Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MPX2202A 4 PIN UNIBODY SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2013-06-19 0718K50010S189A1.24 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No No e4 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MPX2202A 4 PIN UNIBODY ALL 1.607850 g EACH 220 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Cap/Cover 0.2853 Cap/Cover Metals Chromium, metal 7440-47-3 0.04834637 g Cap/Cover Solvents, additives, and other materials Sulfur 7704-34-9 0.0000853 g Cap/Cover Solvents, additives, and other materials Phosphorus 7723-14-0 0.00011383 Cap/Cover Solvents, additives, and other materials Silicon 7440-21-3 Cap/Cover Metals Iron, metal Cap/Cover Metals Manganese, metal Die Encapsulant Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 169458 16.9458 30068 3.0068 299 0.0299 53 0.0053 g 399 0.0399 70 0.007 0.0021329 g 7476 0.7476 1326 0.1326 7439-89-6 0.23177773 g 812400 81.24 144153 14.4153 7439-96-5 0.00284387 g 9968 0.9968 1768 0.1768 g 1.01905 g Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.02454688 g 24088 2.4088 15266 1.5266 Die Encapsulant Flame Retardants Bromophenol, formaldehyde, epichlorohydrin polymer 68541-56-0 0.03272883 g 32117 3.2117 20355 2.0355 Die Encapsulant Plastics/polymers Formaldehyde, polymer with 2-methylphenol, glycidyl ether 64425-89-4 0.16364313 g 160584 16.0584 101777 10.1777 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00281258 g 2760 0.276 1749 0.1749 Die Encapsulant Lead/Lead Compounds Lead 7439-92-1 0.00001325 g 13 0.0013 8 0.0008 Die Encapsulant Solvents, additives, and other materials (3,4-Epoxycyclohexyl)ethyltrimethoxysilane 3388-04-3 0.00368183 g 3613 0.3613 2289 0.2289 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.09614023 g 94343 9.4343 59794 5.9794 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.69548327 g 682482 68.2482 432580 43.258 Non-Conductive Epoxy/Adhesive 0.0082 g Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Silicone gum 67762-94-1 0.00008466 g 10324 1.0324 52 0.0052 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and Silicones, di-Me, Me vinyl, vinyl groupterminated 68083-18-1 0.00100787 g 122911 12.2911 626 0.0626 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.00322516 g 393313 39.3313 2005 0.2005 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.00181416 g 221239 22.1239 1128 0.1128 Non-Conductive Epoxy/Adhesive Glass D4 and HMDZ treated Silicon Dioxide 68937-51-9 0.00120944 g 147493 14.7493 752 0.0752 Non-Conductive Epoxy/Adhesive Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.00076598 g 93412 9.3412 476 0.0476 Non-Conductive Epoxy/Adhesive Metals Titanium (IV) Oxide 13463-67-7 0.00009273 g 11308 1.1308 57 0.0057 1000000 100 310 0.031 Bonding Wire 0.0005 Bonding Wire Gel Die Encapsulant g Metals Gold, metal 7440-57-5 0.0005 0.1136 g g Gel Die Encapsulant Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.10803599 g 951021 95.1021 67192 6.7192 Gel Die Encapsulant Solvents, additives, and other materials Dimethyl Cyclosiloxanes 70900-21-9 0.00034773 g 3061 0.3061 216 0.0216 Gel Die Encapsulant Solvents, additives, and other materials Dimethyl Siloxane 69430-24-6 0.00521628 g 45918 4.5918 3244 0.3244 Copper Lead Frame 0.1612 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.15609447 g 968328 96.8328 97082 9.7082 Copper Lead Frame Metals Gold, metal 7440-57-5 0.00001612 g 100 0.01 10 0.001 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00349208 g 21663 2.1663 2171 0.2171 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00000258 g 16 0.0016 1 0.0001 Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.00134376 g 8336 0.8336 835 0.0835 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.00006835 g 424 0.0424 42 0.0042 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00018264 g 1133 0.1133 113 0.0113 Bonding Agent 0.0082 g Bonding Agent Metals Proprietary Material-Other aluminum compounds - 0.00369 g 450000 45 2294 0.2294 Bonding Agent Solvents, additives, and other materials Other guanidine compounds - 0.000205 g 25000 2.5 127 0.0127 Bonding Agent Solvents, additives, and other materials Carbon Black 1333-86-4 0.000205 g 25000 2.5 127 0.0127 Bonding Agent Plastics/polymers Other phenolic resins - 0.0041 g 500000 50 2549 0.2549 Bonding Agent 0.0082 g Bonding Agent Metals Proprietary Material-Other aluminum compounds - 0.00369 g 450000 45 2294 0.2294 Bonding Agent Solvents, additives, and other materials Other guanidine compounds - 0.000205 g 25000 2.5 127 0.0127 Bonding Agent Solvents, additives, and other materials Carbon Black 1333-86-4 0.000205 g 25000 2.5 127 0.0127 Bonding Agent Plastics/polymers Other phenolic resins - 0.0041 g 500000 50 2549 0.2549 Pb Glass Frit Semiconductor Di 0.0036 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00003737 g 10381 1.0381 23 0.0023 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00003579 g 9943 0.9943 22 0.0022 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00003579 g 9943 0.9943 22 0.0022 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00349105 g 969733 96.9733 2171 0.2171 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MPX2202A_IPC1752_v11.xml http://www.freescale.com/mcds/MPX2202A_IPC1752A.xml