOP
SSOP
Ported
M-Pak
M-Pak
Ported
SOP
SOP Ported
SOP
Side Port
Tape Width
W
24.0+/-0.3
24.0+/-0.3
24.0+/-0.3
24.0+/-0.3
24.0+/-0.3
32+/-0.3
32+/-0.3
32+/-0.3
Pocket Width
Ao
8.5+/-0.2
7.7+/-0.1
8.8+/-0.1
6.8+/-0.1
7.2+/-0.1
11.3+/-0.1
12.0+/-0.2
12.6+/-0.2
Length
Bo
14.2+/-0.2
10.7+/-0.1
11.8+/-0.1
12.6+/-0.1
13.2+/-0.1
18.9+/-0.1
18.8+/-0.2
18.8+/-0.2
Depth
Ko
4.7+/-0.1
5.0+/-0.1
10.8+/-0.1
4.6+/-0.1
10.5+/-0.1
6.4+/-0.1
13.8+/-0.1
9.2+/-0.2
Sprocket Hole
Pitch
Po
4.0 +/-0.1
4.0+/-0.1
4.0+/-0.1
4.0+/-0.1
4.0+/-0.1
4.0+/-0.1
4.0+/-0.1
4.0+/-0.1
Sprocket Hole
Diagram
Do
1.55+/-0.05
1.55+/-0.05
1.55+/-0.05
1.55+/-0.05
1.55+/-0.05
1.5+/-0.05
1.5+/-0.1
1.5+/-0.1
Edge to Hole
E1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
Hole to Edge
E2
22.2 min
22.2 min
22.2 min
22.2 min
22.2 min
N/A
N/A
N/A
Distance
between Holes
So
N/A
N/A
N/A
N/A
N/A
28.4+/-0.1
28.4+/-0.1
28.4+/-0.1
Pocket Pitch
P1
12.0+/-0.1
12.0+/-0.1
16.0+/-0.1
12.0+/-0.1
16.0+/-0.1
16.0+/-0.1
20.0+/-0.1
24.0+/-.01
Pocket
Position
P2
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
F
11.5+/-0.1
11.5+/-0.1
11.5+/-0.1
11.5+/-0.1
11.5+/-0.1
14.2+/-0.1
14.2+/-0.1
14.2+/-0.1
Tape
Thickness
T
0.40+/-0.05
0.40+/-0.05
0.40+/-0.05
0.40+/-0.05
0.40+/-0.05
0.30+/-0.05
0.35+/-0.05
0.40+/-0.05
Distance
Pocket to
Edge
S1
0.6 min.
0.6 min
0.6 min
0.6 min
0.6 min
N/A
N/A
N/A
Pocket Hole
Diagram
D1
N/A
1.5+/-0.1
1.5+/-0.1
1.5+/-0.1
1.5+/-0.1
2.0+/-0.1
2.0+/-0.1
2.0+/-0.1
Thickness
T1
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
0.052
+/-0.01
Width
W4
21.1+/-0.1
21.1+/-0.1
21.1+/-0.1
21.1+/-0.1
21.1+/-0.1
21.1+/-0.1
25.5+/-0.1
25.5+/-0.1
Width at Hub
W1
23.7 - 25.2
23.7 - 25.2
23.7 - 25.2
23.7 - 25.2
23.7 - 25.2
23.7 - 25.2
31.7 - 33.2
31.7 - 33.2
Width at outer
flange
W3
23.7 - 28.0
23.7 - 28.0
23.7 - 28.0
23.7 - 28.0
23.7 - 28.0
23.7 - 28.0
31.7 - 36.0
31.7 - 36.0
Cover Tape
Reel
Overall Width
W2
30.4 max.
30.4 max.
30.4 max.
30.4 max.
30.4 max.
30.4 max.
38.4 max.
38.4 max
Hub Diagram
N
100+/-2.50
100+/-2.50
100+/-2.50
100+/-2.50
100+/-2.50
100+/-2.50
178+/-2.50
178+/-2.50
Arbor Hole
Diagram
C
13.0+
0.5/-0.2
13.0+
0.5/-0.2
13.0+
0.5/-0.2
13.0
+0.5/-0.2
13.0
+0.5/-0.2
13.0
+0.5/-0.2
13.0
+0.5/-0.2
13.0
+0.5/-0.2
Slot of Arbor
Hole
B
1.50/2.50
1.50/2.50
1.50/2.50
1.50/2.50
1.50/2.50
1.50/2.50
1.50/2.50
1.50/2.50
A
330+/-0.76
330+/-0.76
330+/-0.76
330+/-0.76
330+/-0.76
330+/-0.76
330+/-0.76
330+/-0.76
MPQ
1000
1000
300
1000
400
600
100
200
Reel Diagram
DEVICE
QTY/REEL
AN1984
2
Sensors
Freescale Semiconductor
Cover
Tape
Carrier
Tape
D0
T
P2
D1
P0
B
E1
F
E2
B0
W4
A0
S1
P1
T1
W
B
K0
A0
m
0.2
0+/-
B0
K1
Hole Location
View A-A
View B-B
Figure 3. Carrier Tape
Plastic Reel
W3
W2
A
N
D*
C
B*
W1
Front View
Side View
Reel
Sealing Tape
Pocket
Carrier Tape
Bar Code Label
Figure 4. Reel
AN1984
Sensors
Freescale Semiconductor
3
Pin 1
Pin 1
Corner
Chamfer
User Direction of Feed
Figure 5. Orientation of Small Outline Package Sensor Device
AN1984
4
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
A
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54 10.79
10.54 10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29 10.54
18.01 18.41
SOP PACKAGE
CASE
482-01
CASE
482-01
ISSUE
OO
ISSUE
DATE 01/27/98
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
SOP PACKAGE
CASE 482A-01
CASE
482A-01
ISSUE
A
ISSUE A
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
DATE 05/13/98
AN1984
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 2
MPAK PACKAGE
CASE 1320-02
ISSUE B
AN1984
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Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
MPAK PACKAGE
CASE 1320-02
ISSUE B
AN1984
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Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 1 OF 2
MPAK PACKAGE
CASE 1320A-02
ISSUE A
AN1984
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Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
MPAK PACKAGE
CASE 1320A-02
ISSUE A
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Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 1 OF 2
SSOP PACKAGE
CASE 1317A-03
ISSUE C
AN1984
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PACKAGE DIMENSIONS
PAGE 2 OF 2
SSOP PACKAGE
CASE 1317A-03
ISSUE C
AN1984
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Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 1 OF 3
SSOP PACKAGE
CASE 1317-04
ISSUE F
AN1984
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PACKAGE DIMENSIONS
PAGE 2 OF 3
SSOP PACKAGE
CASE 1317-04
ISSUE F
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PACKAGE DIMENSIONS
PAGE 3 OF 3
SSOP PACKAGE
CASE 1317-04
ISSUE F
AN1984
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PACKAGE DIMENSIONS
PAGE 1 OF 3
SSOP PACKAGE
CASE 1352-03
ISSUE C
AN1984
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Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 2 OF 3
SSOP PACKAGE
CASE 1352-03
ISSUE C
AN1984
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Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 3 OF 3
SSOP PACKAGE
CASE 1352-03
ISSUE C
AN1984
Sensors
Freescale Semiconductor
17
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AN1984
Rev. 3
11/2006
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