50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors

Pressure
Freescale Semiconductor
MPXV2050
Rev 0, 10/2010
50 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
MPXV2050
Series
0 to 50 kPa (0 to 7.25 psi)
40 mV Full Scale
(Typical)
The MPXV2050 series devices are silicon piezoresistive pressure sensors
that provide a highly accurate and linear voltage output directly proportional to the
applied pressure. A single, monolithic silicon diaphragm with the strain gauge and
an integrated thin-film resistor network. Precise span and offset calibration with
temperature compensation are achieved by laser trimming.
Application Examples
Features
•
•
•
•
•
•
• Temperature Compensated Over 0°C to +85°C
• Ratiometric to Supply Voltage
Pump/Motor Control
Robotics
Level Detectors
Medical Diagnostics
Pressure Switching
Blood Pressure Measurement
ORDERING INFORMATION
Device Name
Package
Options
# of Ports
Pressure Type
Case No.
Device Marking
None
Single
Dual
Gauge
Differential
Absolute
Small Outline Package (MPXV2050 Series)
MPXV2050GP
Tray
1369
•
SMALL OUTLINE PACKAGE
MPXV2050GP
CASE 1369
© Freescale Semiconductor, Inc., 2010. All rights reserved.
•
MPXV2050GP
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
50
kPa
VS
—
10
16
VDC
IO
—
6.0
—
mAdc
VFS
38.5
40
41.5
mV
—
–1.0
—
1.0
mV
ΔV/ΔP
—
0.8
—
mV/kPa
Non-Linearity
—
–0.3
—
0.3
%VFS
Pressure Hysteresis (0 to 50 kPa)
—
—
±0.1
—
%VFS
Temperature Hysteresis (-40° to 125°C)
—
—
±0.5
—
%VFS
Temperature Coefficient of Full Scale
TCVFS
–1.0
—
1.0
%VFS
Temperature Coefficient of Offset
TCVOFF
–1.0
—
1.0
mV
ZIN
1000
—
2500
Ω
ZOUT
1400
—
3000
Ω
Response Time(5) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time
—
—
20
—
ms
Offset Stability(6)
—
—
±0.5
—
%VFS
Pressure Range(1)
(2)
Supply Voltage
Supply Current
Full Scale Span
(3)
Offset(4)
Sensitivity
Input Impedance
Output Impedance
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Max Value
Unit
Supply Voltage
16
V
Pressure (P1 > P2)
200
kPa
Storage Temperature
–40 to +125
°C
Operating Temperature Range
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPXV2050
2
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Freescale Semiconductor
Pressure
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and
Calibration
X-ducer
Sensing
Element
2
4
Vout+
Vout-
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output vs. Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side relative to the vacuum side. Similarly, output voltage
increases as increasing vacuum is applied to the vacuum
side relative to the pressure side.
On-Chip Temperature Compensation and Calibration
Figure 2 shows the minimum, maximum and typical output
characteristics of the MPXV2050 series at 25°C. The output
is directly proportional to the differential pressure and is
essentially a straight line.
40
VS = 10 Vdc
TA = 25°C
35
Output (mVdc)
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
TYP
30
25
20
SPAN
RANGE
(TYP)
MAX
15
10
MIN
5
kPa
PSI
0
-5
0
12.5
1.8
25
3.6
37.5
5.4
50
7.25
OFFSET
(TYP)
Figure 2. Output vs. Pressure Differential
MPXV2050
Sensors
Freescale Semiconductor
3
Pressure
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 3) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. The
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Relative Voltage Output
Straight Line
End Point
Straight Line Fit
OFFSET
0
50
100
Pressure (% Full scale)
Figure 3. Linearity Specification Comparison
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier. A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPXV2050 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Refer to application note AN3728, for more information
regarding media compatibility.
Silicone
Gel Die Coat
Die
Stainless
Steel Cap
P1
Thermoplastic
Case
Wire
Bond
Lead
Frame
P2
Differential Sensing
Element
Die Bond
Figure 4. SOP Package — Cross-Sectional Diagram (Not to Scale)
MPXV2050
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Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SOP PACKAGE
MPXV2050
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369A-01
ISSUE B
SOP PACKAGE
MPXV2050
6
Sensors
Freescale Semiconductor
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MPXV2050
Rev. 0
10/2010
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