34AA04 DATA SHEET (10/28/2014) DOWNLOAD

34AA04
4K I2C™ Serial EEPROM with Software Write-Protect
Device Selection Table
Part
Number
34AA04
Description
VCC
Range
Max. Clock
Frequency
Temp
Ranges
1.7-3.6
1 MHz(1)
I, E
VCC
Note 1: 400 kHz for 1.8V ≤
100 kHz for VCC < 1.8V
< 2.2V
Features
• 4 Kbit EEPROM:
- Internally organized as two 256 x 8-bit banks
- Byte or page writes (up to 16 bytes)
- Byte or sequential reads within a single bank
- Self-timed write cycle (5 ms max.)
• JEDEC® JC42.4 (EE1004-v) Serial Presence
Detect (SPD) Compliant for DRAM (DDR4)
modules
• High-Speed I2C™ Interface:
- Industry standard 1 MHz, 400 kHz, and
100 kHz
- Schmitt Trigger inputs for noise suppression
- SMBus-compatible bus time out
- Cascadable up to eight devices
• Write Protection:
- Reversible software write protection for four
individual 128-byte blocks
• Low-Power CMOS Technology:
- Voltage range: 1.7V to 3.6V
- Write current: 1.5 mA at 3.6V
- Read current: 200 µA at 3.6V, 400 kHz
- Standby current: 1 µA at 3.6V
• High Reliability:
- More than one million erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• 8-lead PDIP, SOIC, TSSOP, TDFN, and UDFN
Packages
• Available Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
 2014 Microchip Technology Inc.
The Microchip Technology Inc. 34AA04 is a 4 Kbit
Electrically Erasable PROM which utilizes the I2C serial
interface and is capable of operation across a broad
voltage range (1.7V to 3.6V). This device is JEDEC
JC42.4 (EE1004-v) Serial Presence Detect (SPD)
compliant and includes reversible software write
protection for each of four independent 128 x 8-bit
blocks. The device features a page write capability of
up to 16 bytes of data. Address pins allow up to eight
devices on the same bus.
The 34AA04 is available in the 8-lead PDIP, SOIC,
TSSOP, TDFN, and UDFN packages.
Package Types
PDIP/SOIC/TSSOP
A0
1
8
VCC
A1
2
7
NC
A2
3
6
SCL
VSS
4
5
SDA
TDFN/UDFN
A0 1
A1 2
A2 3
VSS 4
8 VCC
7 NC
6 SCL
5 SDA
Block Diagram
A0 A1 A2
I/O
Control
Logic
SDA SCL
VCC
VSS
HV Generator
Memory
Control
Logic
XDEC
Block 0
(000h-07Fh)
Block 1
(080h-0FFh)
Block 2
(100h-17Fh)
Block 3
(180h-1FFh)
Write-Protect
Circuitry
YDEC
Sense Amp.
R/W Control
DS20005271B-page 1
34AA04
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC .............................................................................................................................................................................6.5V
All Inputs and Outputs (except A0) w.r.t. VSS ............................................................................................... -0.3V to 6.5V
A0 Input w.r.t. VSS ........................................................................................................................................... -0.3 to 12V
Storage Temperature...............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
ESD Protection on All Pins  4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC SPECIFICATIONS
VCC = +1.7V to +3.6V
Industrial (I): TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
DC CHARACTERISTICS
Param.
No.
Symbol
Characteristic
Min.
Max.
Units
Conditions
—
A0, A1, A2, SCL, and SDA
—
—
—
D1
VIH
High-Level Input Voltage
0.7 VCC
VCC + 0.5
V
D2
VIL
Low-Level Input Voltage
—
0.3 VCC
0.2 VCC
V
V
VCC ≥ 2.5V
VCC < 2.5V
D3
VHYS
Hysteresis of Schmitt
Trigger Inputs
0.0 VCC
—
V
(Note)
D4
VOL
Low-Level Output Voltage
—
0.40
0.40
V
V
IOL = 20.0 mA, VCC = 2.2V
IOL = 6.0 mA, VCC = 1.7V
D5
VHV
High-Voltage Detect
(A0 pin only)
7
10
V
VCC < 2.2V
D6
ILI
Input Leakage Current
D7
ILO
Output Leakage Current
D8
CIN, COUT Pin Capacitance
(all inputs/outputs)
D9
ICC write
D10
ICC read
D11
ICCS
Note:
Operating Current
Standby Current
VCC + 4.8
10
V
VCC  2.2V
—
±1
A
VIN = VSS or VCC
—
±1
A
VOUT = VSS or VCC
—
10
pF
VCC = 5.5V (Note)
TA = 25°C, FCLK = 1 MHz
—
1.5
mA
VCC = 3.6V
—
200
A
VCC = 3.6V, SCL = 400 kHz
—
—
1
5
A
A
Industrial
Automotive
SDA, SCL, VCC = 3.6V
A0, A1, A2 = VSS
This parameter is periodically sampled and not 100% tested.
DS20005271B-page 2
 2014 Microchip Technology Inc.
34AA04
TABLE 1-2:
AC SPECIFICATIONS
VCC = +1.7V to +3.6V
Industrial (I): TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
AC CHARACTERISTICS
Param.
No.
Symbol
Characteristic
Min.
Max.
Units
Conditions
10
10
10
100
400
1000
kHz
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
1
FCLK
Clock Frequency (Note 2)
2
THIGH
Clock High Time
4000
600
260
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
3
TLOW
Clock Low Time
4700
1300
500
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
4
TR
SDA and SCL Rise Time (Note 1)
—
—
—
1000
300
120
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
5
TF
SDA and SCL Fall Time (Note 1)
—
—
—
300
300
120
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
6
THD:STA
Start Condition Hold Time
4000
600
260
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
7
TSU:STA
Start Condition Setup Time
4700
600
260
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
8
THD:DAT
Data Input Hold Time
0
—
ns
(Note 3)
9
TSU:DAT
Data Input Setup Time
250
100
50
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
10
TSU:STO
Stop Condition Setup Time
4000
600
260
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
11
TAA
Output Valid from Clock (Note 3)
200
200
—
3450
900
350
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
12
TBUF
Bus Free Time: Time the bus must
be free before a new transmission
can start
4700
1300
500
—
—
—
ns
1.7V  VCC < 1.8V
1.8V  VCC  2.2V
2.2V  VCC  3.6V
13
TSP
Input Filter Spike Suppression
(SDA and SCL pins)
—
50
ns
(Note 1)
14
TWC
Write Cycle Time (byte or page)
—
5
ms
—
—
15
TTIMEOUT
Bus Timeout Time
25
35
ms
16
—
Endurance
1M
—
cycles
Page mode, 25°C, VCC = 3.6V
(Note 4)
Note 1: Not 100% tested.
2: The minimum clock frequency of 10 kHz is to prevent the bus timeout from occurring.
3: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
200 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please
consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
 2014 Microchip Technology Inc.
DS20005271B-page 3
34AA04
FIGURE 1-1:
BUS TIMING DATA
5
SCL
7
SDA
In
D3
2
3
8
9
4
10
6
13
11
12
SDA
Out
DS20005271B-page 4
 2014 Microchip Technology Inc.
34AA04
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Symbol
PDIP
SOIC
TSSOP
UDFN
TDFN
Description
A0/VHV
1
1
1
1
1
Chip Address Input, High-Voltage Input
A1
2
2
2
2
2
Chip Address Input
A2
3
3
3
3
3
Chip Address Input
VSS
4
4
4
4
4
Ground
SDA
5
5
5
5
5
Serial Address/Data I/O
SCL
6
6
6
6
6
Serial Clock
NC
7
7
7
7
7
Not Connected
VCC
8
8
8
8
8
+1.7V to 3.6V Power Supply
Note:
2.1
Exposed pad on TDFN/UDFN can be connected to VSS or left floating.
A0, A1, A2 Chip Address Inputs
The levels on these inputs are compared with the
corresponding bits in the slave address. The chip is
selected if the compare is true.
2.3
Serial Clock (SCL)
This input is used to synchronize the data transfer to
and from the device.
Up to eight 34AA04 devices may be connected to the
same bus by using different Chip Select bit combinations. These inputs must be connected to either VSS or
VCC.
The A0 pin also serves as the high-voltage input for
enabling the SWPn and CWP instructions.
Note:
2.2
The comparison between the A0, A1, and
A2 pins and the corresponding Chip
Select bits is disabled for software WriteProtect and Bank Select commands.
Serial Address/Data Input/Output
(SDA)
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal. Therefore, the SDA bus requires a pullup resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz and 1 MHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
 2014 Microchip Technology Inc.
DS20005271B-page 5
34AA04
3.0
FUNCTIONAL DESCRIPTION
The 34AA04 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data, as a receiver. The bus has to be
controlled by a master device, which generates the
Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 34AA04
works as slave. Both master and slave can operate as
transmitter or receiver, but the master device
determines which mode is activated.
The 4 Kbit array of the 34AA04 is divided into two
separate banks of 2 Kbits each. The 34AA04 also
offers reversible software write protection for each of
four 1 Kbit blocks.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Bus Not Busy (A)
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
will be stored when doing a write operation. When an
overwrite does occur, it will replace data in a first-in,
first-out (FIFO) fashion.
4.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. Exceptions to this rule relating to software write
protection are described in Section 9.0 “Software
Write Protection”. The master device must generate
an extra clock pulse, which is associated with this
Acknowledge bit.
Note:
The 34AA04 does not generate any
Acknowledge bits
if an internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end-ofdata to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (34AA04) will leave the data line
high to enable the master to generate the Stop
condition.
4.6
Bus Timeout
If SCL remains low for the time specified by TTIMEOUT,
the 34AA04 will reset the serial interface and ignore all
further communication until another Start condition is
detected (Figure 4-2). This dictates the minimum clock
speed as defined by FCLK.
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited; although only the last sixteen
DS20005271B-page 6
 2014 Microchip Technology Inc.
34AA04
FIGURE 4-1:
SCL
(A)
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SDA
FIGURE 4-2:
Stop
Condition
Data
Allowed
to Change
BUS TIMEOUT
TTIMEOUT(MIN)
TTIMEOUT(MAX)
SCL
TLOW < TTIMEOUT(MIN): Bus interface does not reset.
TTIMEOUT(MIN) < TLOW < TTIMEOUT(MAX): Bus interface may or may not reset.
TTIMEOUT(MAX) < TLOW: Bus interface will reset.
4.7
Device Addressing
A control byte is the first byte received following the
Start condition from the master device. The first part of
the control byte consists of a 4-bit control code which is
set to ‘1010’ for normal read and write operations and
‘0110’ for accessing the software write-protect features
and bank selection. The control byte is followed by
three Chip Select bits (A2, A1, A0). The Chip Select bits
allow the use of up to eight 34AA04 devices on the
same bus and are used to determine which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond.
The eighth bit of slave address determines if the master
device wants to read or write to the 34AA04
(Figure 4-3). When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected.
Control
Code
Chip
Select
R/W
Read
1010
A2 A1 A0
1
Write
1010
A2 A1 A0
0
Read Write-Protect/
Bank Address
0110
A2 A1 A0
1
Set Write-Protect/
Bank Address
0110
A2 A1 A0
0
Operation
FIGURE 4-3:
CONTROL BYTE
ALLOCATION
Start
Read/Write
Slave Address
1
0
1
0
R/W A
A2
A1
A0
A2
A1
A0
OR
0
 2014 Microchip Technology Inc.
1
1
0
DS20005271B-page 7
34AA04
5.0
BANK ADDRESSING
Note: Sequential read operations cannot
cross a bank boundary and will roll over
back to the beginning of the selected
bank.
To support backwards-compatibility with DDR2/3
(JEDEC EE1002) SPD EEPROMs, the memory array
of the 34AA04 is divided into two separate 256-byte
banks. The Set Bank Address (SBA) commands are
used to set the bank address to either 0 or 1. The
Read Bank Address (RBA) command is used to
determine which bank is currently selected.
TABLE 5-1:
Note 1: The bank address is volatile and is reset
to Bank 0 upon power-up.
BANK ADDRESS RANGE
Bank
Logical Array Address
Bank 0
Bank 1
000h-0FFh
100h-1FFh
2: The comparison between the A0, A1, and
A2 pins and the corresponding Chip
Select bits is disabled for Bank Select
commands.
TABLE 5-2:
BANK ADDRESSING INSTRUCTION SET
Control Byte
Function
Set Bank Address to 0
Set Bank Address to 1
Read Bank Address
5.1
Abbr
Control Code
R/W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
1
1
0
1
1
1
1
1
1
0
1
0
0
0
1
SBA0
SBA1
RBA
Set Bank Address (SBA)
The Set Bank Address (SBA) commands are used to
select the array bank for future read and write
operations.
The master generates a Start condition followed by the
corresponding control byte for the chosen SBA
command (Table 5-2), with the R/W bit set to a logic
‘0’. Note that Chip Select bit A0 of the control byte
effectively determines which bank is selected. The
FIGURE 5-1:
Chip Select Bits
A0 Pin
0, 1, or VHV
0, 1, or VHV
0, 1, or VHV
34AA04 will respond with an Acknowledge, and then
the master transmits two dummy bytes. The 34AA04
will not acknowledge either dummy byte. Finally, the
master generates a Stop condition to end the
operation (Figure 5-1).
Array Read and Write commands will operate in the
newly-selected bank until another SBA command is
executed, or the 34AA04 experiences a POR or BOR
event.
SET BANK ADDRESS
Bus Activity
Master
S
T
A
R
T
SDA Line
A1
S 0 1 1 0 1 1 0 0
Bus Activity
Control
Byte
P
A
C
K
Note 1: Chip Select bit A0 specifies which bank to select.
DS20005271B-page 8
S
T
O
P
Dummy
Byte
Dummy
Byte
N
o
N
o
A
C
K
A
C
K
 2014 Microchip Technology Inc.
34AA04
5.2
Read Bank Address (RBA)
The Read Bank Address (RBA) command allows the
34AA04 to indicate which array bank is currently
selected.
The master generates a Start condition and transmits
the RBA control byte (Table 5-2), with the R/W bit set
to logic ‘1’. If Bank 0 is currently selected, the 34AA04
will respond with an Acknowledge signal. If Bank 1 is
currently selected, an Acknowledge will not be
generated. Regardless of the result, the master must
read at least one dummy byte from the 34AA04,
transmitting a Not Acknowledge signal after each byte,
and generate a Stop condition to end the command
(Figure 5-2).
FIGURE 5-2:
READ BANK ADDRESS
Bus Activity
Master
S
T
A
R
T
SDA Line
S 0 1 1 0 1 1 0 1
Bus Activity
Control
Byte
Dummy
Byte
S
T
O
P
P
A1
C
K
N
o
A
C
K
Note 1: The 34AA04 will only acknowledge if Bank 0 is currently selected.
2: In accordance with the JEDEC spec, the master is allowed to read multiple dummy bytes,
transmitting a Not Acknowledge after each byte.
 2014 Microchip Technology Inc.
DS20005271B-page 9
34AA04
6.0
WRITE OPERATIONS
6.1
Byte Write
Following the Start signal from the master, the control
code (4 bits), the Chip Select bits (3 bits) and the R/W
bit, which is a logic low, are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that the array address byte will follow,
once it has generated an Acknowledge bit during the
ninth clock cycle. Therefore, the next byte transmitted
by the master is the array address and will be written
into the Address Pointer of the 34AA04.
After receiving another Acknowledge signal from the
34AA04, the master device will transmit the data byte to
be written into the addressed memory location. The
34AA04 acknowledges again and the master generates
a Stop condition. This initiates the internal write cycle,
which means that during this time, the 34AA04 will not
generate Acknowledge signals (Figure 6-1).
It is recommended to perform a Set Bank
Address command before initiating a
Write command to ensure the desired
bank is selected.
Note:
Pointer bits are internally incremented by one. The
higher order four bits of the array address, as well as
the bank selection, remain constant. If the master
should transmit more than 16 bytes prior to generating
the Stop condition, the address counter will roll over
and the previously received data will be overwritten. As
with the byte write operation, once the Stop condition is
received, an internal write cycle will begin (Figure 6-2).
If an attempt is made to write to a software write-protected portion of the array, the 34AA04 will not
acknowledge the data byte, no data will be written, and
the device will immediately accept a new command.
Note:
When doing a write of less than 16 bytes,
the data in the rest of the page is
refreshed along with the data bytes being
written. This will force the entire page to
endure a write cycle. For this reason,
endurance is specified per page.
Note:
Page write operations are limited to
writing bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer multiples of the page buffer size (or ‘page size’)
and end at addresses that are integer multiples of [page size – 1]. If a Page Write
command attempts to write across a physical page boundary, the result is that the
data wraps around to the beginning of the
current page (overwriting data previously
stored there), instead of being written to
the next page, as might be expected. It is,
therefore, necessary for the application
software to prevent page write operations
that would attempt to cross a page
boundary.
If an attempt is made to write to a software write-protected portion of the array, the 34AA04 will not acknowledge the data byte, no data will be written, and the
device will immediately accept a new command.
6.2
Page Write
The write control byte, array address and the first data
byte are transmitted to the 34AA04 in the same way as
in a byte write. Instead of generating a Stop condition,
the master transmits up to 15 additional data bytes to
the 34AA04, which are temporarily stored in the onchip page buffer and will be written into the memory
after the master has transmitted a Stop condition. Upon
receipt of each word, the four lower order Address
TABLE 6-1:
DEVICE RESPONSE WHEN WRITING DATA
Status
Command
Protected with SWPn
Not Protected
FIGURE 6-1:
Page or Byte Write in
Protected Block
Page or Byte Write
ACK
Address
ACK
Data Byte
ACK
Write Cycle
ACK
Address
ACK
Data
NoACK
No
ACK
Address
ACK
Data
ACK
Yes
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Bus Activity
DS20005271B-page 10
Control
Byte
Array
Address
S
T
O
P
Data
P
A
C
K
A
C
K
A
C
K
 2014 Microchip Technology Inc.
34AA04
FIGURE 6-2:
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Control
Byte
Bus Activity
 2014 Microchip Technology Inc.
Array
Address (n)
Data (n)
S
T
O
P
Data (n + 15)
Data (n + 1)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS20005271B-page 11
34AA04
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If the cycle is complete, then the device will return the
ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for flow
diagram.
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS20005271B-page 12
 2014 Microchip Technology Inc.
34AA04
8.0
READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 34AA04 contains an address counter that
maintains the address of the last byte accessed, internally incremented by ‘1’. Therefore, if the previous
access (either a read or write operation) was to
address n, the next current address read operation
would access data from address n+1. Upon receipt of
the slave address with R/W bit set to ‘1’, the 34AA04
issues an acknowledge and transmits the 8-bit data
value. The master will not acknowledge the transfer,
but does generate a Stop condition and the 34AA04
discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the array address must first
be set. This is done by sending the array address to the
34AA04 as part of a write operation. Once the array
address is sent, the master generates a Start condition
following the acknowledge. This terminates the write
operation, but not before the internal Address Pointer is
set. The master then issues the control byte again, but
with the R/W bit set to a ‘1’. The 34AA04 then issues
an acknowledge and transmits the 8-bit data word. The
FIGURE 8-1:
master will not acknowledge the transfer, but does
generate a Stop condition and the 34AA04
discontinues transmission (Figure 8-2).
Note:
8.3
It is recommended to perform a Set Bank
Address command before initiating a
Read command to ensure the desired
bank is selected.
Sequential Read
Sequential reads are initiated in the same way as a
random read, with the exception that after the 34AA04
transmits the first data byte, the master issues an
acknowledge, as opposed to a Stop condition in a
random read. This directs the 34AA04 to transmit the
next sequentially addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 34AA04 contains an
internal Address Pointer, which is incremented by one
at the completion of each operation. Sequential reads
are limited to a single bank per operation, so the
Address Pointer allows the entire memory contents of
the current bank to be serially read during one operation.
8.4
Noise Protection and Brown-Out
The 34AA04 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.35V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Bus Activity
 2014 Microchip Technology Inc.
Control
Byte
S
T
O
P
Data (n)
P
A
C
K
N
O
A
C
K
DS20005271B-page 13
34AA04
FIGURE 8-2:
RANDOM READ
Bus Activity
Master
S
T
A
R
T
Control
Byte
S
SDA Line
Bus Activity
Master
Control
Byte
S
T
O
P
Data (n)
P
S
A
C
K
Bus Activity
FIGURE 8-3:
S
T
A
R
T
Array
Address (n)
A
C
K
A
C
K
N
O
A
C
K
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + X)
SDA Line
Bus Activity
DS20005271B-page 14
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
 2014 Microchip Technology Inc.
34AA04
9.0
SOFTWARE WRITE
PROTECTION
TABLE 9-1:
BLOCK ADDRESS RANGE
Block
Logical Array Address
Block 0
Block 1
Block 2
Block 3
000h - 07Fh
080h - 0FFh
100h - 17Fh
180h - 1FFh
The 34AA04 has a reversible software write-protect
feature that allows each of four 128-byte blocks to be
individually write-protected. The write protection is set
by executing the Set Write Protect (SWPn)
commands. The Clear All Write Protect (CWP)
command is used to unprotect all of the blocks at
once. It is not possible to unprotect blocks individually.
The Read Protection Status (RPS) commands are
used to determine if a given block is currently writeprotected.
Note:
The comparison between the A0, A1, and
A2 pins and the corresponding Chip
Select bits is disabled for software WriteProtect commands.
The 34AA04 will not respond with an Acknowledge
following the data bytes of write operations that are
attempted within a write-protected block.
Note: The write-protect state of each block is
stored in nonvolatile bits.
TABLE 9-2:
SOFTWARE WRITE PROTECTION INSTRUCTION SET
Control Byte
Function
Abbr
Control Code
Bit 7
Set Write Protection, block 0
Set Write Protection, block 1
Set Write Protection, block 2
Set Write Protection, block 3
Clear All Write Protection
Read Protection Status, block 0
Read Protection Status, block 1
Read Protection Status, block 2
Read Protection Status, block 3
9.1
SWP0
SWP1
SWP2
SWP3
CWP
RPS0
RPS1
RPS2
RPS3
Bit 6
0
Set Write Protection (SWPn)
The Set Write Protection (SWP) commands are used
to set the reversible write protection for individual array
blocks. There are four different SWP commands, one
for each block.
1
Bit 5
1
Chip Select Bits
R/W
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
1
1
0
0
0
1
1
0
0
0
0
0
1
0
0
0
0
1
0
1
0
1
1
0
1
0
0
0
0
0
0
1
1
1
1
A0 Pin
VHV
VHV
VHV
VHV
VHV
0, 1, or VHV
0, 1, or VHV
0, 1, or VHV
0, 1, or VHV
If the specified block is already write-protected, the
SWP command is ignored, no Acknowledges will be
sent, and the internal write cycle will not be executed.
VHV must be applied to the A0 pin for the entire SWP
command. Then, the command is executed in a
manner similar to an array byte Write command.
Following the Start condition, the ‘0110’ control code
and the three Chip Select bits that correspond to the
desired SWP command (Table 9-2) are transmitted by
the master, along with the R/W bit as a logic ‘0’. After
the 34AA04 responds with an Acknowledge, the
master transmits two dummy bytes, after each of
which the 34AA04 responds with an Acknowledge.
Finally, the master generates a Stop condition, which
initiates the internal write cycle and, during this time,
the 34AA04 will not generate Acknowledge signals
(Figure 9-1).
 2014 Microchip Technology Inc.
DS20005271B-page 15
34AA04
FIGURE 9-1:
SET WRITE PROTECTION
VHV
A0 Pin
Bus Activity
Master
S
T
A
R
T
SDA Line
A1 A1 A1
S 0 1 1 0 2 1 0 0
Control
Byte
P
A2
C
K
Bus Activity
S
T
O
P
Dummy
Byte
Dummy
Byte
A2
C
K
A2
C
K
Note 1: Chip Select bits A0-A2 vary depending on which SWP command is being executed.
2: The 34AA04 will only acknowledge if the specified block is not currently write-protected.
TABLE 9-3:
DEVICE RESPONSE WHEN DEFINING WRITE PROTECTION
Status
Command
Protected with SWPn
Not Protected
9.2
SWPn
CWP
SWPn or CWP
ACK
Address
ACK
Data Byte
ACK
Write Cycle
NoACK
ACK
ACK
Don’t Care
Don’t Care
Don’t Care
NoACK
ACK
ACK
Don’t Care
Don’t Care
Don’t Care
NoACK
ACK
ACK
No
Yes
Yes
Clear All Write Protection (CWP)
The Clear All Write Protection (CWP) command resets
all of the write protection in a single operation. It is
executed in the same manner as a SWP command,
except using the CWP control byte (Table 9-2).
The 34AA04 will always acknowledge and execute a
CWP command if an internal write cycle is not in
progress, regardless of the state of write protection.
9.3
Following the Start condition, the master transmits the
control byte for the desired RPS command (Table 9-2),
with the R/W bit set to logic ‘1’. If the specified block is
not write-protected, the 34AA04 will respond with an
Acknowledge signal. If the block is currently writeprotected, an Acknowledge will not be generated.
Regardless of the result, the master must read at least
one dummy byte from the 34AA04, transmitting a Not
Acknowledge signal after each byte, and generate a
Stop condition to end the command (Figure 9-3).
Read Protection Status (RPS)
The Read Protection Status (RPS) commands provide
a way of determining whether or not the specified
block is currently write-protected.
FIGURE 9-2:
CLEAR ALL WRITE PROTECTION
VHV
A0 Pin
Bus Activity
Master
S
T
A
R
T
SDA Line
S 0 1 1 0 0 1 1 0
Bus Activity
DS20005271B-page 16
Control
Byte
S
T
O
P
Dummy
Byte
Dummy
Byte
P
A
C
K
A
C
K
A
C
K
 2014 Microchip Technology Inc.
34AA04
FIGURE 9-3:
READ PROTECTION STATUS
Bus Activity
Master
S
T
A
R
T
SDA Line
A1 A1 A1
S 0 1 1 0 2 1 0 1
Dummy
Byte
Control
Byte
P
A2
C
K
Bus Activity
S
T
O
P
N
o
A
C
K
Note 1: Chip Select bits A0-A2 vary depending on which RPS command is being performed.
2: The 34AA04 will only acknowledge if the specified block is not currently write-protected.
3: In accordance with the JEDEC spec, the master is allowed to read multiple dummy bytes,
transmitting a Not Acknowledge after each byte.
TABLE 9-4:
DEVICE RESPONSE WHEN READING WRITE PROTECTION STATUS
Status
Protected with SWPn
Not Protected
 2014 Microchip Technology Inc.
Command
ACK
Data Byte
ACK
RPSn
RPSn
NoACK
ACK
Don’t Care
Don’t Care
NoACK
NoACK
DS20005271B-page 17
34AA04
10.0
PACKAGING INFORMATION
10.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
34AA04
e3 3EC
1442
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (3.90 mm)
Example:
XXXXXXXX
XXXXYYWW
NNN
34AA04
e3 1442
3EC
Example:
8-Lead TSSOP
XXXX
AACK
YYWW
1442
NNN
3EC
8-Lead 2x3 TDFN
Example:
ACB
442
3E
XXX
YWW
NN
8-Lead 2x3 UDFN
Example:
CAC
442
3E
XXX
YWW
NN
1st Line Marking Codes
DS20005271B-page 18
Part Number
PDIP
SOIC
TSSOP
TDFN
UDFN
34AA04
34AA04
34AA04
AACK
ACB
CAC
 2014 Microchip Technology Inc.
34AA04
Legend: XX...X
Y
YY
WW
NNN
e3
Note:
Note:
Part number or part number code
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
JEDEC® designator for Matte Tin (Sn)
For very small packages with no room for the JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
 2014 Microchip Technology Inc.
DS20005271B-page 19
34AA04
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
PLANE
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20005271B-page 20
 2014 Microchip Technology Inc.
34AA04
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
 2014 Microchip Technology Inc.
DS20005271B-page 21
34AA04
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005271B-page 22
 2014 Microchip Technology Inc.
34AA04
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2014 Microchip Technology Inc.
DS20005271B-page 23
34AA04
!"#$%
&
!
"#$%&"'""
($)
%
*++&&&!
!+$
DS20005271B-page 24
 2014 Microchip Technology Inc.
34AA04
'(()
'** !"'%
&
!
"#$%&"'""
($)
%
*++&&&!
!+$
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
@"
!"
A!"
E#!7
)("
AA88
E
E
EG
H
(
G3K
L
J;>?
L
%%($$""
1
1;
%
))
1
;
L
1;
1
G3N%
8
%%($N%
81
<
J>?
%%($A
<
<1
A
A
;
J
;
A1
;
18
O
L
O
A%$""
L
A%N%
7
1
L
<
&
1 (13"#%6)#!3'7#!#"7
%&%
!"
"%81%
#%!
%)"
#"
"
%)"
#"
""
6%1;!!"%
< !"
%
8=1;
>?* >"!"
63#"
&&
#
"
8* )!"
'#"#&
#
')
)
!
#
""
& ?J>
 2014 Microchip Technology Inc.
DS20005271B-page 25
34AA04
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005271B-page 26
 2014 Microchip Technology Inc.
34AA04
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2014 Microchip Technology Inc.
DS20005271B-page 27
34AA04
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005271B-page 28
 2014 Microchip Technology Inc.
34AA04
+
,
)-./0012 !"'+,%
&
!
"#$%&"'""
($)
%
*++&&&!
!+$
 2014 Microchip Technology Inc.
DS20005271B-page 29
34AA04
+
,
)-.3/002 !"3+,%
&
!
"#$%&"'""
($)
%
*++&&&!
!+$
DS20005271B-page 30
 2014 Microchip Technology Inc.
34AA04
+
,
)-.3/002 !"3+,%
&
!
"#$%&"'""
($)
%
*++&&&!
!+$
 2014 Microchip Technology Inc.
DS20005271B-page 31
34AA04
APPENDIX A:
REVISION HISTORY
Revision B (10/2014)
• Removed “Preliminary” condition.
• Updated Section 10.0, Packaging Information.
• Minor typographical corrections.
Revision A (03/2014)
Original release of this document.
DS20005271B-page 32
 2014 Microchip Technology Inc.
34AA04
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in
the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration
instructions.
 2014 Microchip Technology Inc.
DS20005217B-page 33
34AA04
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
–
X
/XX
Temperature Package
Range
34AA04:
34AA04T:
Temperature
Range:
I
E
=
=
Package:
P
SN
ST
MNY(1)
=
=
=
=
MUY(1) =
= 1.7V, 4 Kbit I2C Serial EEPROM
= 1.7V, 4 Kbit I2C Serial EEPROM
(Tape and Reel)
-40°C to +85°C
-40°C to +125°C
Examples:
a)
34AA04-I/P: Industrial
1.7V, PDIP package
Temperature,
b)
34AA04-I/SN: Industrial Temperature,
1.7V, SOIC package
c)
34AA04T-E/MUY: Tape and Reel,
Automotive Temperature, 1.7V, UDFN
package
d)
34AA04T-I/MNY: Tape and Reel, Industrial Temperature, 1.7V, TDFN package
e)
34AA04-E/ST: Automotive Temperature,
1.7V, TSSOP package
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Dual Flat, No Lead Package
(2x3x0.75 mm body), 8-lead
Plastic Dual Flat, No Lead Package
(2x3x0.5 mm body), 8-lead
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
DS20005271B-page 34
 2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-747-9
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005271B-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20005271B-page 36
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
 2014 Microchip Technology Inc.
Similar pages