93C76A DATA SHEET (04/12/2012) DOWNLOAD

93AA76A/B/C, 93LC76A/B/C,
93C76A/B/C
8K Microwire Compatible Serial EEPROM
Device Selection Table
Part Number
VCC Range
ORG Pin
PE Pin
Word Size
Temp Ranges
Packages
93AA76A
1.8-5.5
No
No
8-bit
I
P, SN, ST, MS, OT
93AA76B
1.8-5-5
No
No
16-bit
I
P, SN, ST, MS, OT
93LC76A
2.5-5.5
No
No
8-bit
I, E
P, SN, ST, MS, OT
93LC76B
2.5-5.5
No
No
16-bit
I, E
P, SN, ST, MS, OT
93C76A
4.5-5.5
No
No
8-bit
I, E
P, SN, ST, MS, OT
93C76B
4.5-5.5
No
No
16-bit
I, E
P, SN, ST, MS, OT
93AA76C
1.8-5.5
Yes
Yes
8- or 16-bit
I
P, SN, ST, MS, MC, MN
93LC76C
2.5-5.5
Yes
Yes
8- or 16-bit
I, E
P, SN, ST, MS, MC, MN
93C76C
4.5-5.5
Yes
Yes
8- or 16-bit
I, E
P, SN, ST, MS, MC, MN
Features:
Description:
•
•
•
•
•
The Microchip Technology Inc. 93XX76A/B/C devices
are 8Kbit, low-voltage, serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic levels
driving the ORG pin to set word size. The 93XX76A
devices provide dedicated 8-bit memory organization,
while the 93XX76B devices provide dedicated 16-bit
memory organization. A Program Enable (PE) pin allows
the user to write-protect the entire memory array.
Advanced CMOS technology makes these devices ideal
for low-power, nonvolatile memory applications. The
93XX Series is available in standard packages including
8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/
TDFN and 8-lead TSSOP. All packages are Pb-free
(Matte Tin) finish.
•
•
•
•
•
•
•
•
•
•
Low-Power CMOS Technology
ORG Pin to Select Word Size for ‘76C’ Version
1024 x 8-bit Organization ‘A’ Devices (no ORG)
512 x 16-bit Organization ‘B’ Devices (no ORG)
Program Enable Pin to Write-Protect the Entire
Array (‘76C’ version only)
Self-Timed Erase/Write Cycles (including
Auto-Erase)
Automatic ERAL Before WRAL
Power-On/Off Data Protection Circuitry
Industry Standard 3-Wire Serial I/O
Device Status Signal (Ready/Busy)
Sequential Read Function
1,000,000 Erase/Write Cycles
Data Retention > 200 Years
Pb-free and RoHS Compliant
Temperature Ranges Supported:
- Industrial (I)
Package Types (not to scale)
-40°C to +85°C
- Automotive (E) -40°C to +125°C
Pin Function Table
Name
Function
CS
Chip Select
CLK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
VSS
Ground
PE
Program Enable – 93XX76C only
ORG
Memory Configuration – 93XX76C only
VCC
Power Supply
 2003-2012 Microchip Technology Inc.
SOT-23
(OT)
PDIP/SOIC
(P, SN)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
VCC
PE(1)
ORG(1)
VSS
1
2
3
4
8
7
6
5
1
6
2
5
VCC
CS
DI
3
4
CLK
DFN/TDFN
(MC, MN)
TSSOP/MSOP
(ST, MS)
CS
CLK
DI
DO
DO
VSS
VCC
PE(1)
ORG(1)
VSS
CS 1
CLK 2
DI 3
DO 4
8
7
6
5
VCC
PE
ORG
VSS
Note 1: 93XX76C only.
DS21796M-page 1
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins  4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
Parameter
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to 5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V
Min
Typ
Max
Units
Conditions
D1
VIH1
VIH2
High-level input voltage
2.0
0.7 VCC
—
—
VCC +1
VCC +1
V
V
VCC 2.7V
VCC < 2.7V
D2
VIL1
VIL2
Low-level input voltage
-0.3
-0.3
—
—
0.8
0.2 VCC
V
V
VCC 2.7V
VCC < 2.7V
D3
VOL1
VOL2
Low-level output voltage
—
—
—
—
0.4
0.2
V
V
IOL = 2.1 mA, VCC = 4.5V
IOL = 100 A, VCC = 2.5V
D4
VOH1
VOH2
High-level output voltage
2.4
VCC - 0.2
—
—
—
—
V
V
IOH = -400 A, VCC = 4.5V
IOH = -100 A, VCC = 2.5V
D5
ILI
Input leakage current
—
—
±1
A
VIN = VSS or VCC
D6
ILO
Output leakage current
—
—
±1
A
VOUT = VSS or VCC
D7
CIN,
COUT
Pin capacitance (all inputs/
outputs)
—
—
7
pF
VIN/VOUT = 0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Write current
—
—
—
500
3
—
mA
A
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 2.5V
D9
ICC read Read current
—
—
—
—
—
100
1
500
—
mA
A
A
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 3.0V
FCLK = 2 MHz, VCC = 2.5V
D10
ICCS
Standby current
—
—
—
—
1
5
A
A
I – Temp
E – Temp
CLK = CS = 0V
ORG = DI = PE = VSS or VCC
(Note 2) (Note 3)
D11
VPOR
VCC voltage detect
—
—
1.5
3.8
—
—
V
V
Note 1:
2:
3:
(Note 1)
93AA76A/B/C, 93LC76A/B/C
93C76A/B/C
This parameter is periodically sampled and not 100% tested.
ORG and PE pins not available on ‘A’ or ‘B’ versions.
Ready/Busy status must be cleared from DO; see Section 3.4 “Data Out (DO)”.
DS21796M-page 2
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
Parameter
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to 5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V
Min
Max
Units
Conditions
A1
FCLK
Clock frequency
—
3
2
1
MHz
MHz
MHz
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A2
TCKH
Clock high time
200
250
450
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A3
TCKL
Clock low time
100
200
450
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A4
TCSS
Chip Select setup time
50
100
250
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A5
TCSH
Chip Select hold time
0
—
ns
1.8V VCC < 5.5V
A6
TCSL
Chip Select low time
250
—
ns
1.8V VCC < 5.5V
A7
TDIS
Data input setup time
50
100
250
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A8
TDIH
Data input hold time
50
100
250
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A9
TPD
Data output delay time
—
100
250
400
ns
ns
ns
4.5V VCC < 5.5V, CL = 100 pF
2.5V VCC < 4.5V, CL = 100 pF
1.8V VCC < 2.5V, CL = 100 pF
A10
TCZ
Data output disable time
—
100
200
ns
ns
4.5V VCC < 5.5V, (Note 1)
1.8V VCC < 4.5V, (Note 1)
A11
TSV
Status valid time
—
200
300
500
ns
ns
ns
4.5V VCC < 5.5V, CL = 100 pF
2.5V VCC < 4.5V, CL = 100 pF
1.8V VCC < 2.5V, CL = 100 pF
A12
TWC
Program cycle time
—
5
ms
Erase/Write mode (AA and LC
versions)
A13
TWC
—
2
ms
Erase/Write mode
(93C versions)
A14
TEC
—
6
ms
ERAL mode, 4.5V VCC 5.5V
A15
TWL
—
15
ms
WRAL mode, 4.5V VCC 5.5V
A16
—
1M
—
Note 1:
2:
Endurance
cycles 25°C, VCC = 5.0V, (Note 2)
This parameter is periodically sampled and not 100% tested.
This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which may be obtained from Microchip’s web
site at www.microchip.com.
 2003-2012 Microchip Technology Inc.
DS21796M-page 3
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
FIGURE 1-1:
CS
SYNCHRONOUS DATA TIMING
VIH
TCSS
VIL
TCKH
TCKL
TCSH
VIH
CLK
VIL
TDIS
TDIH
VIH
DI
VIL
DO
(Read)
DO
(Program)
Note:
TCZ
TPD
TPD
VOH
VOL
TCZ
TSV
VOH
Status Valid
VOL
TSV is relative to CS.
TABLE 1-3: INSTRUCTION SET FOR X16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)
Instruction
SB
Opcode
Address
READ
1
10
X
EWEN
1
00
1
A8 A7 A6 A5 A4 A3 A2 A1 A0
1
x
x
x
x
x
x
x
x
A8 A7 A6 A5 A4 A3 A2 A1 A0
Data In
Data Out
Req. CLK
Cycles
—
D15-D0
29
—
High-Z
13
—
(RDY/BSY)
13
—
(RDY/BSY)
13
D15-D0
(RDY/BSY)
29
ERASE
1
11
X
ERAL
1
00
1
WRITE
1
01
X
WRAL
1
00
0
1
x
x
x
x
x
x
x
x
D15-D0
(RDY/BSY)
29
EWDS
1
00
0
0
x
x
x
x
x
x
x
x
—
High-Z
13
0
X
X
X
X
X
X
X
X
A8 A7 A6 A5 A4 A3 A2 A1 A0
TABLE 1-4: INSTRUCTION SET FOR X8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)
Instruction
SB
Opcode
READ
1
10
X
EWEN
1
00
1
ERASE
1
11
X
ERAL
1
00
1
WRITE
1
01
X
WRAL
1
00
0
1
x
x
x
x
x
x
x
x
EWDS
1
00
0
0
x
x
x
x
x
x
x
x
DS21796M-page 4
Data In
Data Out
Req. CLK
Cycles
—
D7-D0
22
—
High-Z
14
—
(RDY/BSY)
14
—
(RDY/BSY)
14
D7-D0
(RDY/BSY)
22
x
D7-D0
(RDY/BSY)
22
x
—
High-Z
14
Address
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
x
x
x
x
x
x
x
x
x
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0
x
x
x
x
x
x
x
x
x
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.0
FUNCTIONAL DESCRIPTION
When the ORG pin (93XX76C) is connected to VCC,
the (x16) organization is selected. When it is connected
to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI
pin on the rising edge of the clock (CLK). The DO pin is
normally held in a High-Z state except when reading
data from the device, or when checking the Ready/
Busy status during a programming operation. The
Ready/Busy status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the High-Z
state on the falling edge of CS.
2.1
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (Read, Write, Erase, EWEN, EWDS, ERAL
or WRAL). As soon as CS is high, the device is no
longer in Standby mode.
2.3
All modes of operation are inhibited when VCC is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
2.2
Note:
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation if A0 is a logic highlevel. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be
connected between DI and DO.
 2003-2012 Microchip Technology Inc.
To prevent accidental writes to the array in
the 93XX76C devices, set the PE pin to a
logic low.
Block Diagram
VCC
VSS
Memory
Array
Address
Decoder
Address
Counter
When preparing to transmit an instruction,
either the CLK or DI signal levels must be
at a logic low as CS is toggled active high.
Data In/Data Out (DI/DO)
For added protection, an EWDS command
should be performed after every write
operation and an external 10 k pulldown protection resistor should be added
to the CS pin.
After power-up the device is automatically in the EWDS
mode. Therefore, an EWEN instruction must be
performed before the initial ERASE or WRITE instruction
can be executed.
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
Note:
Data Protection
Data Register
Output
Buffer
DO
DI
ORG*
CS
Mode
Decode
Logic
PE*
CLK
Clock
Register
*ORG and PE inputs are not available on
A/B devices.
DS21796M-page 5
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.4
Erase
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
The ERASE instruction forces all data bits of the
specified address to the logical ‘1’ state. The rising
edge of CLK before the last address bit initiates the
write cycle.
Note:
FIGURE 2-1:
After the Erase cycle is complete, issuing
a Start bit and then taking CS low will clear
the Ready/Busy status from DO.
ERASE TIMING
TCSL
CS
Check Status
CLK
1
DI
1
1
AN
AN-1 AN-2
•••
A0
TCZ
TSV
DO
High-Z
Busy
Ready
High-Z
TWC
2.5
Erase All (ERAL)
The DO pin indicates the Ready/Busy status of the
device, if CS is brought high after a minimum of 250 ns
low (TCSL).
The Erase All (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle
is identical to the erase cycle, except for the different
opcode. The ERAL cycle is completely self-timed. The
rising edge of CLK before the last data bit initiates the
write cycle. Clocking of the CLK pin is not necessary
after the device has entered the ERAL cycle.
FIGURE 2-2:
Note:
After the ERAL command is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
VCC must be 4.5V for proper operation of ERAL.
ERAL TIMING
TCSL
CS
Check Status
CLK
DI
1
0
0
1
0
x
•••
x
TCZ
TSV
DO
High-Z
Busy
Ready
High-Z
TEC
DS21796M-page 6
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.6
Erase/Write Disable and Enable
(EWDS/EWEN)
Once the EWEN instruction is executed, programming
remains enabled until an EWDS instruction is executed
or VCC is removed from the device.
The 93XX76A/B/C powers up in the Erase/Write
Disable (EWDS) state. All programming modes must be
preceded by an Erase/Write Enable (EWEN) instruction.
FIGURE 2-3:
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all erase/write
functions and should follow all programming operations. Execution of a READ instruction is independent of
both the EWEN and EWDS instructions.
EWDS TIMING
TCSL
CS
CLK
1
DI
FIGURE 2-4:
0
0
0
0
•••
x
x
EWEN TIMING
TCSL
CS
CLK
1
DI
2.7
0
0
1
1
•••
x
Read
The output data bits will toggle on the rising edge of the
CLK and are stable after the specified time delay (TPD).
Sequential read is possible when CS is held high. The
memory data will automatically cycle to the next register
and output sequentially.
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-version
devices) or 16-bit (If ORG pin is high or B-version
devices) output string.
FIGURE 2-5:
x
READ TIMING
CS
CLK
DI
DO
1
1
0
High-Z
 2003-2012 Microchip Technology Inc.
AN
•••
A0
0
Dx
•••
D0
Dx
•••
D0
Dx
•••
D0
DS21796M-page 7
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.8
Write
The DO pin indicates the Ready/Busy status of the
device, if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
The WRITE instruction is followed by 8 bits (if ORG is
low or A-version devices) or 16 bits (if ORG pin is high
or B-version devices) of data which are written into the
specified address. The self-timed auto-erase and
programming cycle is initiated by the rising edge of CLK
on the last data bit.
FIGURE 2-6:
Note:
The write sequence requires a logic high
signal on the PE pin prior to the rising
edge of the last data bit.
Note:
After the Write cycle is complete, issuing a
Start bit and then taking CS low will clear
the Ready/Busy status from DO.
WRITE TIMING
TCSL
CS
CLK
DI
1
0
1
AN
•••
A0
Dx
•••
D0
TSV
DO
High-Z
Busy
TCZ
Ready
High-Z
TWC
DS21796M-page 8
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.9
Write All (WRAL)
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
The self-timed auto-erase and programming cycle is
initiated by the rising edge of CLK on the last data bit.
Clocking of the CLK pin is not necessary after the
device has entered the WRAL cycle. The WRAL
command includes an automatic ERAL cycle for the
device, so the WRAL instruction does not require an
ERAL instruction. However, the chip must be in the
EWEN status.
Note:
The write sequence requires a logic high
signal on the PE pin prior to the rising
edge of the last data bit.
Note:
After the Write All cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
VCC must be 4.5V for proper operation of WRAL.
FIGURE 2-7:
WRAL TIMING
TCSL
CS
CLK
DI
1
0
0
0
1
x
•••
x
Dx
•••
D0
TSV
DO
High-Z
Busy
TCZ
Ready
HIGH-Z
TWL
 2003-2012 Microchip Technology Inc.
DS21796M-page 9
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.0
PIN DESCRIPTIONS
TABLE 3-1:
PIN DESCRIPTIONS
PDIP
SOIC
TSSOP
MSOP
DFN(1)
TDFN(1)
SOT-23
CS
1
1
1
1
1
1
5
Chip Select
CLK
2
2
2
2
2
2
4
Serial Clock
Name
Function
DI
3
3
3
3
3
3
3
Data In
DO
4
4
4
4
4
4
1
Data Out
VSS
5
5
5
5
5
5
2
Ground
ORG
6
6
6
6
6
6
—
Organization/93XX76C
only
PE
7
7
7
7
7
7
—
Program Enable/
93XX76C only
8
8
8
8
8
8
6
Power Supply
VCC
Note 1:
3.1
The exposed pad on the DFN/TDFN package may be connected to VSS or left floating.
Chip Select (CS)
A high level selects the device; a low level deselects
the device and forces it into Standby mode. However, a
programming cycle that is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
3.2
Serial Clock (CLK)
The Serial Clock is used to synchronize the communication between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of CLK. Data bits are also clocked
out on the positive edge of CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low-level) and can be continued
anytime with respect to Clock High Time (TCKH) and
Clock Low Time (TCKL). This gives the controlling
master freedom in preparing opcode, address and
data.
CLK is a “don’t care” if CS is low (device deselected). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status (i.e.,
waiting for a Start condition).
CLK cycles are not required during the self-timed write
(i.e., auto erase/write) cycle.
After detection of a Start condition the specified number
of clock cycles (respectively, low-to-high transitions of
CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
DS21796M-page 10
data bits before an instruction is executed. CLK and DI
then become “don’t care” inputs waiting for a new Start
condition to be detected.
3.3
Data In (DI)
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
3.4
Data Out (DO)
Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (TPD after the
positive edge of CLK).
This pin also provides Ready/Busy status information
during erase and write cycles. Ready/Busy status information is available on the DO pin if CS is brought high
after being low for minimum Chip Select Low Time
(TCSL) and an erase or write operation has been
initiated.
The Status signal is not available on DO, if CS is held
low during the entire erase or write cycle. In this case,
DO is in the High-Z mode. If status is checked after the
erase/write cycle, the data line will be high to indicate
the device is ready.
Note:
3.5
After a programming cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
Organization (ORG)
When the ORG pin is connected to VCC or logic high,
the (x16) memory organization is selected. When the
ORG pin is tied to VSS or logic low, the (x8) memory
organization is selected. For proper operation, ORG
must be tied to a valid logic level.
93XX76A devices are always (x8) organization and
93XX76B devices are always (x16) organization.
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.6
Program Enable (PE)
This pin allows the user to enable or disable the ability
to write data to the memory array. If the PE pin is tied
to VCC, the device can be programmed. If the PE pin is
tied to VSS, programming will be inhibited. This pin
cannot be floated – it must be tied to VCC or VSS. PE is
not available on 93XX76A or 93XX76B. On those
devices, programming is always enabled.
 2003-2012 Microchip Technology Inc.
DS21796M-page 11
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead MSOP (150 mil)
XXXXXXT
YWWNNN
6-Lead SOT-23
XXNN
Example:
3L76CI
5281L7
Example:
4EL7
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
93LC76C
I/P e3 1L7
0528
8-Lead SOIC
Example:
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
XXXX
TYWW
NNN
8-Lead 2x3 DFN
XXX
YWW
NN
8-Lead 2x3 TDFN
XXX
YWW
NN
DS21796M-page 12
93LC76CI
SN e3 0528
1L7
Example:
L76C
I528
1L7
Example:
3B4
528
L7
Example:
EB4
528
L7
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1st Line Marking Codes
Part Number
SOT-23
TSSOP
93AA76A
DFN
TDFN
MSOP
A76A
I Temp.
E Temp.
I Temp.
E Temp.
I Temp.
E Temp.
3A76AT
4BNN
—
—
—
—
—
93AA76B
A76B
3A76BT
4LNN
—
—
—
—
—
93AA76C
A76C
3A76CT
—
—
3B1
—
EB1
—
93LC76A
L76A
3L76AT
4ENN
4FNN
—
—
—
—
93LC76B
L76B
3L76BT
4PNN
4RNN
—
—
—
—
93LC76C
L76C
3L76CT
—
—
3B4
3B5
EB4
EB5
93C76A
C76A
3C76AT
4HNN
4JNN
—
—
—
—
93C76B
C76B
3C76BT
4TNN
4UNN
—
—
—
—
93C76C
C76C
3C76CT
—
—
3B7
3B8
EB7
EB8
Note:
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X
T
Y
YY
WW
NNN
e3
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2003-2012 Microchip Technology Inc.
DS21796M-page 13
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
NOTES:
DS21796M-page 14
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2003-2012 Microchip Technology Inc.
DS21796M-page 15
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 16
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
b
4
N
E
E1
PIN 1 ID BY
LASER MARK
1
2
3
e
e1
D
A
A2
c
φ
L
A1
L1
3#
4#
5$8
%1
44""
5
5
56
7
9
1#
()*
6$# !4!1#
)*
6,:#
;
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%%
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6,=!#
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6,4#
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4
;
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.
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.
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>
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<
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4!=!#
8
;
(
!"!
#$!
!% #$ !% #$ #&! !
!#
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$##
- *<)
 2003-2012 Microchip Technology Inc.
DS21796M-page 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 18
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
!"##
$% !
.
#
#$#/!- 0 #
1/%#
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##+22---
2/
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
3#
4#
5$8
%1
5*:"
5
5
56
7
<
1#
#
#1
;
;
!!1//
(
(
) #
#1
(
;
;
$!#
$!=!#
"
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!!1/=!#
"
(
<
6,4#
<
9(
#
#1
4
(
(
4!/
<
(
8
9
8
<
)
;
;
34!=!#
4
-4!=!#
6,
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)*
1, $!&%#$,08$#$ #8
#!-###!
?%#*# #
!"!
#$!
!% #$ !% #$ #&!@ !
!#
"'(
)*+) #&#,$ --#
$##
- *<)
 2003-2012 Microchip Technology Inc.
DS21796M-page 19
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 20
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2003-2012 Microchip Technology Inc.
DS21796M-page 21
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
"&'()#$%!*
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
DS21796M-page 22
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
++,
"-(-$%
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
3#
4#
5$8
%1
44""
5
5
56
7
<
1#
6,:#
;
9()*
;
!!1//
<
(
#!
%%
(
;
(
6,=!#
"
!!1/=!#
"
9)*
!!1/4#
.
#4#
4
(
9
(
.
##
4
(
".
.
#
>
;
<>
4!/
;
4!=!#
8
;
1, $!&%#$,08$#$ #8
#!-###!
!"!
#$!
!% #$ !% #$ #&!( !
!#
"'(
)*+ ) #&#,$ --#
$##
".+ % 0$ $-#
$##
0%
%
#
$
- *<9)
 2003-2012 Microchip Technology Inc.
DS21796M-page 23
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 24
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
.
',/0*"11#()$% .
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
3#
4#
5$8
%1
44""
5
5
56
7
<
1#
6,:#
<
#!
%%
(
*
##/
".
6,4#
)*
6,=!#
"
"&
!1!4#
;
"&
!1!=!#
"
(
;
(
8
(
*
##4#
4
(
*
###
"&
!1!
U
;
;
*
##=!#
()*
)*
((
1, $!&%#$,08$#$ #8
#!-###!
1/,
&
!#8 #! 1/ - $#!
!#
"'(
)*+ ) #&#,$ --#
$##
".+ % 0$ $-#
$##
0%
%
#
$
- **
 2003-2012 Microchip Technology Inc.
DS21796M-page 25
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 26
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2003-2012 Microchip Technology Inc.
DS21796M-page 27
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796M-page 28
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
.
',/0"11#(23$% .
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
 2003-2012 Microchip Technology Inc.
DS21796M-page 29
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
APPENDIX A:
REVISION HISTORY
Revision A (05/2003)
Initial Release.
Revision B (07/2003)
Revision C (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision D (02/2004)
Corrections to Device Selection Table, Table 1-1, Table
1-2, Section 2.4, Section 2.5, Section 2.8 and Section
2.9. Added note to Figure 2-7.
Revision E (03/2005)
Added DFN package.
Revision F (04/2005)
Added notes throughout.
Revision G (09/2006)
Revised note in Sections 2.8 and 2.9. Replaced DFN
package drawing.
Revision H (11/2006)
Updated Package Drawings.
Revision J (10/2007)
Revised Device Selection Table; Revised Pin Function
Table; Revised Package Types; Revised Table 3-1;
Replaced Package Drawings; Revised Product ID
System.
Revision K (5/2008)
Revised Figures 2-1, 2-2, 2-6 and 2-7; Revised
Package Marking Information; Replaced Package
Drawings.
Revision L (01/2012)
Added TDFN package.
Revision M (04/2012)
Revised Device Selection Table; Added Note to Package Types Diagram; Revised Marking Codes Table;
Revised Product ID System.
DS21796M-page 30
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2003-2012 Microchip Technology Inc.
DS21796M-page 31
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Literature Number: DS21796M
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21796M-page 32
 2003-2012 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office..
X
PART NO.
Device
Tape & Reel Temperature
Range
Device:
Tape & Reel:
/XX
X
Package
Examples:
a)
b)
93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)
93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)
93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG
c)
93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, tape and reel, 1.8V
93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)
93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)
93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG
a)
93C76A:
93C76B:
93C76C:
c)
93LC76C-I/ST: 8K, 1024x8 or 512x16 Serial
EEPROM, TSSOP package, 2.5V
93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,
SOT-23 package, tape and reel, 2.5V
93LC76CT-E/MNY: 8K, 1024x8 or 512x16
Serial EEPROM, Automotive Temp, TDFN
package, tape and reel
Blank =
T
=
8K 5.0V Microwire Serial EEPROM (x8)
8K 5.0V Microwire Serial EEPROM (x16)
8K 5.0V Microwire Serial EEPROM w/ORG
Standard pinout
Tape & Reel
b)
a)
b)
Temperature Range:
I
E
Package:
MS
=
OT
=
P
=
SN
=
ST
=
MC
=
MNY(1) =
Note
1:
93AA76C-I/P: 8K, 1024x8 or 512x16 Serial
EEPROM, PDIP package, 1.8V
93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V
=
=
93C76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 5.0V
93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V
-40°C to +85°C
-40°C to +125°C
Plastic MSOP (Micro Small outline), 8-lead
Plastic SOT-23, 6-lead (Tape & Reel only)
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic DFN (2x3x0.90 mm body), 8-lead
Plastic TDFN (2x3x0.75 mm body), 8-lead
(Tape & Reel only)
“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
 2003-2012 Microchip Technology Inc.
DS21796M-page 33
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
NOTES:
DS21796M-page 34
 2003-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620762158
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2003-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21796M-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
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Harbour City, Kowloon
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Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
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Japan - Osaka
Tel: 81-66-152-7160
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Tel: 49-89-627-144-0
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Tel: 678-957-9614
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Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
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Netherlands - Drunen
Tel: 31-416-690399
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Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21796M-page 36
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
 2003-2012 Microchip Technology Inc.
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