Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MPL3115A2R1 LGA 8 3*5*1.1 P1.25 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-04-07 007KK50008S044A1.5 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes No Yes 7c-I MPL3115A2R1 LGA 8 3*5*1.1 P1.25 ALL 0.031300 g EACH 1 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Epoxy Die Attach 0.0002 Epoxy Die Attach Cadmium/Cadmium Compounds Cadmium 7440-43-9 0 g Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00001319 g Epoxy Die Attach Lead/Lead Compounds Lead 7439-92-1 0.00000002 Epoxy Die Attach Plastics/polymers 4,4'-Dihydroxydiphenyl 92-88-6 Epoxy Die Attach Plastics/polymers Phenol p-xylylene dimethyl ether copolymer Epoxy Die Attach Metals Silver, metal Bonding Agent Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 3 0.0003 0 0 65969 6.5969 421 0.0421 g 104 0.0104 0 0 0.0000022 g 10995 1.0995 70 0.007 26834-02-6 0.0000022 g 10995 1.0995 70 0.007 7440-22-4 0.00018239 g 911934 91.1934 5827 0.5827 g 0.0006 g Bonding Agent Plastics/polymers Plastic: SI - Silicone Rubber - 0.00047984 g 799734 79.9734 15330 1.533 Bonding Agent Glass Dimethyl silicone polymer with silica 67762-90-7 0.00011996 g 199933 19.9933 3832 0.3832 Bonding Agent Metals Other platinum compounds - 0.0000002 g 333 0.0333 6 0.0006 Bonding Wire, Other 0.0001 g Bonding Wire, Other Metals Gold, metal 7440-57-5 0.000099 g 990000 99 3162 0.3162 Bonding Wire, Other Metals Palladium, metal 7440-05-3 0.000001 g 10000 1 31 0.0031 Gel Die Encapsulant 0.0002 g Gel Die Encapsulant Solvents, additives, and other materials Siloxanes and Silicones, di-Me, mono(vinyl group)terminated 68952-00-1 0.0001975 g 987500 98.75 6309 0.6309 Gel Die Encapsulant Solvents, additives, and other materials Other organic Silicon Compounds - 0.000002 g 10000 1 63 0.0063 Gel Die Encapsulant Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.0000005 g 2500 0.25 15 0.0015 Organic Substrate 0.0085 g Organic Substrate Metals Proprietary Material-Other aluminum compounds - 0.00000116 g 136 0.0136 37 0.0037 Organic Substrate Metals Barium sulfate 7727-43-7 0.00022954 g 27005 2.7005 7333 0.7333 Organic Substrate Metals Copper, metal 7440-50-8 0.00319514 g 375899 37.5899 102081 10.2081 Organic Substrate Plastics/polymers Epikote 862 28064-14-4 0.00057674 g 67852 6.7852 18426 1.8426 Organic Substrate Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00047292 g 55638 5.5638 15109 1.5109 Organic Substrate Metals Gold, metal 7440-57-5 0.00009228 g 10856 1.0856 2948 0.2948 Organic Substrate Metals Talc 14807-96-6 0.00002653 g 3121 0.3121 847 0.0847 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00057674 g 67852 6.7852 18426 1.8426 Organic Substrate Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00031144 g 36640 3.664 9950 0.995 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.00191016 g 224725 22.4725 61027 6.1027 Organic Substrate Glass Silicon dioxide 7631-86-9 0.00017071 g 20084 2.0084 5453 0.5453 Organic Substrate Metals Aluminum Hydroxide 21645-51-2 0.00093548 g 110056 11.0056 29887 2.9887 Organic Substrate Metals Copper phthalocyanine 147-14-8 0.00000116 g 136 0.0136 37 0.0037 Cap/Cover 0.0137 g Cap/Cover Metals Chromium, metal 7440-47-3 0.00249596 g 182187 18.2187 79743 7.9743 Cap/Cover Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00000274 g 200 0.02 87 0.0087 Cap/Cover Solvents, additives, and other materials Silicon 7440-21-3 0.00007131 g 5205 0.5205 2278 0.2278 Cap/Cover Metals Iron, metal 7439-89-6 0.00987241 g 720614 72.0614 315431 31.5431 Cap/Cover Metals Manganese, metal 7439-96-5 0.00014948 g 10911 1.0911 4775 0.4775 Cap/Cover Nickel (external applications only) Nickel 7440-02-0 0.00110262 g 80483 8.0483 35227 3.5227 Cap/Cover Solvents, additives, and other materials Carbon 7440-44-0 0.00000548 g 400 0.04 175 0.0175 Silicon Semiconductor Die 0.004 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00008 g 20000 2 2555 0.2555 Silicon Semiconductor Die Glass Silicon, doped - 0.00392 g 980000 98 125239 12.5239 Pb Glass Frit Semiconductor Di 0.004 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00004152 g 10381 1.0381 1326 0.1326 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00003977 g 9943 0.9943 1270 0.127 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00003977 g 9943 0.9943 1270 0.127 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00387894 g 969733 96.9733 123927 12.3927 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MPL3115A2R1_IPC1752_v11.xml http://www.freescale.com/mcds/MPL3115A2R1_IPC1752A.xml