MPX4250, Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated - Data...

Pressure
Freescale Semiconductor
+
MPX4250
Rev 7, 1/2009
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX4250
Series
0 to 250 kPa (0 to 36.3 psi)
0.2 to 4.9 V Output
The MPX4250 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high-level
analog output signal that is proportional to the applied pressure. The small
form factor and high reliability of on-chip integration make the Freescale
sensor a logical and economical choice for the automotive system engineer.
Application Examples
• Ideally Suited for Microprocessor or
Microcontroller-Based Systems
Features
•
•
•
•
•
•
Differential and Gauge Applications Available
1.4% Maximum Error Over 0° to 85°C
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over –40° to +125°C
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
Durable Epoxy Unibody Element
ORDERING INFORMATION
Package
Device Name
Options
Unibody Package (MPX4250 Series)
MPX4250D
Tray
MPX4250GP
Tray
Case
No.
None
867
•
MPX4250DP
867C
Tray
867B
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
MPX4250D
•
•
MPX4250GP
•
•
MPX4250DP
•
UNIBODY PACKAGES
MPX4250D
CASE 867
MPX4250GP
CASE 867B
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
Device Marking
MPX4250DP
CASE 867C
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Pressure Range
Supply Voltage
Symbol
Min
Typ
Max
Unit
POP
0
—
250
kPa
VS
4.85
5.1
5.35
Vdc
Io
—
7.0
10
mAdc
(0 to 85°C)
Voff
0.139
0.204
0.269
Vdc
(0 to 85°C)
VFSO
4.844
4.909
4.974
Vdc
(0 to 85°C)
VFSS
—
4.705
—
Vdc
(0 to 85°C)
—
—
—
±1.4
%VFSS
ΔV/ΔP
—
18.8
—-
mV/kPa
tR
—
1.0
—-
ms
Io+
—
0.1
—-
mAdc
—
—
20
—-
ms
—
—
±0.5
—-
%VFSS
(1)
(2)
Supply Current
Minimum Pressure Offset @ VS = 5.1 Volts(3)
Full Scale Output @ VS = 5.1 Volts
(4)
Full Scale Span @ VS = 5.1 Volts(5)
Accuracy
(6)
Sensitivity
Response Time
(7)
Output Source Current at Full Scale Output
Warm-Up Time
Offset
(8)
Stability(9)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Variation from Nominal:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX4250
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
1000
kPa
Storage Temperature
TSTG
–40 to +125
°C
TA
–40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
2
3
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX4250
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the differential/gauge pressure sensing
chip in the basic chip carrier (Case 867). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPX4250 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range
.
Fluoro Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Epoxy Case
RTV Die Bond
Lead Frame
P2
Figure 2. Cross Sectional Diagram (not to scale)
+5.1 V
Vout
Output
Vs
IPS
1.0 μF
GND
0.01 μF
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1535)
5.0
4.5
4.0
Output (Volts)
3.5
Transfer Function:
Vout = Vs* (0.00369*P + 0.04) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85°C
TYP
3.0
2.5
2.0
MAX
MIN
1.5
1.0
0.5
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
0
Pressure in kPa
Figure 4. Output versus Absolute Pressure
MPX4250
4
Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPX4250)
Nominal Transfer Value: Vout = VS x (0.00369 x P + 0.04)
± (Pressure Error x Temp. Factor x 0.00369 x VS)
VS = 5.1 ± 0.25 Vdc
Temperature Error Band
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
–40
0 to 85
+125
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.
Pressure Error Band
5.0
Pressure
Error
(kPa)
4.0
3.0
2.0
1.0
0
–1.0
–2.0
0
25
50
75 100 125 150 175 200 225 250
Pressure
(kPa)
–3.0
–4.0
–5.0
Pressure
Error (Max)
0 to 250 kPa
±3.45 kPa
MPX4250
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
BASIC ELEMENT (D)
CASE 867-08
ISSUE N
P
0.25 (0.010)
M
T Q
-A-
M
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
N
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
1
C
SEATING
PLANE
-T-
-TJ
2
3
4
5
K
6
S
SEATING
PLANE
G
F
D 6 PL
0.13 (0.005)
M
A
M
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
PRESSURE AND VACUUM SIDE DUAL PORTED (DP)
CASE 867C-05
ISSUE F
MPX4250
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
PRESSURE SIDE PORTED (GP)
CASE 867B-04
ISSUE G
MPX4250
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
PRESSURE SIDE PORTED (GP)
CASE 867B-04
ISSUE G
MPX4250
8
Sensors
Freescale Semiconductor
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 010 5879 8000
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or +1-303-675-2140
Fax: +1-303-675-2150
[email protected]
MPX4250
Rev. 7
1/2009
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2009. All rights reserved.