MPX5050, MPXV5050, MPVZ5050 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and...

Pressure
Freescale Semiconductor
MPX5050
Rev 11, 03/2010
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX5050
MPXV5050
MPVZ5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 V Output
The MPXx5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated Over -40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
Easy-to-Use Chip Carrier Option
ORDERING INFORMATION
Case
Device Name
No.
Unibody Package (MPX5050 Series)
None
MPX5050D
867
•
MPX5050DP
867C
MPX5050GP
867B
MPX5050GP1
867B
Small Outline Package (MPXV5050 Series)
# of Ports
Single
Dual
Gauge
•
•
•
•
•
Pressure Type
Differential
•
•
Absolute
Device
Marking
MPX5050D
MPX5050DP
MPX5050GP
MPX5050GP
MPXV5050GP
1369
•
MPXV5050DP
1351
•
MPXV5050GC6U
482A
•
MPXV5050GC6T1
482A
•
Small Outline Package (Media Resistant Gel) (MPVZ5050 Series)
•
•
•
MPXV5050GP
MPXV5050DP
MPXV5050G
MPXV5050G
MPVZ5050GW7U
•
MZ5050GW
1560
•
© Freescale Semiconductor, Inc., 2007-2010. All rights reserved.
•
Pressure
UNIBODY PACKAGES
MPX5050D
CASE 867-08
MPX5050GP
CASE 867B-04
MPX5050DP
CASE 857C-05
SMALL OUTLINE PACKAGES
MPVZ5050GW7U
CASE 1560-03
MPXV5100GC6U
CASE 482A-01
MPXV5050DP
CASE 1351-01
MPXV5050GP
CASE 1369-01
MPX5050
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
50
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
7.0
10
mAdc
Minimum Pressure Offset(3)
@ VS = 5.0 Volts
(0 to 85°C)
Voff
0.088
0.2
0.313
Vdc
Full Scale Output(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.587
4.7
4.813
Vdc
Full Scale Span(5)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
—
4.5
—
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±2.5
%VFSS
V/P
—
90
—
mV/kPa
Response Time(7)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—
mAdc
Warm-Up Time(8)
—
—
20
—
ms
Offset Stability(9)
—
—
±0.5
—
%VFSS
Sensitivity
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2.Device is ratiometric within this specified excitation range.
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6.Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX5050
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
200
kPa
Storage Temperature
Tstg
-40° to +125°
°C
Operating Temperature
TA
-40° to +125°
°C
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 4, 5, and 6 are NO CONNECTS
for Unibody Device
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX5050
4
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Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
TYPICAL
Output (V)
3.0
2.5
MAX
2.0
MIN
1.5
1.0
0.5
0
0
5
10
15
20
25
30
35
40
45
50
55
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
Stainless Steel
Metal Cover
Fluorosilicone
Gel Die Coat
P1
Epoxy
Plastic
Case
Differential/Gauge Element
Die
Bond
Die
Wire Bond
Lead Frame
P2
Figure 3. Cross-Sectional Diagram (not to scale)
+5 V
Vout
OUTPUT
Vs
IPS
1.0 μF
0.01 μF
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MPX5050
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Freescale Semiconductor
5
Pressure
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
± (Pressure Error x Temp. Factor x 0.018 x VS)
VS = 5.0 V ± 0.25 Vdc
Temperature Error Band
4.0
Temp
3.0
Temperature
Error
Factor
–40
0 to 85
+125
2.0
Multiplier
3
1
3
1.0
0.0
–40
–20
0
20
40
60
Temperature in °C
80
100
120
140
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
Pressure (in kPa)
0.0
0
–1.0
10
20
30
40
50
60
–2.0
–3.0
Pressure
Error (Max)
0 to 50 (kPa)
±1.25 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
Part Number
MPX5050D
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
867
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX5050DP
867C
Side with Part Marking
MPX5050GP
867B
Side with Port Attached
MPXV5050GP
1369
Side with Port Attached
MPXV5050DP
1351
Side with Part Marking
MPXV5050GC6U/T1
482A
Vertical Port Attached
MPX5050
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Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0
7
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
UNIBODY PACKAGE
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.84
0.027
0.033
0.68
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
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Pressure
PACKAGE DIMENSIONS
P
0.25 (0.010)
M
T Q
–A–
M
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
N
–Q–
PORT #2
VACUUM
(P2)
B
PIN 1
1
2
3
4
5
K
6
C
SEATING
PLANE
–T–
–T–
J
S
SEATING
PLANE
D 6 PL
G
F
0.13 (0.005)
M
A
M
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 2 OF 2
PAGE 2 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
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PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
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MPX5050
Rev. 11
03/2010
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