Pressure Freescale Semiconductor + MPX4250A Rev 7, 1/2009 Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4250A Series 20 to 250 kPa (2.9 to 36.3 psi) 0.2 to 4.9 V Output The MPX4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thinfilm metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer. Application Examples • • Turbo Boost Engine Control Ideally Suited for Microprocessor or Microcontroller-Based Systems Features • • • • • • • 1.5% Maximum Error Over 0° to 85°C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over -40° to +125°C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package Ideal for Non-Automotive Applications ORDERING INFORMATION Package Case Device Name Options No. Small Outline Package (MPXA4250A Series) MPXA4250A6U Rail 482 MPXA4250AC6U Rail 482A MPXA4250AC6T1 Tape and Reel Unibody Package (MPX4250A Series) MPX4250A Tray MPX4250AP Tray None 867 Gauge Pressure Type Differential Absolute Device Marking • • • MPXA4250A • • • • MPX4250A • • SMALL OUTLINE PACKAGES MPXA4250A6U CASE 482-01 Dual • 482A 867B # of Ports Single MPXA4250AC6U/C6T1 CASE 482A-01 © Freescale Semiconductor, Inc., 2006-2009. All rights reserved. MPXA4250A MPXA4250A MPX4250A UNIBODY PACKAGES MPX4250A CASE 867-08 MPX4250AP CASE 867B-04 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Units POP 20 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 VDC Supply Current IO — 7.0 10 mAdc Differential Pressure Range(1) Minimum Pressure Offset(3) @ VS = 5.1 Volts (0 to 85°C) VOFF 0.133 0.204 0.274 VDC Full Scale Output(4) @ VS = 5.1 Volts (0 to 85°C) VFSO 4.826 4.896 4.966 VDC Full Scale Span(5) @ VS = 5.1 Volts (0 to 85°C) VFSS — 4.692 — VDC Accuracy(6) (0 to 85°C) — — — ±1.5 %VFSS ΔV/ΔΡ — 20 — mV/kPa tR — 1.0 — msec Output Source Current at Full Scale Output IO + — 0.1 — mAdc Warm-Up Time(8) — — 20 — msec Offset Stability(9) — — ±0.5 — %VFSS Sensitivity Response Time(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation over the temperature range of 0° to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4250A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure(2) (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG -40 to +125 °C TA -40 to +125 °C Operating Temperature 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 (Unibody) 2 (Small Outline Package) Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry 2 (Unibody) 3 (Small Outline Package) VOUT 1 (Unibody) 4 (Small Outline Package) Pins 4, 5, and 6 are NO CONNECTS for unibody package devices. Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package and Small Outline Package MPX4250A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. . Fluorosilicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame Epoxy Case RTV Die Bond P2 Sealed Vacuum Reference Figure 2. Cross Sectional Diagram (not to scale) +5.1 V Vout OUTPUT Vs IPS 1.0 μF 0.01 μF 470 pF GND Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) 5.0 4.5 4.0 Output (Volts) 3.5 MAX Transfer Function: VOUT = Vs* (0.004 x P-0.04) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C TYP 3.0 2.5 2.0 1.5 1.0 MIN 0.5 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure MPX4250A 4 Sensors Freescale Semiconductor Pressure Transfer Function Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04) ± (Pressure Error × Temp. Factor × 0.004 × VS) VS = 5.1 V ± 0.25 VDC Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C. Pressure Error Band 5.0 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.0 0 25 50 75 100 125 150 175 200 225 250 Pressure (kPa) Pressure 20 to 250 kPa Error (Max) ±3.45 (kPa) MPX4250A Sensors Freescale Semiconductor 5 Pressure INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and the correct size to ensure proper solder connection interface shorting between solder pads. between the board and the package. With the correct Footprint, the packages will self align when subjected to a 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX4250A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX4250A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX4250A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A 10 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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