Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MPX2010GS 4PIN UNIBDY STOVPIPE PRT SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2013-06-19 0875K50010S191A1.19 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes No e4 MPX2010GS 4PIN UNIBDY STOVPIPE PRT ALL 2.686800 g EACH 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon Exemptions in this part List of Freescale Accepted Exemptions 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION SubPart Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.0086 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Other organic Silicon Compounds - 0.000023 g Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Other siloxanes and silicones - 0.007194 g Non-Conductive Epoxy/Adhesive Glass Other silica compounds - 0.001383 g Die Encapsulant Exemption SubstanceWeight UoM SubPart PPM SubPart% REACHPPM REACH% 2681 0.2681 8 0.0008 836461 83.6461 2677 0.2677 160858 16.0858 514 0.0514 g 0.9593 g Die Encapsulant Flame Retardants Antimony trioxide 1309-64-4 0.023108 g 24088 2.4088 8600 0.86 Die Encapsulant Flame Retardants Bromophenol, formaldehyde, epichlorohydrin polymer 68541-56-0 0.03081 g 32117 3.2117 11467 1.1467 Die Encapsulant Plastics/polymers Formaldehyde, polymer with 2-methylphenol, glycidyl ether 64425-89-4 0.154048 g 160584 16.0584 57335 5.7335 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.002648 g 2760 0.276 985 0.0985 Die Encapsulant Metals Lead, metallic lead and lead alloys 7439-92-1 0.000012 g 13 0.0013 4 0.0004 Die Encapsulant Solvents, additives, and other materials (3,4-Epoxycyclohexyl)ethyltrimethoxysilane 3388-04-3 0.003466 g 3613 0.3613 1290 0.129 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.090503 g 94343 9.4343 33684 3.3684 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.654705 g 682482 68.2482 243677 24.3677 Port 1.3766 g Port Metals Antimony, metal 7440-36-0 0.041298 g 30000 3 15370 1.537 Port Flame Retardants Antimony trioxide 1309-64-4 0.041298 g 30000 3 15370 1.537 Port Solvents, additives, and other materials Carbon Black 1333-86-4 0.007571 g 5500 0.55 2817 0.2817 Port Plastics/polymers Polybutylene terephthalate (PBT) 30965-26-5 1.011113 g 734500 73.45 376335 37.6335 Port Glass Fibrous-glass-wool 65997-17-3 0.27532 g 200000 20 102472 10.2472 1000000 100 260 0.026 Bonding Wire 0.0007 Bonding Wire Gel Die Encapsulant g Metals Gold, metal 7440-57-5 0.0007 0.1138 g g Gel Die Encapsulant Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.108227 g 951021 95.1021 40281 4.0281 Gel Die Encapsulant Solvents, additives, and other materials Dimethyl Cyclosiloxanes 70900-21-9 0.000348 g 3061 0.3061 129 0.0129 Gel Die Encapsulant Solvents, additives, and other materials Dimethyl Siloxane 69430-24-6 0.005225 g 45918 4.5918 1944 0.1944 Copper Lead Frame 0.2147 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.207901 g 968328 96.8328 77379 7.7379 Copper Lead Frame Metals Gold, metal 7440-57-5 0.000021 g 100 0.01 7 0.0007 Copper Lead Frame Metals Iron, metal 7439-89-6 0.004651 g 21663 2.1663 1731 0.1731 Copper Lead Frame Metals Lead, metallic lead and lead alloys 7439-92-1 0.000003 g 16 0.0016 1 0.0001 Copper Lead Frame Metals Nickel, metal 7440-02-0 0.00179 g 8336 0.8336 666 0.0666 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.000091 g 424 0.0424 33 0.0033 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.000243 g 1133 0.1133 90 0.009 Bonding Agent 0.0086 g Bonding Agent Metals Proprietary Material-Other aluminum compounds - 0.00387 g 450000 45 1440 0.144 Bonding Agent Solvents, additives, and other materials Other guanidine compounds - 0.000215 g 25000 2.5 80 0.008 Bonding Agent Solvents, additives, and other materials Carbon Black 1333-86-4 0.000215 g 25000 2.5 80 0.008 Bonding Agent Plastics/polymers Other phenolic resins - 0.0043 g 500000 50 1600 0.16 Silicon Semiconductor Die 0.0045 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00009 g 20000 2 33 0.0033 Silicon Semiconductor Die Glass Silicon, doped - 0.00441 g 980000 98 1641 0.1641 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v0.9 Form Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v0.9_MCD_Template.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MPX2010GS_IPC1752_v09.xml http://www.freescale.com/mcds/MPX2010GS_IPC1752_v11.xml http://www.freescale.com/mcds/MPX2010GS_IPC1752A.xml