Freescale Semiconductor, Inc. Selector Guide Automotive Analog and Mixed-Signal Products Power Management Products Sensor Products Access and Remote Control Products S08 8-Bit Microcontroller Products S12 and S12X 16-Bit Microcontroller Products S12 MagniV Mixed-signal MCUs 56F8xxx Digital Signal Controller Products Qorivva MPC56xx and MPC55xx 32-Bit Products Image Cognition Processors Quarter 1, 2014 SG187 Q12014 Rev 54 FREESCALE SEMICONDUCTOR ANALOG AND MIXED-SIGNAL PRODUCTS The product categories range from Power Actuation and Communication Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of load control and drivers, including motor control. SMARTMOS™ — Freescale Semiconductor SMARTMOS technology allows designers to interface high-precision components with the harsh automotive environment. Cost-Effective — Ideally suited for rugged automotive applications, SMARTMOS solutions offer a cost-effective blend of analog, digital, and robust power silicon that enables integrated, mixed-signal, power control ICs. Functionality — SMARTMOS solutions implement traditional analog functions with smaller die size, and a modular process produces components with the minimum number of process steps for each circuit, minimizing overhead. Benefits — Freescale Semiconductor SMARTMOS technology brings a wide range of benefits to today’s designs, including component reductions, power flexibility, durability, efficiency, precision, high-performance analog, and robustness. Packaging — Freescale devices may be offered in EPP and RoHS compliant packages. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com www.freescale.com/analog www.freescale.com/powermanagement www.freescale.com/productlongevity www.freescale.com/files/shared/doc/ prod_num_scheme/ANALOGPN.pdf ANALOG AND MIXED-SIGNAL PRODUCTS Power Actuation — Low-Side Switches (Solid State Intelligent Switches) Product Description No of Outputs MC33800 Engine Control IC, with Eight Low-Side Switches, Two Constant Current Low-Side Switches and Six MOSFET gate pre-drivers 8 High-Side or LowSide L MC33810 Engine Control Integrated Circuit capable of driving a combination of four Low-Side loads and four MOSFETs or IGBT gates Engine control power IC, with 3 Low-Side drivers, one pre-driver, +5V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. (1.0 Ω RDS(on)) Configurable Eight Output SPI Controlled Switch (0.8 Ω RDS(on)) Smart Six Output Switch with SPI and Parallel Input Control 4 MC33996 Continuous Current RDS(on) (mΩ) of Current Current Limitation Control1 Each Output (A) Each Output Limitation (A) Standby Max (μA) Status/Fault Reporting Protection Features Packaging Status Open Load detect, Overcurrent protect, Overvoltage protect, Shorted Load detect, Undervoltage protect, Thermal protect Shorted Load detect, Thermal protect 54-pin SOICW Exposed Pad Production EVB 32-pin SOICW Exposed Pad Production EVB Overcurrent, Outputs Short to Battery, Overtemperature Protect Short Circuit, Current Limit, Temp Sense 32-pin SOICW Exposed Pad Production EVB Ref.Dsgn. Production EVB 30-pin HSOP, 32-pin SOICW Exposed Pad, 32-pin QFN Exposed Pad 32-pin SOICW Production 54-pin SOICW Production EVB 8 @ 0.35 2 @ 700 6 @ 1000 2 @ 6.0 6 @ 2.0 30 SPI, Parallel SPI L 1.0 100 6.0 30 SPI, Parallel SPI Status Flags 3 L 2 @ 4.0 1 @ 1.5 2 @ 200 1 @ 1000 2 @ 6.0 1 @ 2.0 2 @ 1000 1 @ 20 Parallel Parallel 8 H/L 0.35 550 1.2 25 SPI w/ 2 PWM SPI 8 L 1.0 375 3.0 10 SPI SPI Short Circuit, Current Limit, Temp Sense 16 Output Hardware Low-Side Switch with 24-Bit Serial Input Control 16 L 0.5 450 1.0 to 2.5 50 SPI SPI MC33999 16 Output Hardware Low-Side Switch with 24-Bit Serial Input Control and 8 Parallel Control 16 L 0.5 450 1.0 to 2.5 50 SPI. Parallel SPI Short Circuit, Current Limit, Temp Sense, Open Load Short Circuit, Current Limit, Temp Sense, Open Load MM912_634 Integrated S12 MagniV Based Relay Drivers with See Embedded MCU + Power/ S12 MagniV Mixed-Signal MCUs (page 10) LIN MC33812 MC33879 MC33882 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (1Q2014) – 2 32-pin SOICW Exposed Pad Production EVB ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Power Actuation — High-Side Switches (Solid State Intelligent Switches) Product Description MC33879 (1.0 Ω RDS(ON)) Configurable Eight Output SPI Controlled Switch MM908E621 Integrated Quad Half-Bridge and Triple High-Side with Embedded MCU and LIN for High End Mirror Integrated Quad Half-Bridge, Triple High-Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror Triple High Side Switch with Embedded MCU+Power+LIN MM908E622 MM908E624 No of High-Side or Outputs Low-Side 8 H/L 1.2 RDS(on) (mΩ) Current Current Limitation Control1 of Each Output Limitation (A) Standby Max (μA) 550 1.2 25 SPI w/ 2 PWM Parallel Status/Fault Reporting SPI Protection Features Packaging Status Short-circuit, Current Limit, Temp 32-pin SOICW Production Sense Exposed Pad EVB See Embedded MCU plus Power (page 11) MM908E625 Quad Half H-Bridge with P/S + HC08 + LIN MM912_634 Integrated S12 MagniV Based Relay See S12 MagniV Drivers with LIN G12 V Multipurpose Low RDSON eXtreme Switches MC12XS2 Maximum Current Each Output (A) Mixed-Signal MCUs (page 11) MC33981 Single High Side Switch (4.0 mΩ), with PWM, Protection and Diagnostics 1 H 40 4 100 5.0 MC33982 Self Protected 2.0 mΩ Switch with Diagnostic and Protection 1 H 60 2 150 5.0 MC33984 Self Protected 4.0 mΩ Switch with Diagnostic and Protection 2 H 30 4 100 5.0 MC33988 Self Protected 8.0 mΩ Switch with Diagnostic and Protection 2 H 30 8 60 5.0 3 X 6, 2 X 17 48, 96 5.0 SPI and Parallel SPI Over-current, Over-temperature, Over-voltage, Under-voltage & Short-circuit protect 2X7 93 5.0 SPI and Parallel SPI 4X9 89 5.0 SPI and Parallel SPI 2 x 10, 2 x 12 78 5.0 SPI and Parallel SPI 2 X 10, 2 X 25 39, 78 5.0 SPI and Parallel SPI 2 x 10, 2 x 35 78 5.0 SPI and Parallel SPI Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit MC12XS3 12V Automotive Exterior Lighting Multichannel eXtreme Switches MC06XS3517 Penta High Side Switch (3 x 6mΩ, 5+1 H 2.8, 5.5 2 x 17 mΩ), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. MC07XS3200 Dual High Side Switch (2 x 7mΩ), with 2 H 6.0 PWM, Protection, Diagnostics and SPI Control MC09XS3400 Quad High Side Switch (4 x 9mΩ), 4 H 6.0 with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 MC10XS3412 Quad High Side Switch (2 x 10 mΩ, 2 x 12 mΩ), with PWM, Protection, Diagnostics and SPI Control MC10XS3425 Quad High Side Switch (2 x 10 mΩ, 4 H 6.0 2 x 25mΩ), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 MC10XS3435 Quad High Side Switch (2 x 12 mΩ, 2 x 35 mΩ), with PWM, Protection, Diagnostics and SPI Control SG187 (Selector Guide) (1Q2014) – 3 Status Pin, Over-current, Over-temperature, Current Monitor, Short-circuit, Under-voltage Lock Temperature Out SPI and SPI Temp Sense, Over/UnderParallel voltage, Shutdown, Over-current, Reverse Polarity, Current Recopy SPI and SPI Temp Sense, Over/UnderParallel voltage, Shutdown, Over-current, Reverse Polarity, Current Recopy SPI and SPI Temp Sense, Over/UnderParallel voltage, Shutdown, Over-current, Reverse Polarity, Current Recopy 16-pin PQFN Production 16-pin PQFN Production EVB 16-pin PQFN Production EVB 16-pin PQFN Production EVB 24-pin PQFN Production EVB 32-pin SOICW Production Exposed Pad 24-pin PQFN Production EVB 24-pin PQFN Production EVB 32-pin SOICW Production Exposed Pad EVB 24-pin PQFN Production EVB ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Power Actuation — High-Side Switches (Solid State Intelligent Switches) (continued) Product Description No of High-Side or Outputs Low-Side 5+1 H Maximum Current Each Output (A) 2.8, 5.5 MC10XS3535 Penta High Side Switch (3 x 10 mΩ, 2 x 35 mΩ), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. MC15XS3400 Quad High Side Switch (4 x 15 mΩ), 4 H 6.0 with PWM, Protection, Diagnostics and SPI Control MC35XS3400 Quad High Side Switch (4 x 35 mΩ), 4 H 6.0 with PWM, Protection, Diagnostics and SPI Control MC35XS3500 Penta High Side Switch (5 x 35 mΩ), 5+1 H 2.8 with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. MC12XS6 External Automotive Lighting Multichannel Scalable eXtreme Switches RDS(on) (mΩ) Current Current Limitation Control1 of Each Output Limitation (A) Standby Max (μA) 3x10, 2x35 44, 88 2.0 SPI and Parallel Status/Fault Reporting SPI Protection Features Packaging Status Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit 24-pin PQFN Production EVB Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit 24-pin PQFN Production EVB 24-pin PQFN Production EVB 24-pin PQFN Production EVB Poduction EVB 15 78 5.0 SPI and Parallel SPI 35 39 5.0 SPI and Parallel SPI 35 39.5 2.0 SPI and Parallel SPI MC07XS6517 Penta High Side Switch (3 x 7 mΩ, 2x 5+1 H 11, 5.5 17 mΩ), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. MC17XS6500 Penta High Side Switch (5 x 17 mΩ), 5+1 H 5.5 with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. MC24XS4 External Automotive Lighting Multichannel Scalable eXtreme Switches 3 x 17 2x7 100, 50 20 SPI Parallel SPI Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit 54-pin SOICW Exposed PAD 5 x 17 50 20 SPI Parallel SPI Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit 32-pin SOICW Production Exposed PAD EVB MC06XS4200 Dual High Side Switch (2 x 6mΩ), with PWM, Protection, Diagnostics and SPI Control (24V) MC10XS4200 Dual High Side Switch (2 x 10mΩ), with PWM, Protection, Diagnostics and SPI Control (24V) MC20XS4200 Dual High Side Switch (2 x 20mΩ), with PWM, Protection, Diagnostics and SPI Control (24V) Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit, Parallel operation Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit, Parallel operation Fail Safe Mode, Over-current Shutdown, Over-temperature, Short-circuit, Parallel operation 2 H 9.0 2X6 30, 90 10 SPI and Parallel SPI 2 H 6.0 2 X 10 18, 55 10 SPI and Parallel SPI 2 H 3.0 2 X 20 9.0, 27 10 SPI and Parallel SPI 24-pin PQFN Production EVB 24-pin PQFN Production EVB 24-pin PQFN Production EVB 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. Power Actuation — H-Bridges and Motor Drivers Main Characteristics Current Limitation (A) 6.5 Current Limitation Standby Max 20 mA Control1 550 1.2 25 µA 8 550 1.2 2 120 2 130 Product Description No of RDS(on) (mΩ) Outputs of Each Output 2 150 MC33186 H-Bridge Driver (5.0 A) 40 V/150 mΩ per FET MC33879 (1.0 Ω RDS(on)) Configurable Eight Output SPI Controlled Switch 8 MC33880 Configurable Eight Output SPI Controlled Switch MC33886 H-Bridge Driver (5.2 A) (1.0 Ω RDS(ON)) Configurable Eight Output SPI Controlled Switch (1.0 Ω RDS(ON)) Configurable Eight Output SPI Controlled Switch 225 mΩ @150°C MC33887 H-Bridge Driver with Sleep Mode (5.2 A) 130 mΩ @ 25°C, sleep mode, current sense Status/Fault Reporting 1 Status Pin Protection Features Packaging Status Short Circuit, Current Limit, Temp Sense 20-pin HSOP Production SPI w/2 PWM SPI Short Circuit, Current Limit, Temp Sense 32-pin SOICW Exposed Pad Production EVB 25 µA SPI w/2 PWM SPI Short Circuit, Current Limit, Temp Sense 32-pin SOICW Production EVB 6.0 20 mA Parallel Short Circuit, Current Limit, Temp Sense 20-pin HSOP Production EVB 6.0 25 μA Parallel 1 Status Pin (Overcurrent / Overtemp) 1 Status Pin (Overcurrent / Overtemp) Short Circuit, Current Limit, Temp Sense 20-pin HSOP, 36-pin PQFN, 54-pin SOICW Exposed Pad Production EVB SG187 (Selector Guide) (1Q2014) – 4 Parallel Power Actuation — H-Bridges and Motor Drivers (continued) Product MC33899 MC33926 MC33931 MC33932 Description Main Characteristics Programmable H-Bridge Power IC Designed to drive a DC motor in both forward and reverse shaft rotation under Pulse Width Modulation (PWM) of speed and torque. 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM’ed up to 20 kHz. 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM'ed up to 11 kHz 5.0 A Throttle Control Dual H-Bridge H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM'ed up to 11 kHz No of RDS(on) (mΩ) Outputs of Each Output Current Limitation (A) Current Limitation Standby Max Control1 Status/Fault Reporting Protection Features Packaging Status 2 100 11.5 50 μA SPI and Parallel SPI Open Circuit detect, Undervoltage, Overtemperature Shutdown, Output Short Circuit Current Limit 30-pin HSOP Production 2 120 8.0 50 μA Parallel Status Flag Output Short Circuit Protect, Overcurrent Limit, Overtemperature 32-pin PQFN Production EVB 2 120 8.0 50 μA Parallel Status Flag Output Short Circuit Protect, Overcurrent Limit, Overtemperature 44-pin HSOP, Production EVB 4 120 50 μA 8.0 Parallel Status Flag 32-pin SOICW with Exposed Pad Output Short Circuit Protect, Overcurrent Limit, Overtemperature 44-pin HSOP, 54-pin SOICW with Exposed Pad Production EVB 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. Power Actuation — H-Bridge Stepper Motors Product MM908E626 Description Main Characteristics Operating Voltage (V) 5 to 28 Stepper Motor Control, Quad Half-Bridge with Embedded MCU and LIN for Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slewrates High Temperature TJ = 135°C Packaging Status 54-pin SOICW Exposed Pad Production EVB (‘625) Power Actuation — Pre-Drivers (High-Side MOSFET Gate Drivers) Product Main Characteristics Operating Voltage (V) Control1 Status Reporting Protection Features Packaging Status SPI 54-pin SOICW Exposed Pad Production EVB SPI, Status Flags Parallel Open Load detect, Overcurrent, Overvoltage, Shorted Load detect, Undervoltage, Thermal Shorted Load detect, Thermal 32-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad Production EVB Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, eight LowSide Switches, and two constant current Low-Side Switches 5.0 to 36 Parallel, SPI Output Drives High/Low-Side, Drive Current 6 H, 2 mA (typ) MC33810 Automotive Engine Control IC Parallel, SPI 4 L, 780 μA (typ) Single cylinder Engine control IC. Engine control IC with four MOSFET/IGBT gate drivers and four Low-Side switches. Engine control power IC, with 3 Low-Side drivers, one pre-driver, +5V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. 4.5 to 36 MC33812 4.5 to 36 Parallel 2L, 4.0 A (typ) 1L, 1.5 A (typ) MC33883 Quad TMOS driver, for fuel injector Quad TMOS driver, in H-Bridge configuration 5.5 to 28/55 4 non-invert CMOS, LSTTL logic n/a None Overvoltage, Undervoltage 20-pinSOICW MC33937 Three-Phase Field Effect Transistor PreDriver Triple High-Side and Low-Side FET pre-drivers, with parallel & SPI control and programmable deadtime (shoot-through protect). 8.0 to 58 Parallel, SPI 3 H, 3 L, 1.0 A (typ) SPI Programmable Deadtime, Reverse Charge Injection 54-pin SOICW Exposed Pad MC33800 Description Overcurrent, Outputs Short to Battery, Overtemperature Protect Production EVB Ref.Dsgn. Production EVB Production EVB 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boar Product MC33797 Description Four Channel Squib Driver IC Main Characteristics Four-Channel High-Side and Low-Side 2.0 A FET Switches, Externally Adjustable FET Current Limiting, Adjustable Current Limit Range: 0.8 A to 2.0 A, 8-Bit SPI for Diagnostics and FET Switch Activation, Diagnostics for High-Side Safing Sensor Status SG187 (Selector Guide) (1Q2014) – 5 Regulation Voltage 7.0 to 35 Operating Voltage (V) 4.75 to 5.25 Packaging Status 32-pin SOICW Production ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Power Actuation — Powertrain Control and EnginManagement Product Description Main Characteristics MC33800 Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, eight LowSide Switches, and two constant current Low-Side Switches. MC33810 Automotive Engine Control IC MC33811 MC33812 Solenoid Monitor Integrated Circuit See Signal Conditioning (page 7) Single cylinder Engine control IC MC33813 One Cylinder Small Engine Control IC Engine control IC with four MOSFET/IGBT gate drivers and four Low-Side Switches. 5 input solenoid monitoring to verify proper electrical and mechanical solenoid operation. Engine control power IC, with 3 Low-Side drivers, one pre-driver, +5V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. Engine control analog power IC intended for one cylinder motorcycle and other small engine control applications. Includes ISO9141 coomunication interface. MC33814 Two Cylinder Small Engine Control IC Engine control analog power IC intended for two cylinder motorcycle and other small engine control applications. Includes ISO9141 coomunication interface. MC33816 Engine Control IC with Smart Gate Control A 12-channel gate driver IC for automotive engine control applications. The IC consist of five external MOSFET high side pre-drivers and seven external MOSFET low side pre-drivers. Also contains four independent and concurrent digital microcores Designed to drive a DC motor in both forward and reverse shaft rotation under pulse-width modulation (PWM) of speed and torque. Can be controlled by SPI or parallel control lines. H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM’ed up to 20 KHz Triple High-Side and Low-Side FET pre-drivers, with parallel & SPI control and programmable deadtime (shoot-through protect). 22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power mode interrupt capability, wake-up. Can supply current to external sensors. MC33899 Programmable H-Bridge Power IC MC33926 5.0 A Throttle Control H-Bridge MC33937 Three-Phase Field Effect Transistor Pre-Driver MC33975 22 input Multiple Switch Detect Interface with 32 mA Wetting Current and Wake-up See Signal Conditioning (page 8) 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (1Q2014) – 6 Peak Current Limit (A) 2 @ 6.0 6 @ 2.0 1 @ 2.8 1 @ 1.0 6.0 RDSON (mΩ) 2 @ 700 6 @ 1000 1 @ 250 1 @ 1000 100 — — 2 @ 6.0 1 @ 2.0 1 @ 3.0 1 @ 6.0 2 @ 2.4 1 @ .110 2 @ 3.0 1 @ 6.0 2 @ 2.4 1 @ .110 Control1 SPI, Parallel Operating Voltage (V) 5.0 to 36 4.5 to 36 Packaging Status 54-pin SOICW Exposed Pad Production EVB 32-pin SOICW Exposed Pad 16-pin SOICW SPI, Parallel SPI 10.5 to 15.5 2@200 1@1000 Parallel 4.5 to 36 32-pin SOICW Exposed Pad 1 @ 400 1 @ 300 2 @ 1500 1 @ 20000 2 @ 400 1 @ 300 2 @ 1500 1 @ 20000 SPI, Parallel 6.0 to 18 48-pin LFQP, Exposed Pad Production EVB Production EVB Production EVB Ref.Dsgn. Production EVB SPI, Parallel 6.0 to 18 48-pin LFQP, Exposed Pad Production EVB SPI Parallel 9.0 to 16 64-pin LQFP Exposed Pad Jan. 2014 EVB - - 15.0 90 SPI, Parallel 6.0 to 26.5 30-pin HSOP Production 8.0 120 Parallel 8.0 to 28 32-pin PQFN Production EVB — — 8.0 to 58 — — SPI, Parallel SPI 54-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad Production EVB Production EVB 5.5 to 26.5 ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Communication Transceivers — CAN Physical Interface Components Product MC33742 MC33889 MC33897 Description System Basis Chip with Enhanced High-Speed CAN (250k to 1Mbps) System Basis Chip Lite with Low-Speed CAN Single-wire CAN Main Characteristics Low or high (33.3 kbps or 83.3) kbps data rates, wake-up capability (GMW3089 v2.3 compatible) System Basis Chip with High-Speed CAN See System Basis Chip (page 9) MC33901 High-Speed CAN Transceiver Single CAN high-speed physical layer provides operation up to 2 Mbps and the physical interface between an MCU and the physical dual wires of the CAN bus. MC33903 System Basis Chip(SBC)-Gen 2with High Speed CAN & LIN Interfaces System Basis Chip (SBC)-Gen 2-with High Speed CAN Interface System Basis Chip (SBC)-Gen 2-with High Speed CAN & LIN Interfaces Safe System Basis Chip with Buck and Boost DC/DC up to 800 mA Safe System Basis Chip with Buck and Boost DC/DC up to 1.5 A System Basis Chip with CAN, LIN and Multiple Switch-to-Ground Interface MC33905 MC33907 MC33908 MC33909 Operating Voltage (V) Single-wire CAN 6.0 to 27 45 CAN HS dual wire 4.5 to 5.5 - Other Features Control and Status Reporting1 Protection Features Packaging Status 60 Regulator Control Output Waveshaping, Undervoltage lockout detect and loss of GND 2 Mode Control Pins Thermal shutdown, current limit 14-pin SOICN Production 5.0 CAN bus wake-up. TXD dominant timeout, 3.3 or 5.0 V MCU I/O Parallel High system ESD spec. 8-pin SOICN 2Q 2014 Current Limitation Standby (μA) Typ Max See System Basis Chip (page 10 MC33989 MC33904 Bus Type and Standard See System Basis Chip (page 10) 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (1Q2014) – 7 ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Communication Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components Product Description Main Characteristics Operating Voltage (V) Current Limitation Standby (μA) Typ Max 20 50 LIN Single-wire 7.0 to 18 ISO9141 8.0 to 18 — Other Features Control and Status Reporting1 Protection Features Packaging Status Wake-up input pin, control of external voltage regulator Parallel Current limitation, Thermal protection 8-pin SOICN Production EVB 50 Data rates up to 50 Kbps Serial 8-pin SOICN Compatibility with 5.0 V and 3.3 V micros, wake-up input control of external regulator Active bus waveshaping, EMI immunity, Local & Remote wakeup Active bus waveshaping, EMI immunity, 2 wake-up input pins, Compatibility with 5.0 V and 3.3 V micros MCU watchdog timer, +5V pre-regulator for MCU, MCU power on RESET Output short circuit Thermal protection Current limitation, Thermal protection Production EVB Production EVB MC33399 Local Interconnect Network (LIN) Physical Layer MC33660 ISO K Line Serial Link Interface MC33661 eLIN – Enhanced LIN Physical Layer Selectable slew rate for operations at (Local Interconnect Network) 10, 20, 100 kbps; bus short to ground fail safe; excellent EMC behavior. LIN Single-wire 7.0 to 18 8.0 12 MC33662 LIN 2.1/SAE J2602-2 LIN Physical Layer Transceiver LIN single wire, SAE J2602- 7.0 to 18 6.0 11 MC33663 LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer Transceivers LIN Single-wire, SAE J2602-2 7.0 to 18 12 36 MC33812 Single cylinder Engine control IC ISO-9141 4.5 to 36 — — MC33903 System Basis Chip(SBC)-Gen 2-with High Speed CAN & LIN Interfaces System Basis Chip (SBC)-Gen 2with High Speed CAN & LIN Interfaces Safe System Basis Chip with Buck and Boost DC/DC up to 800 mA Safe System Basis Chip with Buck and Boost DC/DC up to 1.5 A System Basis Chip with LIN, CAN and Multiple Switch-to-Ground Interface System Basis Chip with High-Side Drivers and LIN Physical Interface System Basis Chip with DC Motor Pre-driver and LIN Physical Interface System Basis Chip with DC Motor Pre-driver and Current Sense and LIN Physical Interface MC33905 MC33907 MC33908 MC33909 MC33910 MC33911 MC33912 Offers speed communication from 1.0 kbps to 20 kbps, and up to 60 kbps for Programming Mode. It supports LIN Protocol Specification 1.3. ISO9141 physical interface device Bus Type and Standard Single wire LIN supports normal baud rates of 10 kbps (J) or 20 kbps (L) and fast rate of 100 kbps Integrates two physical layer LIN bus transceivers. The devices offer baud rates of 10 and 20 kbps as well as 100 kbps for test/programming modes. Engine control power IC, with 3 LowSide drivers, one pre-driver, +5V preregulator, ISO-9141 physical interface and MCU watchdog circuit. See System Basis Chip (page 10) 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (1Q2014) – 8 Parallel 8-pin SOICN Parallel Current limitation, Thermal protection 8-pin SOICN Production EVB Parellel Over-temperature protection, Output short circuit 14-pin SOICN Production Parallel Overcurrent Outputs Short to Battery, Overtemperature Protect 32-pin SOICW Production EVB Ref.Dsgn. ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Communication Transceiver - Distributed Systems Interface (DSI) Components Product MC33780 MC33781 MC33784 MC33789 MC33790 MC33793 Description Main Characteristics Max Data Rate Dual DSI Master with Differential Drive Bus controller for two differential DSI channels. SPI port for uC interface. Variable CRC generation and detection, thermal protection, frequency spreading. Quad DSI Master with Differential Drive Bus controller for four differential DSI channels. Dual SPI ports for uC and safing interfaces. Variable CRC generation and detection, comprehensive fault detection, thermal protection, frequency spreading DSI Sensor Interface DSI slave device optimized as a sensor interface. Differential bus capability & dual bus switches for improved EMC performance, 2-channel 10-bit ADC, 5.0V regulated output, 3 configurable logic pins, CRC generation and checking. Airbag System Basis Chip (IC) (SBC) Air bag control module which monitors battery voltage, sensor status and supplies various voltages to the air bag system. Uses SPI for MCU communication. Uses PSI5 for satellite sensors communication. Distributed System Interface (DSI) Dual current-limited waveshaped outputs, Physical Interface (DSIP) current sensing inputs, 3.3 V and 5.0 V DSI Sensor Interface DSI slave device. 5.0 V regulated output, 4 configurable I/O pins (logic I/O or 8-bit ADC), fault tolerant, logic output high current buffer. 150 kbps Operating Temp Bus Sw. Resistance, Range (°C) typ/max (Ω) -40 to +85 n/a Packaging Status 16-pin SOICW Production 200 kbps -40 to +90 n/an/a 32-pin SOICW Exposed Pad Production n/a -40 to +150 3.0/6.0 16-pin SOICN Production 125 kbps -40 to +125 n/a 64-pin LQFP Exposed Pad 5 - 150 kbps -40 to +85 6.0 16-pin SOICW Production EVB (contact sales) Production n/a -40 to +125 4.0/8.0 16-pin SOICN Production Signal Conditioning Product Description Main Characteristics MC33811 Solenoid Monitor Integrated Circuit 5 input solenoid monitoring to verify proper electrical and mechanical solenoid operation. MC33972 22 input Multiple Switch Detect Interface with 16 mA Wetting Current and Suppressed Wake-up Multiple switch detection interface with suppressed wake-up designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 configurable), wetting current of 2.0 mA or 16 mA. 22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power mode interrupt capability, wake-up. Can supply current to external sensors. MC33975 22 input Multiple Switch Detect Interface with 32 mA Wetting Current and Wake-up SG187 (Selector Guide) (1Q2014) – 9 Switch Monitor Voltage (V) 0 to 64 Operating Voltage (V) 10.5 to 15.5 -14 to 38 5.5 to 26 -14 to 40 -14 to 38/40 5.5 to 26.5 Packaging Status 16-pin SOICW Production EVB 32-pin SOICW, 32-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad Production EVB Production EVB ANALOG AND MIXED-SIGNAL PRODUCTS (continued) System Basis Chip Product MC33742 MC33789 Description Main Characteristics System Basis Chip with Enhanced High- SBC, Dual VREG, Enhance HS CAN with Speed CAN (250K to 1Mbps) Bus failure diagnostic capability, 4 wakeup inputs. Airbag System Basis Chip (SBC) with Air bag control module which monitors Power Supply and PSI5 Sensor battery voltage, sensor status and Interface supplies various voltages to the air bag system. Uses SPI for MCU communication. Uses PSI5 for satellite sensors communication. System Basis Chip with Low-Speed Dual 5.0 V regulators LS CAN, Fault Tolerant CAN 2 wake-up inputs Bus Type and Standard Operating Voltage (V) Current Other Features Limitation Standby (μA) Typ M ax 60 150 Low power modes, remote and local wake-up capabilities CAN High-Speed dual wires 5.5 to 27 PSI5 5.2 to 20 - - CAN Low-Speed, dual wires 5.5 to 27 60 100 Control and Status Reporting1 Protection Features Packaging Status SPI Current and thermal protection for CAN and regulator 28-pin SOICW, 48-pin QFN Production EVB SPI Safing state machine, Scrap mode 64-pin LQFP Exposed Pad Production EVB (contact sales) SPI Fault tolerant 28-pin SOICW Production EVB “Secured” SPI Overcurrent, Overtemperature, Short circuit, protec 32-pin SOICW Exposed Pad Production EVB “Secured” SPI Overcurrent, Overtemperature, Short circuit and undervoltage detect Overcurrent, Overtemperature, Short circuit and undervoltage detect 32-pin SOICW Exposed Pad Production EVB(‘905) 32-pin SOICW Exposed Pad, 54-pin SOICW Exposed Pad Production EVB MC33903 System Basis Chip(SBC)-Gen 2-with High Speed CAN & LIN Interfaces High speed CANand 1 or 2 LIN physical interface. 5.0 or 3.3 V VDD regulator. CAN high-speed, dual wires, LIN single wire 5.5 to 27 15 35 MC33904 System Basis Chip (SBC)-Gen 2-with High Speed CAN Interface High speed CAN physical interface. 5.0 or CAN high-speed, 3.3 VDD and VAux regulators, w/current dual wires sharing 5.5 to 27 15 35 MC33905 System Basis Chip (SBC)-Gen 2-with High Speed CAN & LIN Interfaces High speed CAN & 1 or 2 LIN physical interfaces. 5.0 or 3.3 VDD and VAux regulators, w/current sharing. CAN high-speed, dual wires. LIN single wire 5.5 to 27 15 35 MC33907 Safe System Basis Chip with Buck and Boost DC/DC up to 800 mA 5.6 to 40 32 60 MC33908 Safe System Basis Chip with Buck and Boost DC/DC up to 1.5 A 5.6 to 40 32 60 Safe Assure product MC33909 System Basis Chip with CAN, LIN Multiple Switch-to-Ground Interface 3.5 to 27 125 - MC33910 System Basis Chip with High-Side Drivers and LIN Physical Interface 5.5 to 18 48 80 MC33911 System Basis Chip with DC Motor Predriver and LIN Physical Interface 5.5 to 18 48 80 MC33912 System Basis Chip with DC Motor Predriver and Current Sense and LIN Physical Interface. System Basis Chip with High-Speed CAN CAN high-speed, Multiple switching and linear voltage dual wires. regulators, built-in enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards. Multiple switching and linear voltage CAN high-speed, regulators, built-in enhanced high speed dual wires. CAN interface fulfills the ISO11898-2 and -5 standards. Two high speed CAN interfaces plus four CAN high-speed, LINs, compatible with specification 2.1 dual wires. and SAEJ2602-2. Also contains 17 switch LIN single wire to ground inputs for switch detection. LIN 2.0 compatible, 5.0 V/60 mA LDO, LIN Single-wire 2 High-Side drivers w/PWM, 1 analog/ digital input LIN 2.0 compatible, 5.0 V/60 mA LDO, LIN Single-wire 1 High-Side driver & 2 Low-Side drivers w/PWM, 2 analog/digital inputs LIN 2.0 compatible, 5.0 V/60 mA LDO, LIN Single-wire 2 High-Side drives & 2 Low-Side drivers w/PWM, 4 analog/digital inputs Safing state machine, 9 switch input monitors, 2 config. high/low side drivers, Power-on-reset, watchdog timer, Squib energy reserve Dual voltage regulator, Watchdog, wake-up input, sleep and stop modes Fail-safe state machine, Configurable I/O, MUX - out, pin compatible with MC33905 Fail-safe state machine, Configurable I/O, MUX out, pin compatible with MC33905 Fail-safe state machine, Configurable I/O, MUX out, SAFE output, Low power modes w/INT and RST capability. Safe Assure product 5.5 to 18 48 80 Hall Sensor supply, Configurable Window Watchdog, Current Sense SPI 5.5 to 27 80 150 Dual voltage regulator, Watchdog, wake-up input, sleep and stop modes SPI MC33889 MC33989 Dual 5.0 V regulators HS CAN, 4 wake-up inputs “Secured” SPI “Secured” SPI Over-current, Overtemperature, Over & Under-voltage detect 48-pin LQFP Exposed Pad Feb. 2014 “Secured” SPI Over-current, Overtemperature, Over & Under-voltage detect 48-pin LQFP Exposed Pad Feb. 2014 Watchdog timer, Switched inputs wake-up, Fail safe mode SPI Over Voltage 64-pin LQFP Exposed Pad 3Q2013 Hall Sensor supply, Configurable Window Watchdog Configurable Window Watchdog SPI Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset 32-pin LQFP Production EVB (‘912) 32-pin LQFP Production EVB (‘912) 32-pin LQFP Production EVB Current limitation, thermal 28-pin SOICW Production EVB MCU Reference MCU Detail Additional Information 16-Bit MCU S12 16-Bit core, 128K/96K Bytes Flash, 6K Bytes RAM, Selectable Internal or external temp CPU12_V1 4K bytes data Flash, ESCI, 16-bit 4 Channel Timer, sense, GPIO, including SPI functionality, Internal Clock Generator, BDM internal or external oscillator. Window Watchdog with Selectable Timing, Normal/Stop/Sleep/Crank Mode Ctrl. High Voltage Wake-up Inputs, Packaging 48-pin QFN, Exposed Pad Status Production EVB CAN High-Speed, dual wires SPI 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Embedded MCU + Power Product MM912_637 Description Xtrinsic Battery Sensor with LIN for 12V Lead-acid Batteries Main Characteristics Simultaneous Battery voltage & current measurement with 16-bit sigma-delta ADC & IIR filter. Voltage Regulators: 2.5 V/10mA & 60mA, 5.0 V/80 mA. LIN 2.1 Physical Layer w/Selectable Slew rates and triggered wake-up, SG187 (Selector Guide) (1Q2014) – 10 ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Embedded MCU + Power Product MM9Z1_638 Description Xtrinsic Battery Sensor with CAN and LIN MM912_P812 S12P MCU and Multifunctional Ignition and Injector Driver System In Package (SiP) Main Characteristics This is a fully integrated battery monitoring device. The device supports precise current measurement via an external shunt resistor. The MM9Z1_638 includes LIN 2.2 protocol and physical interface, and an MSCAN protocol controller, An engine control IC combining an MCU (S12P) and analog control die (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications. MM912_S812 S12XS MCU and Multifunctional An engine control IC combining an MCU Ignition and Injector Driver System In (S12XS) and analog control die Package (SiP) (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications. MCU Reference MCU Detail 16-Bit MCU S12Z MCU with 128 KB Flash, 8 KB RAM, 4 KB S12Z EEPROM 16-Bit MCU S12P The MCU S12P has 6 KB RAM, and flash memory size of 96 KB or 128 KB. The S12P family uses many of the same features found on the S12XS family, including error correction code (ECC) on flash memory, a separate data-flash module for diagnostic or data storage, a fast analog-to-digital converter (ATD), and a frequency modulated phase locked loop (IPLL) that improves electromagnetic compatibility (EMC). 16-Bit MCU S12XS The MCU S12XS has 8 KB or 12 KB RAM, and flash memory size of 128 KB or 256 KB. The S12XS family uses many of the same features found on the S12P family, including error correction code (ECC) on flash memory, a separate data-flash module for diagnostic or data storage, a fast analog-to-digital converter (ATD), and a frequency modulated phase locked loop (IPLL) that improves the electromagnetic compatibility (EMC) performance. Additional Information Four battery voltage measurements with internal resistor dividers, and up to five direct voltage measurements for use with an external resistor divider. Measurement synchronization between voltage channels and current channels. Packaging 48-pin QFN Exposed Pad Analog functions consists of three 100 lead LQFP, integrated low side drivers, one pre-driver, Exposed Pad a +5.0 V, voltage pre-regulator, an MCU watchdog circuit, an ISO 9141 K-Line interface, and a parallel interface for MCU communication. The three low side drivers are provided for driving a fuel injector, a lamp or LED, and a relay, another injector or fuel pump. Analog functions consists of three 100 lead LQFP, integrated low side drivers, one pre-driver, Exposed Pad a +5.0 V, voltage pre-regulator, an MCU watchdog circuit, an ISO 9141 K-Line interface, and a parallel interface for MCU communication. The three low side drivers are provided for driving a fuel injector, a lamp or LED, and a relay, another injector or fuel pump. Status 1Q 2014 (EVB- In Dsgn.) Production Ref.Dsgn. Production Ref. Dsgn. S12 MagniV Mixed-signal MCUs Product MM912_634 Description Main Characteristics Cascaded dual Voltage Regulator 2.5 V/ Integrated S12 MagniV Based Relay 50 mA and 5.0 V/80 mA, LIN Physical Drivers with LIN Layer with Selectable Slew rates, Window Watchdog with SelectableDual High-Side and Dual Low Side Switches with Embedded S12 MCU + Power + LIN Power Features 7 Ω High-Side Switches, 2.5 Ω Low-Side Switches for relay drivel MCU Reference 16-Bit MCU MCU Detail S12 16-Bit Core, 32KB Flash, 2KB RAM, ESCI, Multi channel 10-bit ADC, 16-bit 4 Channel Timer, Internal Clock Generator Additional Information High Voltage Wake-up Inputs, Selectable Gain I-Sense, Battery Voltage Sense. Timing, Normal/ Stop/Sleep Mode Control, Hall Supply of 18 V/30 mA Packaging 48-pin LQFP Exposed Pad Status Production EVB Additional Information 2/3 Pin Hall Sensor Input, Analog Input with Current Source, 40 V Rated Wake-up Input, Vsup, Chip Temp. and Current Sensing Packaging 54-pin SOICW Exposed Pad Status Production 2/3 Pin Hall Sensor Input, Analog Input with Current Source, 40 V Rated Wake-up Input, Vsup, Chip Temp. and Current Sensing 54-pin SOICW Exposed Pad Production Operational Amplifier, 2 x 40 V Rated Wake-up Inputs 54-pin SOICW Production EVB 3 x 2 Pin Hall Sensor Inputs with Cyclic Wake-up Feature, Analog Input with Current Source, Vsup, Chip Temp. and Current Sensing Vsup, Chip Temperature and Current Sensing 54-pin SOICW Exposed Pad Production EVB S12V MagniV MCU See Page 26 for S12V MagniV MCUs information Products ANALOG AND MIXED-SIGNAL PRODUCTS (continued) 8-bit Intelligent Distributed Controllers Product MM908E621 MM908E622 MM908E624 MM908E625 MM908E626 Description DC Motor/Mirror Control and LIN Mirror Control, Integrated Quad HalfBridge and Triple High-Side with Embedded MCU and LIN Main Characteristics Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog, “Normal/Stop/ Sleep Mode “Control Power Features 2 x 275 mΩ Half-Bridges; 2 x 750 mΩ Half-Bridges; 1 x 185 mΩ High-Side; 2 x 440 mΩ High-Side; Switched 5.0 V Output (25 mA) DC Motor/Mirror Control and LIN Voltage Regulator 5.0 V/60 mA, LIN 2 x 275 mΩ Half-Bridges; Mirror Control, Integrated Quad Half- Physical Layer with Selectable Slew 2 x 750 mΩ Half-Bridges; Bridge, Triple High-Side and EC rates, Window Watchdog, “Normal/Stop/ 1 x 185 mΩ High-Side; Glass Driver with Embedded MCU Sleep Mode “Control 2 x 440 mΩ High-Side; and LIN Switched 5.0 V Output (25 mA) EC Glass Driver DC Motor Control Using Relays (for Voltage Regulator 5.0 V/50 mA, LIN 1 x 7 Ω High-Side, example, Window Lift, Sun Roof, and Physical Layer with Selectable Slew 2 x 2.5 Ω High-Side Switches for Power Seats), Triple High-Side rates, Window Watchdog with Selectable Relay Control Switch with Embedded MCU + Timing, Normal/Stop/Sleep Mode Control Power + LIN Mirror Control, Stepper Motor Voltage Regulator 5.0 V/60 mA, LIN 4 x 400 mΩ Half-Bridges with Control, Door Lock Quad Half-Bridge Physical Layer with Selectable Slew Current Control; and Single High-Side with rates, Timeout Watchdog with Periodic 1 x 600 mΩ High-Side; Embedded MCU and LIN Wake-up Feature, Normal/Stop Modes Switched 5.0 V Output (25 mA) Stepper Motor Control, Quad HalfVoltage Regulator 5.0 V/60 mA, LIN Bridge with Embedded MCU and LIN Physical Layer with Selectable Slew rates. High Temperature use, TJ = 135×C MCU Reference MCU Detail HC08 Core, 16K Flash, 512 Bytes RAM, ESCI, 8-Bit MCU 8-Channel 10-bit ADC, MC68HC908EY16 Two 16-bit 2 Channel Timers, Internal Clock Generator 4 x 400 mΩ Half-Bridges with Current Control; Switched 5.0 V Output (24 mA) SG187 (Selector Guide) (1Q2014) – 11 54-pin SOICW Production Exposed Pad EVB (‘625) FREESCALE SEMICONDUCTOR POWER MANAGEMENT PRODUCTS The Power Management products portfolio provides solutions for Linear and Switching voltage regulators. Hot Swap control and Power over Ethernet devices for use in applications ranging from Consumer and Industrial to Automotive. SMARTMOS™ — Freescale Semiconductor SMARTMOS technology allows designers to interface high-precision components with the harsh automotive environment.. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com www.freescale.com/analog www.freescale.com/powermanagement www.freescale.com/productlongevity POWER MANAGEMENT PRODUCTS Power Management — Linear Regulators Product Description Main Characteristics MC33730 Switch Mode Power Supply with Multiple Linear Regulators and Power Sequencing Step-down Switching regulator (2.0 A), with 3 Programmable Linear Regulators (15 mA, 15 mA, 15 mA) and two 5.0 V Sensor supplies (100 mA, 100 mA). MC33742 System Basis Chip with enhanced High-Speed CAN (250k to 1Mbps) System Basis Chip with Low-Speed Fault Tolerant CAN System Basis Chip(SBC)Gen 2-with High Speed CAN & LIN Interfaces System Basis Chip(SBC)Gen 2-with High Speed CAN Interfaces System Basis Chip(SBC)Gen 2-with High Speed CAN & LIN Interfaces System Basis Chip with High-Speed CAN See System Basis Chip (Page 10) MC33889 MC33903 MC33904 MC33905 MC33989 Bus Type and Standard n/a Operating Current Other Features Voltage (V) Limitation Standby (μA) Typ Max 4.5 to 28 150 — Programmable voltage regulator, power sequencing, adjustable OSC - Switcher Diagnostics1 None Protection Features Packaging Status Reverse Battery 32-pin SOICW Protect, Undervoltage and Overvoltage Lockout, Reset monitor signals for regulators (4) Production EVB 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. Power Management — Switching Regulators Product MC33730 Description Switch Mode Power Supply with Multiple Linear Regulators and Power Sequencing Main Characteristics Step-down Switching regulator (2.0 A), with 3 Programmable Linear Regulators (15 mA, 15 mA, 15 mA) and 2 x 5.0 V sensor supply (100 mA, 100 mA) Operating Voltage (V) 4.5 to 28 SG187 (Selector Guide) (1Q2014) – 12 Output Voltages 4.9 to 5.1 V, 2.0 to 3.3 V, 1.5 to 3.3 V, 1.0 to 5.0 V, 5.0 V Protection Features Reverse Battery Protect, Undervoltage and Overvoltage Lockout, Reset monitor signals for regulators (4) Packaging 32-pin SOICW Status Production EVB ANALOG AND MIXED-SIGNAL PRODUCTS (continued) Automotive Alternator Voltage Regulators (LIN 1.3 protocol compliant) Product TC80310 Description An integrated circuit intended to regulate the output voltage of an automotive alternator. It supplies a current via a high side MOSFET to the excitation coil of the alternator and provides an internal freewheeling diode. Main Characteristics Bus Type Operating Voltage (Vdc) Regulation Voltage (VDC) High side field driver, Internal freewheeling diode, Up to 8.0 A rotor current (excitation coil), Load response control (LRC), LIN interface, Set point voltage selectable LIN 8 to 27 150 Other Features Factory Selectable Features: LRC Rate, LRC disable RPM, Self start, Self start threshold, Alternator Pole pairs, Thermal Fault Threshold, Thermal Compensation Threshold, Phase Sensitivity, Phase Start Regulating RPM, Phase Stop Regulating RPM Note: Choice of 16 parametric fields may be specified by the customer. Contact sales for specific parameter combinations and part numbering. SG187 (Selector Guide) (1Q2014) – 13 Diagnostics Protection Features Packaging Status LIN communication used for Electrical, Mechanical and Thermal fault reporting Load Dump Protection, Thermal protection, Thermal compensation Die Production FREESCALE SEMICONDUCTOR AUTOMOTIVE SENSORS Freescale is a leading sensor supplier for automotive safety for airbags, Tire Pressure Monitoring Systems (TPMS), Electronic Stability Control (ESC) and for engine management with barometric absolute pressure (BAP) and manifold absolute pressure (MAP) applications.. Our Zero Defects process, Automotive Electronics Council (AEC) membership and functional safety with Safe Assure are critical in providing world-class quality solutions from entry-level to the high end. Applications — Freescale Semiconductor automotive sensors are designed for a variety of applications ranging from safety and performance to comfort and control. Our sensors are used in under-hood and in-cabin applications, and are compatible with Freescale analog product, power management and microcontroller families. For additional information, visit www.freescale.com/automotive AUTOMOTIVE SENSORS Pressure Sensors Product Maximum Pressure Rating (kPa) Full Scale Span Voltage (Typical) (Vdc) Sensitivity (mV/kPa) Accuracy 0°C to 85°C (% of VFSS) Packaging Status MPX4100A 105 4.6 54 MPXAZ4100A 105 4.6 54 ±1.8 Small Outline Package (SOP) Available ±1.8 SOP — media resistant package MPX4115 115 115 4.6 4.4 Available 46 38 ±1.5 ±1.5 Super-Small Outline Package (SSOP) SSOP Available Available MPX4250 250 250 4.7 4.7 20 19 ±1.5 ±1.4 SSOP SSOP Available Available MPXV5004 MPXV5010G 4 3.9 1000 ±2.5 SOP Available 10 4.5 450 ±5.0 SOP MPX5100 Available 100 4.5 45 ±2.5 6-pin unibody package Available MPX5700 700 4.5 6.4 ±2.5 6-pin unibody package Available MPX5999D 1000 4.5 4.5 ±2.5 6-pin unibody package Available MPXH6101 102 4.6 54 ±1.8 SSOP Available MPXV6115V 115 4.6 45.9 ±1.5 SOP Available MPXV7007 7 4.0 286 ±5.0 SOP Available MPXV7025 25 4.5 90 ±5.0 SOP Available Barometric Absolute Pressure (BAP) and Manifold Absolute Pressure (MAP) Sensors Product Maximum Pressure Rating (kPa) Full Scale Span Voltage (Typical) (Vdc) Sensitivity (mV/kPa) Accuracy 0°C to 85°C (% of VFSS) Packaging Status MPXH6101A 102 MPXA6115A 115 4.6 54 ±1.8 Super-Small Outline Package (SSOP) Available 4.6 45.9 ±1.5 SOP MPXAZ6115A Available 115 4.5 45.9 ±1.5 SOP Available MPXHZ6115 115 4.5 45.9 ±1.5 SSOP Available MPXHZ6115A 115 4.5 45.9 ±1.5 SSOP Available MPXH6250A 250 4.7 20 ±1.5 SSOP Available MPXHZ6250 250 4.7 20 ±1.5 SSOP Available MPXH6300 300 4.7 16 ±1.8 SSOP Available MPXH6400 400 4.7 12 ±1.5 SSOP Available MPXHZ6400 400 4.7 12 ±1.5 SSOP Available MPXHZ9115A6T1 115 4.5 45 ±1.5 SSOP 3Q2013 MPXHZ9250A6T1 250 4.5 19.1 ±1.5 SSOP 3Q2013 MPXHZ9400A6T1 400 4.5 11.7 ±1.5 SSOP 3Q2013 MPXHZ9105A6T1 105 4.5 50 ±1.5 SSOP 3Q2013 MPXHZ9115AC6T1 115 4.5 45 ±1.5 SSOP 3Q2013 MPXHZ9250AC6T1 250 4.5 19.1 ±1.5 SSOP 3Q2013 MPXHZ9400AC6T1 400 4.5 11.7 ±1.5 SSOP 3Q2013 SG187 (Selector Guide) (1Q2014) – 14 AUTOMOTIVE SENSORS (continued) Inertial Sensors1 Product Sensing Direction Acceleration (±g) Sensitivity (mV/V/g) Sensitivity (count/g) Temperature Range Roll-Off Frequency Analog Digital Communication Packaging Status Analog Sensors: MMA1260KEG Z 1.5g 240 — -40°C to +105°C 50 Hz Yes — — 16-pin SOIC Available MMA1270KEG Z 2.5g 150 — -40°C to +105°C 50 Hz Yes — — 16-pin SOIC Available MMA1250KEG Z 5g 80 — -40°C to +105°C 50 Hz Yes — — 16-pin SOIC Available MMA1220KEG Z 8g 50 — -40°C to +85°C 250 Hz Yes — — 16-pin SOIC Available MMA2240KEG X 7g 300 — -40°C to +125°C 50 Hz Yes — — 16-pin SOIC Available MMA2244KEG X 20g 100 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA2201KEG X 40g 10 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA2202KEG X 50g 8 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA2204KEG X 100g 4 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA2300KEG X 250g 1.6 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA2301KEG X 200g 2 — -40°C to +125°C 400 Hz Yes — — 16-pin SOIC Available MMA3201KEG XY 40g 10 — -40°C to +125°C 400 Hz Yes — — 20-pin SOIC Available MMA3221KEG XY 50/20 40/100 — -40°C to +125°C 400 Hz Yes — — 20-pin SOIC Available MMA3204KEG XY 100/30g 4/13 — -40°C to +125°C 400 Hz Yes — — 20-pin SOIC Available MMA3202KG XY 100/50g 4/8 — -40°C to +125°C 400 Hz Yes — — 20-pin SOIC Available MMA621010KEG XY 100/100 4.68/4.68 — -40°C to +125°C 400 Hz Yes — — 20-pin SOIC Available Digital Sensors: MMA5106KW Z 60g — 8 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5112KW Z 120g — 4 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5124KW Z 240g — 2 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5148KW Z 480g — 1 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5206KW X 60g — 8 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5212KW X 120g — 4 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5224KW X 240g — 2 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available MMA5248KW X 480g — 1 -40°C to +125°C 400 Hz — Yes PSI5 16-pin QFN Available Available MMA2602KW X 25g — 20.48 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN MMA2605KW X 50g — 10.24 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA2606KW X 62.5g — 8.192 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA2612KW X 125g — 4.096 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA2618KW X 187g — 2.731 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA2631KW X 312g — 1.638 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA1605KW Z 50g — 10.24 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA1606KW Z 62.5g — 8.192 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA1612KW Z 125g — 4.096 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA1618KW Z 187g — 2.731 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available 1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5 V and T = 25°C, unless otherwise specified. Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative SG187 (Selector Guide) (1Q2014) – 15 Inertial Sensors1 Product Sensing Direction Acceleration (±g) Sensitivity (mV/V/g) Sensitivity (count/g) Temperature Range Roll-Off Frequency Analog Digital Communication Packaging Status MMA1631KW Z 312g — 1.638 -40°C to +125°C 400 Hz — Yes DSI 16-pin QFN Available MMA6255KEG XY 50/50 — 9.76 -40°C to +125°C 400 Hz — Yes SPI 16-pin QFN Available MMA6851KQ X 25g — 20.479 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6852KQ X 35g — 13.947 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6853KQ X 50g — 9.766 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6854KQ X 75g — 6.51 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6855KQ X 120g — 4.096 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6856KQ X 60g — 8.192 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6811KQ XY 60g/25g — 8.192/20.479 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6813KQ XY 50g/50g — 9.766/9.766 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6821KQ XY 120g/25g — 4.096/20.479 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6823KQ XY 120g/60g — 4.096/8.192 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6826KQ XY 60g/60g — 8.192/8.192 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6827K XY 120g/120g — 4.096/4.096 -40°C to +105°C 400 Hz — Yes SPI 16-pin QFN Available MMA6900KQ XY 3.5g — 291.5 -40°C to +105°C 50 Hz — Yes SPI 16-pin QFN Available MMA6901KQ XY 5g — 203.6 -40°C to +105°C 50 Hz — Yes SPI 16-pin QFN Available 1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5 V and T = 25°C, unless otherwise specified. Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative. SG187 (Selector Guide) (1Q2014) – 16 AUTOMOTIVE SENSORS (continued) Tire Pressure Monitoring Systems Product Flash MPXY8600A 16 KB MPXY8500B 16 KB MPXY8500C RAM 512 B RF Transmitter Frequency 315/434MHz Protocols Supported ASK and FSK Modulation Clock Type OSC Timer 2-CH, 16-bit PWM 512 B 315/434MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 16 KB 512 B 315/434MHz ASK and FSK Modulation OSC MPXY8610A 16 KB 512 B 315/434MHz ASK and FSK Modulation MPXY8510B 16 KB 512 B 315/434MHz MPXY8350C 16 KB 512 B MPXY8620A 16 KB MPXY8620B MPXY8620C Pressure Range 100 - 800 kPA Pressure Sensor Accuracy ±10 kPA Package SOIC-20 WB Temperature Range -40 to 125°C 100 - 800 kPA ±10 kPA SOIC-20 WB -40 to 125°C 2-CH, 16-bit PWM 100 - 800 kPA ±10 kPA SOIC-20 WB -40 to 125°C OSC 2-CH, 16-bit PWM 100 - 450 kPA ±7 kPA SOIC-20 WB -40 to 125°C ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA ±7 kPA SOIC-20 WB -40 to 125°C 315/434MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA ±7 kPA SOIC-20 WB -40 to 125°C 512 B 315/434MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA ±20 kPA SOIC-20 WB -40 to 125°C 16 KB 512 B 315/434MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA ±20 kPA SOIC-20 WB -40 to 125°C 16 KB 512 B 315/434MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA ±20 kPA SOIC-20 WB -40 to 125°C Status Description Contact Freescale Contact Freescale Contact Freescale Contact Freescale Contact Freescale Contact Freescale Contact Freescale Contact Freescale Contact Freescale Automotive Pressure Range (with XZ-Axis Accelerometer) Automotive Pressure Range (with Z-Axis Accelerometer) Automotive Pressure Range (without an Accelerometer) Automotive Pressure Range (with XZ-Axis Accelerometer) Automotive Pressure Range (with Z-Axis Accelerometer) Automotive Pressure Range (without an Accelerometer) Truck Tire Pressure Range (with XZ-Axis Accelerometer) Truck Tire Pressure Range (with Z-Axis Accelerometer) Truck Tire Pressure Range (without an Accelerometer) FREESCALE SEMICONDUCTOR ACCESS AND REMOTE CONTROL PRODUCTS For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive ACCESS AND REMOTE CONTROL PRODUCTS GPS Downconverter Product MRFIC1505A RF Freq (MHz) 1575.42 Supply Voltage Range (Vdc) 2.7 to 3.3 Supply Current (Typ) (mA) 28 Standby Current (mA) 3 Conversion Gain (typ) (dB) 105 SG187 (Selector Guide) (1Q2014) – 17 Packaging 48-pin LQFP (Case No 932) System Applicability GPS Documentation MRFIC1505 FREESCALE SEMICONDUCTOR LOCAL INTERCONNECT NETWORK (LIN) SOLUTIONS Freescale Semiconductor and LIN—As the only semiconductor member of the LIN consortium, Freescale Semiconductor has the industry’s most advanced range of components, software, tools, and support available. Cost Benefits from LIN—A LIN sub-bus system uses a single-wire implementation and self-synchronization, without a crystal or ceramic resonator, in the slave node. With these cost benefits, high-end comfort and convenience features no longer need to be limited only to top-of-the-line cars. Embedded Controllers—Since the LIN sub-bus is based on common UART/SCI interface hardware, the 8-bit 68HC08, and 16-bit S12 and S12X Families provide the industry’s broadest range of performance and features, affording designers the freedom to choose parts ideally suited to their needs. Advanced Integration with LIN—Microcontrollers will evolve in the LIN environment to integrate the voltage regulator, physical interface, and high-voltage I/O to provide space, cost, and reliability benefits. Freescale Semiconductor solutions provide this capability today. Software for LIN—Freescale Semiconductor is working closely with the leading LIN tool supplier to ensure a first class, seamless development and debug environment for Freescale Semiconductor LIN products. For additional information, visit: Local Interconnect Network (LIN) Home Page www.lin-subbus.org Automotive Home Page LIN Software Products Product LIN master LIN slave Operating system 68HC05 n/a Available n/a 68HC08 Available Available Available S08 Available Available Available S12 Available Available Available S12X Available Available Available LIN Physical Layer Transceivers Product MC33399 MC33661 MC33662 Description Main Characteristics Bus Type and Standard Protection Features Operating Voltage (V) See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components (page 8)r See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components (page 8) See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components (page 8) SG187 (Selector Guide) (1Q2014) – 18 Current Limitation Standby (μA) Typ Max Other Features Control and Status Reporting Packaging Status MCU CHOICES BY APPLICATION Application Microcontroller Transmission, Engine Control and Management Interfaces MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A,, MPC5746M, MPC5777M, S12XE, S12P, S12G Hybrid and Electric Auxillaries MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC55748G, MPC5746M, S12G Watchdog S12G, S12P, S08QD4, S08SG, S08AW, S08SC4, S08RN High Temperature MPC5744P, S12G, S08SG Body Control Module and Gateway MPC5668x, MPC560xB, MPC560xD, MPC564xB/C, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, S12G, S12XE HVAC, Lighting, Seats, Window Lift, Doors, Sun Roof MPC560xB, MPC560xD, S12XS, S12P, S12G, S12VR, S12ZVFP, S08D, S08AW, S08EL, S08SG, S08SL, S08MP16, S08SC4, S08RN Body Motor Control S12G, S12VR, S08MP16, S08RN Infotainment all i.MX, SVFxxxR Telematics i.MX251, i.MX281, i.MX53, i.MX351, i.MX 6S1, i.MX 6U1 Instrument Cluster MPC560xS, i.MX534, i.MX 6S1, i.MX 6U1, SVFxxxR, S12H, S12XH, S12XHY, S12ZVFP, S12ZVH, S12ZVY S08LG, Braking Systems MPC564xL, MPC560xP, MPC5744P, S12XE, S12XS Electronic Power Steering MPC564xL, MPC560xP, MPC5744P, S12G Semi-Active Suspension MPC564xL, MPC5744P Airbag MPC560xP, MPC5744P, S12XF, S12XE, S12XS, S08SG Electronic Stability Control MPC564xL, MPC560xP, MPC5744P Lane Departure i.MX534, MPC567xK, i.MX 6S4, i.MX 6U4, i.MX 6D4, i.MX 6Q4 Advanced Cruise Control MPC564xL, MPC567xK, MPC5744P, SCP2201, SCP2207 Precrash, Blindspot Detection, Backup Warning MPC564xL, MPC567xK, MPC5744P, MPC5604E, S12ZVFP, S08RN Ethernet MPC560xS, MPC5668x, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M, all i.MX FlexRay (tm) MPC5668x, MPC564xL, MPC560xP, MPC5674F, MPC5673F, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5748G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M MPC5642A, S12XF CAN all MPC5xxx, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G,, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M all S12(X), S08D LIN MPC5644P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, S12P, S12XS, S12XE, S12G, S12X, S12VR64, S08SG, S08EL, S08AW, S08D, S08SL,S08SC4, S08RN vr NOTE: 32-bit in plain, 16-bit in bold, 8-bit in italics SG187 (Selector Guide) (1Q2014) – 19 S08 8 - BIT MICROCONTROLLERS S08 Core Technology — Optimized for extreme operating economy with a number of low-power options, Freescale’s S08 core is particularly attractive for automotive applications. Multiple stop modes, along with wait and standby modes, will help achieve new thresholds in low-power performance under a variety of operating conditions. The S08 core allows efficient, compact, modular coding with full 16-bit stack-pointer and stackrelative addressing, which permit various instruction sizes and enable memory interface in multiple mechanisms and addressing modes. The object code is also compatible with Freescale’s legacy HC05 and HC08 cores. S08 Families (Sheet 1 of 3) Device S08 Family Benefits — Freescale’s S08 families help save cost, reduce board space, increase performance and improve quality through extensive on-chip integration. No longer are external components required, such as an external crystal, LVI circuit, voltage regulator, I/O mux, watchdog circuit or EEPROM. With on-chip emulation and debug, changes can be made in application and in real-time, reducing development time. Also, with the S08 CPU running at 40 MHz, MCUs are able to quickly accomplish a task and go back to sleep. Quick execution translates into power savings, which allows customers to add more embedded content while staying within their power budgets Bus Frequency Flash RAM EEPRO M CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Voltage Temp. Range1 Package Options In Production S08DZ128 20 MHz 128 KB 8 KB Up to 2 KB 1 2xSCI 2 2 — 24-CH, 12-bit ADC, 2 comparators Up to 12-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP √ S08DZ96 20 MHz 96 KB 6 KB Up to 2 KB 1 2xSCI 2 2 — 24-CH, 12-bit ADC, 2 comparators Up to 12-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP √ S08DZ60 20 MHz 60 KB 4 KB Up to 2 KB 1 2xSCI 1 1 — Up to 24-CH, 12-bit ADC, 2 comparators Up to 6-CH+2-CHCH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DZ48 20 MHz 48 KB 3 KB Up to 1.5 KB 1 2xSCI 1 1 — Up to 24-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DZ32 20 MHz 32 KB 2 KB Up to 1 KB 1 2xSCI 1 1 — Up to 24-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DZ16 20 MHz 16 KB 1 KB Up to 512B 1 2xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP √ S08DV128 20 MHz 128 KB 6 KB — 1 2xSCI 2 2 — 24-CH, 12-bit ADC, 2 comparators Up to 12-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP 64 LQFP, 100 LQFP √ S08DV96 20 MHz 96 KB 4 KB — 1 2xSCI 2 2 — 24-CH, 12-bit ADC, 2 comparators Up to 12-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP √ S08DV60 20 MHz 60 KB 3 KB — 1 2xSCI 1 1 — Up to 16-CH, 12-bit ADC, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DV48 20 MHz 48 KB 2 KB — 1 2xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DV32 20 MHz 32 KB 2 KB — 1 2xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DV16 20 MHz 16 KB 1 KB — 1 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP √ S08DN60 20 MHz 60 KB 2 KB Up to 2 KB — 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DN48 20 MHz 48 KB 2 KB Up to 1.5 KB — 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ SG187 (Selector Guide) (1Q2014) – 20 S08 Families (Sheet 2 of 3) Device Bus Frequency Flash RAM EEPRO M CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Voltage Temp. Range1 Package Options In Production S08DN32 20 MHz 32 KB 1 KB Up to 1 KB — 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP √ S08DN16 20 MHz 16 KB 512 B Up to 512B — 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 comparators Up to 6-CH+2-CH MCG (PLL, FLL, OSC) Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP √ S08AW60 20 MHz 60 KB 2 KB — — 2xSCI 1 1 — Up to 16-CH, 10-bit Up to 6-CH+2-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 64 QFP, 64 LQFP, 48 QFN, 44 LQFP √ S08AW48 20 MHz 48 KB 2 KB — — 2xSCI 1 1 — Up to 16-CH, 10-bit Up to 6-CH+2-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 64 QFP, 64 LQFP, 48 QFN, 44 LQFP √ S08AW32 20 MHz 32 KB 2 KB — — 2xSCI 1 1 — Up to 16-CH, 10-bit Up to 6-CH+2-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 64 QFP, 64 LQFP, 48 QFN, 44 LQFP √ S08AW16A 20 MHz 16 KB 1 KB — — 2xSCI 1 1 — Up to 8-CH, 10-bit Up to 8-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 48 QFN, 44 QFP, 32 LQFP √ S08AW8A 20 MHz 8 KB 768 B — — 2xSCI 1 1 — Up to 8-CH, 10-bit Up to 8-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 48 QFN, 44 QFP, 32 LQFP √ S08EL32 20 MHz 32 KB 1 KB Up to 512 B — 1xSCI 1 1 1 Up to 16-CH, 10-bit, 2 comparators 4-CH+2-CH ICS LIN Auto-Baud/Synch, 40 MHz CPU, Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP √ S08EL16 20 MHz 16 KB 1 KB Up to 512 B — 1xSCI 1 1 1 Up to 16-CH, 10-bit, 2 comparators 4-CH+2-CH ICS LIN Auto-Baud/Synch, 40 MHz CPU, Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP √ S08SL16 20 MHz 16 KB 512 B Up to 256 B — 1xSCI 1 1 1 Up to 16-CH, 10-bit, 1 comparator 2-CH+2-CH ICS LIN Auto-Baud/Synch, 40 MHz CPU, Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP √ S08SL8 20 MHz 8 KB 512 B Up to 256 B — 1xSCI 1 1 1 Up to 16-CH, 10-bit, 1 comparator 2-CH+2-CH ICS LIN Auto-Baud/Synch, 40 MHz CPU, Watchdog OSC/Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP √ S08SG32 20 MHz 32 KB 1 KB — — 1xSCI 1 1 — Up to 16-CH, 10-bit, 1 comparator 2-CH+2-CH ICS 40 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M, J, W 28 TSSOP, 20 TSSOP, 16 TSSOP √ S08SG16 20 MHz 16 KB 1 KB — — 1xSCI 1 1 — Up to 16-CH, 10-bit, 1 comparator 2-CH+2-CH ICS 40 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M, J, W 28 TSSOP, 20 TSSOP, 16 TSSOP √ S08SG8 20 MHz 8 KB 512 B — — 1xSCI 1 1 — Up to 12-CH, 10-bit, 1 comparator Up to 2-CH+2-CH ICS 40 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 20 TSSOP, 16 TSSOP, 8 SOIC √ S08SG4 20 MHz 4 KB 256 B — — 1xSCI 1 1 — Up to 12-CH, 10-bit, 1 comparator Up to 2-CH+2-CH ICS 40 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 20 TSSOP, 16 TSSOP, 8 SOIC √ S08SC4 20MHz 4 KB 256 B — — 1xSCI — — — 8-CH, 10-bit 2-CH, 16-bit with PWM functions ICS 40 MHz CPU, Watchdog, COP, Internal Clock Generator, OSC/ Timer KBI, Low Voltage Detect, POR, BDM, Temp Sensor 4.5 to 5.5 C, V, M 16 TSSOP √ SG187 (Selector Guide) (1Q2014) – 21 S08 Families (Sheet 3 of 3) Device Bus Frequency Flash RAM EEPRO M CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Voltage Temp. Range1 Package Options In Production S08LG32 20 MHz 32 KB 2 KB — — 2xSCI 1 1 — Up to 16-CH, 12-bit Up to 2-CH+6-CH ICS 40 MHz CPU, Up to 37x8/41x4 LCD Driver, Watchdog OSC/ Timer, RTC, KBI, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V 80 LQFP, 64 LQFP, 48 LQFP √ S08LG16 20 MHz 18 KB 2 KB — — 2xSCI 1 1 — Up to 16-CH, 12-bit Up to 2-CH+6-CH ICS 40 MHz CPU, Up to 29x8/33x4 LCD Driver, Watchdog OSC/ Timer, RTC, KBI, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V 64 LQFP, 48 LQFP √ S08MP16 20MHz 16 KB 1 KB — — 1xSCI 1 1 — 13-CH, 12-bit, 3 comparators 6-CH+2-CH, 16bit Flextimer with PWM functions ICS 40 MHz CPU, PGA, PDB (x2), MTIM, RTC, POR, KBI, COP, CRC, ICE, BDM, 5-bit DAC (3x), Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP √ S08RN60 20MHz 60 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH + 2-CH ICS TSI, Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08RN48 20MHz 48 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH ICS TSI, Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08RN32 20MHz 32 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH ICS TSI, Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08RN16 20MHz 16 KB 2 KB 256 B — 2 1 1 — 12-CH, 12-bit 6-CH + 2-CH ICS TSI, Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 48,32 LQFP; 20, 16 TSSOP √ S08RN8 20MHz 8 KB 2 KB 256 B — 2 1 1 — 12-CH, 12-bit 6-CH + 2-CH ICS TSI, Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 48,32 LQFP; 20, 16 TSSOP √ S08RNA4 20MHz 4 KB 512 B 128 B — 1 — — — 8-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 20, 16 TSSOP; 20 SOIC √ S08RNA2 20MHz 2 KB 512 B 128 B — 1 — — — 8-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 20, 16 TSSOP; 20 SOIC √ S08RNA8 20MHz 8 KB 2 KB 256 B — 2 1 1 — 12-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 48,32 LQFP; 20, 16 TSSOP √ S08RNA16 20MHz 16 KB 2 KB 256 B — 2 1 1 — 12-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 48,32 LQFP; 20, 16 TSSOP √ S08RNA32 20MHz 32 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08RNA48 20MHz 48 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08RNA60 20MHz 60 KB 4 KB 256 B — 3 2 1 — 16-CH, 12-bit 6-CH + 2-CH + 2-CH ICS Watchdog, BDM, RTC, Analog Comparator 2.7 to 5.5 C, V, M 64, 48,32 LQFP √ S08QD4 8 MHz 4 KB 256 B — — — — — — 4-CH, 10-bit 2-CH+1-CH ICS 16 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 8 SOIC √ S08QD2 8 MHz 2 KB 128 B — — — — — — 4-CH, 10-bit 2-CH+1-CH ICS 16 MHz CPU, Watchdog OSC/ Timer, COP, LVI, ICE, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M 8 SOIC √ 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C SG187 (Selector Guide) (1Q2014) – 22 S12 AND S12X 16-BIT MICROCONTROLLERS S12 and S12X Cores — The S12X family offers 32-bit performance with all of the advantages and efficiencies of a 16-bit MCU. Based on the S12 core, S12X devices deliver 2 to 5 times the performance of a 25 MHz S12 MCU, while retaining code compatibility for easy migration. 172 additional instructions were added to the S12X core to improve paging capability and execute 32-bit calculations. Furthermore, S12X devices offers an industry first-the XGATE module. This versatile, efficient coprocessor delivers up to 80 MIPS of additional processing power to offload, from the main CPU, tasks such as basic gateway activity and peripheral-related processing. The parallel architecture enables more deterministic handling of interrupts and allows design engineers to avoid conflict between core functions and interrupt processing. For additional information, visit: Freescale Semiconductor Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive S12 and S12X Families Device Bus Frequency Flash RAM Data EEPROM XGATE Flash MPU S12XEP100 50 MHz 1 MB 64 KB — 4 KB √ √ S12XEP768 50 MHz 768 KB 48 KB — 4 KB √ S12XEQ512 50 MHz 512 KB 32 KB — 4 KB S12XEQ384 50 MHz 384 KB 24 KB — S12XET512 50 MHz 512 KB 32 KB S12XET384 50 MHz 384 KB S12XET256 50 MHz S12XEG384 ECC FlexRay CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT Operating Temp. Voltage Range1 Package Options In Production √ 5 8 3 2 2x16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit 8-CH, 16 -bit 8-CH — 25 √ 3.13 to 5.5 C, V, M 112 LQFP, 144 LQFP, 208 MAPBGA √ √ √ 5 8 3 2 2x16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit 8-CH, 16 -bit 8-CH — 25 √ 3.13 to 5.5 C, V, M 112 LQFP, 144 LQFP, 208 MAPBGA √ √ √ √ 4 6 3 2 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit 8-CH, 16 -bit 8-CH — 25 √ 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP √ 4 KB √ √ √ 4 4 3 1 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — 4-CH — 25 √ 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP √ — 4 KB √ √ √ 3 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 4-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP √ 24 KB — 4 KB √ √ √ 3 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 4-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP √ 256 KB 16 KB — 4 KB √ √ √ 3 4 3 1 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — 4-CH — 25 √ 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP √ 50 MHz 384 KB 24 KB — 4 KB √ √ √ 2 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 4-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP √ S12XEG256 50 MHz 256 KB 16 KB — 4 KB √ √ √ 2 4 3 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 4-CH — 25 √ 3.13 to 5.5 C, V, M 112 LQFP √ S12XEG128 50 MHz 128 KB 12 KB — 2 KB √ √ √ 2 2 2 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 2-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP √ S12XEA256 54 MHz 256 KB 16 KB — 4 KB √ √ √ 3 2 3 1 8-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 8-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP √ S12XEA128 50 MHz 128 KB 12 KB — 2 KB √ √ √ 2 2 2 1 12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 8-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP √ S12XES384 55 MHz 384 KB 24 KB — 4 KB √ √ √ 1 2 1 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16 -bit — Up to 8-CH — 25 √ 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP √ S12GA128 25 mhZ 128 KB 8 KB — 4 KB — — √ — 1 3 3 — 12-CH, 12-bit 8-CH, 8bit — — — 8-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP, √ S12GA96 25 mhZ 96 KB 8 KB — 4 KB — — √ — 1 3 3 — 12-CH, 12-bit 8-CH, 8bit — — — 8-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP, √ S12GA64 25 mhZ 64 KB 4 KB — 2 KB — — √ — 1 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 48 LQFP, 64 LQFP √ SG187 (Selector Guide) (1Q2014) – 23 LCD KWU EBI C, V, M, W S12 and S12X Families Device Bus Frequency Flash RAM Data EEPROM XGATE Flash MPU ECC FlexRay CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT S12G64 25 mhZ 64 KB 4 KB — 2 KB — — √ S12GA48 25 mhZ 48 KB 4 KB — 1.5 KB — — S12G48 25 mhZ 48 KB 4 KB — 1.5 KB — S12GNA48 25 mhZ 48 KB 4 KB — 1.5 KB S12GN48 25 mhZ 48 KB 4 KB — S12GNA32 25 mhZ 32 KB 2 KB S12GN32 25 mhZ 32 KB S12GNA16 25 mhZ S12GN16 Package Options In Production — 1 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP √ √ — 1 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP, 64 LQFP √ — √ — 1 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP √ — — √ — — 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP, 64 LQFP √ 1.5 KB — — √ — — 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP √ — 1 KB — — √ — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP √ 2 KB — 1 KB — — √ — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN √ 16 KB 1 KB — 512 B — — — — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP √ 25 mhZ 16 KB 1 KB — 512 B — — √ — — 1 1 — 8-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16 -bit — — 16 — 3.13 to 5.5 C, V, M, W 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFP √ S12G192 25 MHz 192 KB 11 KB — 4 KB — — √ — 1 3 3 — 16-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16 -bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP √ S12G240 25 MHz 240 KB 11 KB — 4 KB — — √ — 1 3 3 — 16-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16 -bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP √ S12GN32 25 MHz 32 KB 2 KB — 1 KB — — √ — — 1 1 — 8-CH, 10-bit 6-CH, 8-bit — — — 6-CH, 16 -bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP √ S12G128 25 MHz 128 KB 8 KB — 4 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16 -bit — — — — 3.13 to 5.5 M 48 LQFP, 64 LQFP, 100 LQFP √ S12G96 25 MHz 96 KB 8 KB — 3 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16 -bit — — — — 3.13 to 5.5 M 48 LQFP, 64 LQFP, 100 LQFP √ S12XS256 40 MHz 256 KB 12 KB 8 KB — √ 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16 -bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQFP, 80 QFP, 112 LQFP, KGD √ S12XS128 40 MHz 128 KB 8 KB 8 KB — √ 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16 -bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQFP, 80 QFP, 112 LQFP, KGD √ S12XS64 40 MHz 64 KB 4 KB 4 KB — √ 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16 -bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQP, 80 QFP, 112 LQFP, KGD √ S12XF512 50 MHz 512 KB 32 KB — 4KB √ √ √ 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16 -bit 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP √ S12XF384 50 MHz 384 KB 24 KB — 4KB √ √ √ 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16 -bit 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP √ SG187 (Selector Guide) (1Q2014) – 24 LCD KWU EBI Operating Temp. Voltage Range1 S12 and S12X Families Device Bus Frequency Flash RAM Data EEPROM XGATE Flash MPU ECC FlexRay CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT S12XF256 50 MHz 256 KB 20 KB — 2 KB √ √ S12XF128 50 MHz 128 KB 16 KB — 2 KB √ √ S12XHZ512 40 MHz 512 KB 32 KB — 4 KB S12XHZ384 40 MHz 384 KB 28 KB — S12XHZ256 40 MHz 256 KB 16 KB S12XHY256 40 MHz 256 KB S12XHY128 40 MHz S12P128 √ 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16 -bit 4-CH — √ 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16 -bit 4-CH — √ 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit 4-CH 32x4 8 4 KB √ 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit 4-CH 32x4 — 4 KB √ 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit — 12 KB 8 KB - − - √ − 2 2 1 - 12-ch., 10-bit 8-CH, 8-bit/ 4-CH, 16-bit 16/4 4 - 128 KB 8KB 8 KB - − - √ − 2 2 1 - 12-ch., 10-bit 8-CH, 8-bit/ 4-CH, 16-bit 16/4 4 32 MHz 128 KB 6 KB 4 KB — √ 1 1 1 — 10-CH, 12-bit 6-CH, 8-bit — S12P96 32 MHz 96 KB 6 KB 4 KB — √ 1 1 1 — 10-CH, 12-bit 6-CH, 8-bit S12P64 32 MHz 64 KB 4 KB 4 KB — √ 1 1 1 — 10-CH, 12-bit S12P32 32 MHz 32 KB 2 KB 4 KB — √ 1 1 1 — S12HZ128 25 MHz 128 KB 6 KB — 2 KB 2 2 1 S12HZ64 25 MHz 64 KB 4 KB — 1 KB 1 1 S12HN64 25 MHz 64 KB 4 KB — 1 KB S12HY64 32 MHz 64 KB 4 KB 4 KB — S12HA64 32 MHz 64 KB 4 KB 4 KB — S12HY48 32 MHz 48 KB 4 KB 4 KB — S12HA48 32 MHz 48 KB 4 KB 4 KB — S12HY32 32 MHz 32 KB 2 KB 4 KB — S12HA32 32 MHz 32 KB 2 KB 4 KB — 1 1 1 Operating Temp. Voltage Range1 Package Options In Production 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP √ 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP √ √ 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP √ 8 √ 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP √ 4-CH 32x4 8 √ 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP √ - 16CH., 16-bit 40 x 4 25 - 4.5 to 5.5 C, V, M 100 LQFP, 112 LQFP - - 16CH., 16-bit 40 x 4 25 - 4.5 to 5.5 C, V, M 100 LQFP, 112 LQFP — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN √ — — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN √ 6-CH, 8-bit — — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN √ 10-CH, 12-bit 6-CH, 8-bit — — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN √ 1 16-CH, 10-bit 6-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 32x4 8 4.5 to 5.5 C, V, M 112 LQFP √ 1 — 8-CH, 10-bit 4-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 112 LQFP √ 1 1 — 8-CH, 10-bit 4-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 112 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP √ 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C SG187 (Selector Guide) (1Q2014) – 25 LCD KWU EBI S12 MagniV Mixed-signal MCUs Device Bus Frequency Flash RAM EEPROM ECC CAN CANPHY SCI LINPHY SPI I2C Ext. Analog (ADC) Int. Analog (ADC) PWM Timer S12VR64 25 MHz 64 KB 2 KB 512 B S12VR48 25 MHz 48 KB 2 KB S12ZVH 32 MHz 128KB S12ZVHY 32 MHz S12ZVFP LCD KWU Motor Highj Voltage Input Other Analog Vreg Ext. Supply Operating Voltage 4-CH HVI, Vbat-Sense, Vsup Sense 4-CH HVI, Vbat-Sense, Vsup Sense Vbat-Sense, Vsup Sense 2-CH, HS Driver 2-CH, HS Driver — 2 5 V, 20 mA 6.0 to 18 2 5 V, 20 mA 6.0 to 18 24 2-CH Relay, LS Driver 2-CH Relay, LS Driver 16/4 Temp. Range1 C, V √ — — 2 1 1 — 6-CH, 10-bit 4-CH, 10bit 4-CH, 8bit 4-CH, 16 -bit — 6 512 B √ — — 2 1 1 — 6-CH, 10-bit 4-CH, 10bit 4-CH, 8bit 4-CH, 16 -bit — 6 8 KB 4 KB √ 1 1 2 — 1 1 8-CH, 10-bit 8-CH, 10bit 64 KB 4 KB 2 KB √ — — 2 — 1 1 4-CH, 10-bit 4-CH, 10bit 32 MHz 64 KB 4 KB 2 KB √ — — 2 1 1 1 4-CH, 10-bit 4-CH, 10bit S12ZVML128 50 MHz 128 KB 8 KB 512 B √ 1 — 2 1 1 — 4+5-CH, 12bit 8-CH, 12bit 8-CH(8Two 8- 4x40 bit), 4CH x16CH(16bit bit) 8-CH(8Two 8- 4x40 bit), 4CH x16CH(16bit bit) 8-CH(8Two 8- 4x40 bit), 4CH x16CH(16bit bit) 6-CH, 4-CH, 16- — 15-bit bit S12ZVMC128 50 MHz 128 KB 8 KB 512 B √ 1 — 2 — 1 — 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit S12ZVML64 51 MHz 64 KB 4 KB 512 B √ 1 — 2 1 1 — 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit S12ZVMC64 52 MHz 64 KB 4 KB 512 B √ 1 — 2 — 1 — 4+5-CH, 12bit 8-CH, 12bit S12ZVML32 53 MHz 32 KB 2 KB 512 B √ — — 2 1 1 — 4+5-CH, 12bit S12ZVM32 54 MHz 32 KB 2 KB — √ — — 1 — 1 — 4+5-CH, 12bit 2 5 V, 20 mA 24 8/2 Vbat-Sense, Vsup Sense — 1 19 — Vbat-Sense, Vsup Sense — 6 BLDC/ PMSM Vsup-Sense — 6 BLDC/ PMSM Vsup-Sense 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 6-CH, 15-bit 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150° SG187 (Selector Guide) (1Q2014) – 26 Package Options In Production 32 LQFP, 48 LQFP √ C, V 32 LQFP, 48 LQFP √ 5.5V to 18V C, V 100 LQFP, 144 LQFP 5 V, 20 mA 5.5V to 18V C, V 100 LQFP, 144 LQFP 1 5 V, 20 mA 5.5V to 18V C, V 100 LQFP 2 — 3.5V to 20V V, M, W 64 LQFPEP 2 — 3.5V to 20V V, M, W 64 LQFPEP 1 — 3.5V to 20V V, M, W 64 LQFPEP 2 — 3.5V to 20V V, M, W 64 LQFPEP 1 — 3.5V to 20V V, M, W 64 LQFPEP 1 — 3.5V to 20V V, M, W 64 LQFPEP DIGITAL SIGNAL CONTROLLERS Memory—On-board memory includes program flash and RAM, data flash and RAM, and BootFlash with EEPROM emulation capability. The modified Harvard architecture enables users to perform up to three simultaneous memory accesses. Service—A full-range of services is offered for the controller devices including software, support, training, and internal and third-party development tools. For additional information, visit: Documentation, Tool, and Product Libraries: www.freescale.com 56800E Core—The 56800E MCU+DSP core was architected specifically to provide users the ease of use of an MCU together with the performance of a DSP in a single core. 56F8300 High-Performance Flash Series—The MC56F8300 series of controllers combines the 56800E core with flash memory, motor control peripherals, and built-in safety features targeted specifically for automotive applications to provide 60 MIPS of performance over the full -40°C to 125°C temperature range. 56F8xxx Family Product ROM (KB) RAM Flash Timer 56F8013 0 4K 16K 4 x 16-bit 56F8355 n/a 20K 280K 16 x 16-bit Serial GPIO (pins) A/D PWM Operating Frequency (MHZ) 32 Temperature Packaging 1 x 6-CH Operating Voltage (V) 3.3 1 SCI/LIN + 1 SPI + 1 I2C 26 2 SCI/LIN + 2 SPI + 1 CAN + 1 I2C 49 1 x 4-CH 12-bit 4 x 4-CH 12-bit Additional Information C, M 32-pin LQFP 2 x 6-CH 3.3 60 C, M mcPWM with center alignment, 1 x 4 channel Quad Decoder 128-pin LQFP mcPWM with center alignment, 2 x 4 channel Quad Decoder QORIVVA 32-BIT MICROCONTROLLERS Qorivva MPC56xx — Leveraging the success of the Qorivva MPC55xx family, The Qorivva MPC56xx portfolio will continue to grow with devices that offer expanded sets of memory, connectivity and performance options. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive Qorivva homepage www.freescale.com/Qorivva Freescale has begun introducing the next generation (90nm) of 32-bit microcontrollers, which are built on Power Architecture™ technology: the family. The microcontrollers offer advanced features that help make cars safer and more fuel efficient while reducing harmful emissions. The Qorivva MPC56xx MCUs target a broad range of powertrain, safety, chassis, instrument cluster, body electronics and gateway applications. The Qorivva MPC56xx family includes an array of package options for system performance needs and embedded Flash requirements. To assist in system development, theQorivva MPC56xx family offers supportt including application software, development tools, training, documentation and technical support. Qorivva MPC56xx Family Device Core Platform Bus Program Frequency Flash MPC5744P 2 x e200z4 180 MHz MPC5746R 3 x e200z4 MPC5746M 4 x e200z4 MPC5746G Dual e200z7 3 x 200 MHz 4 x 200 MHz 2x180 MHz MPC5747C e200x4, e200x2 MPC5747G SRAM DMA EEPROM MPU/MMU CTU SCI (LINFlex) DSPI CAN 2.5 MB 384 KB 32-CH 32 Entry 2 2 4 3 I2C FlexRay ™ Ethernet (100BaseT) MLB eTPU eMIOS √ 4 MB 320 KB 64-CH Emulated in Program Flash 288 KB MPU 6 7 4 \ √ √ 64-CH 4 MB 320 KB 64-CH 288 KB Yes, No 5 7 3/1 1 √ √ 120-CH 6 MB 384 KB 96-CH 64 KB Data Flash 32 entry √ 3 10 8 4 √ √ 180 MHz, 80 MHz 4 MB 512 KB 32-CH Emulated 24-CH MPU √ Up to 16 10 8 4 √ √ Dual e200x4, e200x2 180 MHz, 80 MH 4 MB 768 KB 32-CH Emulated 32-CH MPU √ Up to 18 10 8 4 √ √ MPC5748C e200x4, e200x2 180 MHz, 80 MH 6 MB 768 KB 32-CH Emulated 24-CH MPU √ Upto 16 10 8 4 √ √ MPC5748G Dual e200x4, e200x2 180 MHz, 80 MH 6 MB 768 KB 32-CH Emulated 32-CH MPU Up to 18 10 8 4 √ √ √ √ √ SG187 (Selector Guide) (1Q2014) – 27 32-CH Motor Control Timers (3 x 6-ch., E-Timer), (2 x 12-ch, PWM) PIT Analog (ADC) Operating Voltage Temp. Range1 Debug Package Options 4-CH Quad, 25-ch. External, 12-bit 4 x SAR, 3 x SD 8 x SAR, 6 x SD Up to 32CH, 12bit, 48CH, 10bit Up to 32CH, 12bit, 48CH, 10-bi Up to 32CH, 12bit, 48CH, 10-bi Up to 32CH, 12bit, 48CH, 10-bi Up to 32CH, 12bit, 48CH, 10-bi 3.3 C, V, M Nexus 3+, MDO and Aurora interface 144 LQFP, 257 MAPBGA 176 LQFP-EP 252 MAPBGA 176 LQFP-EP 292 MAPBGA 176 LQFP, 256 MApBGA, 324 MAPBGA 8 96-CH 16 96-CH 16 96-CH 16 96-CH 16 96-CH 16 3.3, 5 M Nexus 3+, JTAG 3.3, 5 M 3.3V, 5V C, V, M Nexus 3+, Zipwire Aurora, JTAG Nexus 3+ 3.3V, 5V C, V, M Nexus 3+ 176 LQFP, 256 MApBGA, 324 MAPBGA 3.3V, 5V C, V, M Nexus 3+ 176 LQFP, 256 MApBGA, 324 MAPBGA 3.3V, 5V C, V, M Nexus 3+ 176 LQFP, 256 MApBGA, 324 MAPBGA 3.3V, 5V C, V, M Nexus 3+ 176 LQFP, 256 MApBGA, 324 MAPBGA In Production Qorivva MPC56xx Family Device Core Platform Bus Program Frequency Flash SRAM DMA EEPROM MPU/MMU MPC5777M 3 x e200z7 +1x e200z4 Dual e200z7 3 x 300 MHz + 1 x 200MHz 2x180 MHz 8 MB 596 KB 128-CH 8 x 64 KB 6 MB 384 KB 96-CH MPC5674F e200z7 150, 200, 264 MHz 4 MB 256 KB 64-CH + 32-CH MPC5673F e200z7 150, 200, 264 MHz 3 MB 192 KB 64-CH + 32-CH MPC5673K Dual e200z7 2x180 MHz 1 MB 256 KB 2x 32CH MPC5675K Dual e200z7d 45 MHz 2 MB 512 KB 32-CH MPC5674K Dual e200z7d 180 MHz 1.5 MB 384 KB 2 x 32CH MPC5668G e200z6 + e200z0 e200z0 + e200z0 128 MHz 2 MB 592KB 16-CH 64 KB 116 MHz 2 MB 128 KB 32-CH MPC5604E e200z0h 64 MHz 512 KB 96 KB 16-CH MPC5634M e200z3 60, 80 MHz 1.5M 94 KB 32-CH MPC5633M e200z3 40, 60, 80 MHz 1M 64 KB 32-CH MPC5632M e200z3 40, 60 MHz 768 KB 48 KB 32-CH MPC5643L e200z4x2 80/120 MHz 1 MB 128 KB 16-CH MPC5646C e200z4 + e200z0 120 MHz, 60 MHz 3 MB 256 KB 16-CH MPC5646B e200z4 120 MHz 3 MB 192 KB 16-CH MPC5645C e200z4 + e200z0 120 MHz, 60 MHz 2 MB 256 KB MPC5645B e200z4 120 MHz 2 MB MPC5644C e200z4 + e200z0 120 MHz, 60 MHz MPC5644B e200z4 MPC5607B e200z0 MPC5676R MPC5668E SCI (LINFlex) DSPI CAN I2C FlexRay ™ Ethernet (100BaseT) Yess, No 6 8 4/1 2 √ √ 64 KB Data Flash 32 entry 3 5 4 √ 96-CH Up to 32-CH, 16-bit Emulated in Program Flash Emulated in Program Flash 64 KB Ö √ 3 4 (MSB) 4 √ 2x32-CH 32-CH Ö √ 3 4 (MSB) 4 √ 2x32-CH 32-CH ψεσ 2 3 2 4 2 √ √ 64 entry 2 4 3 4 3 opt. √ √ 2 4 3 4 3 √ √ 6 4 6 4 √ √ Emulated in Program Flash 64 KB 16 entry √ 12 4 5 4 yes 2 3 1 3 Emulated in Program Flash Emulated in Program Flash Emulated in Program Flash 64 KB Data Flash 64 KB Data Flash 8 Entry 2 2 2 0 32-CH 16-CH, 24-bit 5-CH 8 Entry 2 2 2 0 32-CH 16-CH, 24-bit 8 Entry 2 2 2 0 32-CH 8-CH, 24-bit Emulated in Program Flash 64KB CTU MLB eTPU eMIOS √ 2 3 2 0 √ 16 Entry √ 10 8 6 1 √ 64 KB Data Flash 16 Entry √ 10 8 6 1 √ 16-CH 64 KB Data Flash 16 Entry √ 10 8 6 1 √ 160 KB 16-CH 64 KB Data Flash 16 Entry √ 10 8 6 1 √ 1.5 MB 192 KB 16-CH 64 KB Data Flash 16 Entry √ 10 8 6 1 √ 120 MHz 1.5 MB 128 KB 16-CH 64 KB Data Flash 16 Entry √ 10 8 6 1 √ 64 MHz 1.5 MB 96 KB 16-CH 64 KB Data Flash 8 Entry √ Up to 10 6 6 1 PIT Analog (ADC) Operating Voltage Temp. Range1 Debug Package Options 12 x SAR, 10 x SD Up to 64CH, 12bit 12 xDEC Filters Quad 64CH 3.3, 5 M Nexus 3+, Zipwire Aurora, JTAG 416 PBGA, 512 PBGA 3.3V, 5V M Nexus 3+ 416 BGA, 516 BGA 3.3V, 5V M Nexus 3+ 324 BGA, 416 BGA, 516 BGA √ Quad 64CH 3.3V, 5V M Nexus 3+ 324 BGA, 416 BGA, 516 BGA √ 4 x 12bit,,34CH 4-CH, 12-bit 3.3V, 1.2V C, V, M Nexus 3+ 257 MAPBGA, 473 MAPBGA √ 3.3V, 5V M, V Nexus 3+ 473 MAPBGA, 275 MAPBGA √ 4 x 12bit, 34CH 36-CH, 10-bit 64-CH, 10-bit 3.3V, 5V C, V, M Nexus 3+ 257 MAPBGA, 473 MAPBGA √ 3.3V, 5V V 3.3V, 5V V, M Nexus3 on z6 and Nexus 2+ JTAG, Nexus3 onz6 and Nexus2+ 8-CH, 10-bit Dual 34-CH, 12-bit 3.0V, 1.2V C, V, M Nexus 2+ 64 LQFP 5V M Nexus 2+ Wide trace port in Vertical Calibration System 144 LQFP, 176 LQFP, 208 MAPBGA √ 5-CH Dual 34-CH, 12-bit 5V M Nexus 2+ Wide trace port in Vertical Calibration System √ 5-CH Dual 32-CH, 12-bit 5V M Nexus 2+ Wide trace port in Vertical Calibration System 100 LQFP, 144 LQFP, 176 LQFP, 208 MAPBGA 100 LQFP, 144 LQFP 4-Ch. Dual 16Ch., 12bit Up to 29CH, 12bit, Up to 33-CH, 10-bit Up to 29CH, 12bit, Up to 33-CH, 10-bit Up to 29CH, 12bit, Up to 33-CH, 10-bit Up to 29CH, 12bit, Up to 33-CH, 10-bit Up to 29CH, 12bit, Up to 33-CH, 10-bit Up to 29CH, 12bit, Up to 33-CH, 10-bit 16-CH, 10/12-bit & up to 32-Ch., 10-bit 3.3V M Nexus 3+ 144 LQFP, 257 MAPBGA √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP √ 3.3V, 5V C, V, M Nexus 2+ (208MAPBGA Emul. Only Package) JTAG 176 LQFP √ 248-CH 3 x PWM; 3x ETIMER 1 4-CH 3 x PWM; 3x ETIMER √ 16-CH, 24-bit 8-CH 8-CH 1 x ETimer 46-Ch. eTimer/ PWM/STM √ √ √ SG187 (Selector Guide) (1Q2014) – 28 4-CH 32-CH, 16-bit √ 16 Entry Motor Control Timers 1 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit Up to 8-CH 64-CH, 16-bit In Production 208 MAPBGA √ 208 MAPBGA, 256 MAPBGA only for devt. √ √ Qorivva MPC56xx Family Device Core Platform Bus Program Frequency Flash SRAM DMA EEPROM MPU/MMU CTU SCI (LINFlex) DSPI CAN I2C MPC5606B e200z0 64 MHz MPC5605B e200z0 MPC5604B Analog (ADC) Operating Voltage Temp. Range1 Debug Package Options In Production 1 MB 80KB 16-CH 64 KB Data Flash 8 Entry √ Up to 8 Up to 6 6 1 64-CH, 16-bit 16-CH, 10/12-bit & up to 32-Ch., 10-bit 16-CH, 10/12-bit & up to 32-Ch., 10-bit up to 36CH, 10-bit up to 36CH, 10-bit up to 36CH, 10-bit 28-CH, 10-bit 3.3V, 5VV C, V, M Nexus 2+ (208MAPBGA Emul. Only Package) JTAG 144 LQFP, 176 LQFP √ 64 MHz 768 KB 64KB 16-CH 64 KB Data Flash 8 Entry √ Up to 8 Up to 6 6 1 64-CH, 16-bit 3.3V, 5VV C, V, M Nexus 2+ (208MAPBGA Emul. Only Package) JTAG 100 LQFP, 144 LQFP, 176 LQFP √ e200z0 64 MHz 512 KB 32KB 8 Entry √ 4 3 3 1 56-CH, 16-bit up to 6-CH MPC5603B e200z0 64 MHz 384 KB 28KB 8 Entry √ 4 3 3 1 56-CH, 16-bit up to 6-CH MPC5602B e200z0 64 MHz 256 KB 24KB 8 Entry √ 3 3 2 1 56-CH, 16-bit up to 6-CH MPC5604C e200z0 64 MHz 512 KB 48 KB 8 Entry √ 4 3 6 1 28-CH, 16-bit 3-CH MPC5603C e200z0 64 MHz 384 KB 40 KB 8 Entry √ 4 3 6 1 28-CH, 16-bit MPC5602C e200z0 64 MHz 256 KB 32 KB 8 Entry √ 4 3 6 1 MPC5601D e200z0 48 MHz 128 KB 12 KB 16-CH √ 3 2 MPC5602D e200z0 48 MHz 256 KB 16 KB 16-CH √ 3 MPC5604P e200z0 40/64 MHz 512 KB 40 KB 16-CH √ MPC5603P e200z0 40/64 MHz 384 KB 36 KB 16-CH MPC5602P e200z0 40/64 MHz 256 KB 20 KB 16-CH MPC5601P e200z0 40/64 MHz 192 KB 12 KB 16-CH MPC5644A e200z4 120, 132, 150 MHz 4 MB 192 KB 64-CH MPC5643A e200z4 120, 132, 150 MHz 3 MB 192 KB 64-CH MPC5642A e200z4 120, 132, 150 MHz 2 MB 192 KB 64-CH Device Core Platform Bus Program Frequency Flash SRAM eDMA 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash Emulated in Program Flash Emulated in Program Flash Emulated in Program Flash Emulated EEPROM 3.3V, 5VV C, V, M Nexus 2+ (208MAPBGA Emul. Only Package) JTAG 100 LQFP, 144 LQFP, √ 3.3V, 5V C, V, M Nexus 2+ (208 MAPBGA Emul. Only Package) JTAG 100 LQFP, 144 LQFP √ 3.3V, 5V C, V, M Nexus 2+ (208 MAPBGA Emul. Only Package) JTAG 100 LQFP, 144 LQFP √ 3.3V, 5V C, V, M Nexus 2+ (208 MAPBGA Emul. Only Package) JTAG 100 LQFP √ 3-CH 28-CH, 10-bit 3.3V, 5V C, V, M Nexus 2+ (208 MAPBGA Emul. Only Package) JTAG 100 LQFP √ 28-CH, 16-bit 3-CH 28-CH, 10-bit 3.3V, 5V C, V, M Nexus 2+ (208 MAPBGA Emul. Only Package) JTAG 100 LQFP √ 1 Up to 28-CH, 16-bit Up to 4-CH 3.3V, 5V C, V, M JTAG 100 LQFP, 64 LQFP √ 2 1 Up to 28-CH, 16-bit Up to 4-CH 3.3V, 5V C, V, M JTAG 100 LQFP, 64 LQFP √ 2 4 2 0 √ 3.3V, 5V M Nexus 2+ 100 LQFP, 144 LQFP √ √ 2 4 2 0 √ 3.3V, 5V M Nexus 2+ 100 LQFP, 144 LQFP √ √ 2 3 2 0 Up to 33CH, 12bit Up to 33CH, 12bit Dual 13-CH, 10-bit Dual 13-CH, 10-bit 16-CH, 10-bit 3.3V, 5V M 64 LQFP, 100 LQFP √ 1 1 1 0 64 LQFP, 100 LQFP √ 24 entry MMU 3 3(MS B) 3 √ 32-CH Nexus 1 (Emulation with MPC5604P) Nexus 1 (Emulation with MPC5604P) Nexus3+ Vertical Calibration system 176 QFP, 208 MAPBGA, 324 MAPBGA √ 24 entry MMU 3 3(MS B) 3 √ 24 entry MMU 3 3(MS B) 3 √ SCI (LINFlex) DSPI CAN I2C MPC5645S e200z4d 125 MHz 2 MB 64 KB 16-CH 4 x 16 KB Up to 6 Up to 3 3 4 MPC5606S e200z0h 64 MHz 1 MB 48 KB + 160 KB Graphic s RAM 16-CH 4x16 KB 2 3 2 4 MPC5604S e200z0h 64 MHz 512 KB 48 KB 16-CH 4x16 KB 2 2 2 MPC5602S e200z0h 64 MHz 256 KB 24 KB 16-CH 4x16 KB 2 3 1 TFT Drive Stepper Drive Up to 6 Up to 2 gauges w/ Display Stepper Control Unit Stall (DCU) with Detect Parallel (SSD) Data Interface (PDI) Display 6 gauges Control Unit w/Stepper (DCU) with Stall Parallel Detect Data (SSD) Interface (PDI) No 6 gauges w/Stepper Stall Detect (SSD) No 6 gauges w/Stepper Stall Detect (SSD) FlexRay ™ LCD Ethernet (100BaseT) MLB eTPU eMIOS Motor Control Timers 20-CH eTimer/ PWM 20-CH eTimer/ PWM 14-CH eTimer/ PWM 6-CH eTimer PIT 4-CH 4-CH 4-CH 4-CH 11-CH, 10-bit 3.3V, 5V M 24-bit 5-CH Dual 40CH, + 2 DECFIL 3.3V, 5V M 32-CH 24-bit 5-CH Dual 40CH, + 2 DECFIL 3.3V, 5V M Nexus3+ Vertical Calibration system 176 QFP, 208 MAPBGA, 324 MAPBGA √ 32-CH 24-bit 5-CH Dual 40CH, + 2 DECFIL 3.3V, 5V M Nexus3+ Vertical Calibration system 176 QFP, 208 MAPBGA, 324 MAPBGA √ eMIOS Analog (ADC) Operating Voltage Debug Package Options In Production Nexus 3+ 176 LQFP, 208 LQFP, 416 TEPBGA Sound Generator Memory Expansion MPU √ Quad SPI 16 Entry 40x4 Yes (using eMIOS) QuadSPI 12 entry 2-CH 2 64x6 √ 12 entry 2-CH 2 64x6 √ 12 entry 2-CH 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C SG187 (Selector Guide) (1Q2014) – 29 Timers RTC, API, 8-ch, 32- Up to 20bit PIT and S/W CH, 10Watchdog Timer bit 3.3V and 5V Temp. Range1 C, V Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. 16-CH, 10-bit 3.3V and 5V C, V, M Nexus 2+ 144 LQFP, 176 LQFP 16-CH, 10-bit 3.3V and 5V C, V, M Nexus 1 100 LQFP, 144 LQFP 16-CH, 10-bit 3.3V and 5V C, V, M Nexus 1 100 LQFP, 144 LQFP √ Image Cognition Processors Device SPC2201 SPC2207 Primary Core Secondary Core PlatFreCore Platform form quency ARM926 350 APEX - SMD MHz Array, Slave ARM926 ARM926 350 APEX - SMD MHz Array, Slave ARM926 SRAM DMA Video Accelerator Graphics Accelerator Image Processor Camera Input Display Interface 16 MB DRAM PDI LCD/ WVGA 64 MB DRAM PDI LCD/ WVGA DRAM Support Flash Support USB 2.0 PCi express NAND, Serial NOR flash NAND, Serial NOR flash HS OTG + HS Phy HS OTG + HS Phy I2S I2C SPI 1 2 1 1 2 1 UART Timers ADC PIT 3.3 V GPIO Voltage Temp. Range1 Package Options 4 √ 1 C 236 BGA 4 √ 1 C 236 BGA In Production 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150° another, reducing development costs and improving time to market. To assist in development, the Qorivva MPC55xx family offers support including application software, development tools, training, documentation and technical support. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive Qorivva MPC55xx — Based on Power Architecture™ technology and system-onchip (SoC) design, Qorivva MPC55xx microcontrollers offer advanced features that help make cars safer and more fuel efficient, while reducing harmful emissions. The Qorivva MPC55xx MCUs target a broad range of automotive applications, including powertrain control, advanced safety, driver assistance, chassis and body electronics. The MPC55xx family includes an array of package options for systems performance needs and embedded flash requirements. Offering pin-compatibility throughout the entire flash-based family, engineers are given the ability to migrate their efforts from one design to another. Qorivva MPC55xx Family Device Core Platform Bus Frequency Program SRAM Flash DMA EEPROM eSCI DSPI CAN MPC5534 e200z3 40, 66, 80 MHz 1 MB 64 KB 32-CH Emulated in program Flash 2 3 2 MPC5553 e200z6 80, 112, 132 MHz 1.5 MB 64 KB 32-CH Emulated in program Flash 2 3 2 MPC5554 e200z6 80, 112, 132 MHz 2 MB 64 KB 64-CH Emulated in program Flash 2 4 3 MPC5561 e200z6 80, 112, 132 MHz 1 MB 192 KB 32-CH Emulated in program Flash 4 2 2 MPC5565 e200z6 80, 112, 132 MHz 2 MB 80 KB 32-CH Emulated in program Flash 2 3 3 MPC5566 e200z6 80, 112, 132, 144 MHz 3 MB 128 KB 64-CH Emulated in program Flash 2 4 4 MPC5567 e200z6 80, 112, 132 MHz 2MB 80 KB 32-CH Emulated in program Flash 2 3 5 I2C Flexray Ethernet (100BaseT) MLB √ √ √ √ √ emulated via eTPU External Bus Debug eTPU eMIOS √ Nexus 3 32-CH, √ Nexus 3 32-CH, Analog (ADC) Operating Voltage Temp. Range1 Package Options In Production 24-CH, 24-bit 40-CH, 12-bit 3.3V and 5V M 208 MAPBGA, 324 PBGA √ 24-CH 24-bit 40-CH, 12-bit 3.3V and 5V M 208 MAPBGA, 324 PBGA, 416 PBGA √ √ Nexus 3 2x32-CH, 24-CH, 24-bit 40-CH, 12-bit 3.3V and 5V M 416 PBGA √ √ Nexus 3 24-CH 24-bit 40-CH, 12-bit 3.3V and 5V C, M 324 PBGA √ √ Nexus 3 24-CH, 24-bit 40-CH, 12-bit 3.3V and 5V M 324 PBGA √ √ Nexus 3 2x32-CH, 24-CH 24-bit 40-CH, 12-bit 3.3V and 5V C, M 416 PBGA √ √ Nexus 3 24-CH, 24-bit 40-CH, 12-bit 3.3V and 5V C, M 324 PBGA, 416 PBGA √ 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C. Note: specs given are for the largest package size stated. SG187 (Selector Guide) (1Q2014) – 30 32-CH, 32-CH, PIT MPC52xx and MPC51xx Families Device Core Platform Bus Cache Frequency Audio Acceleration DRAM Bandwidth Bus System Graphics Acceleration Display Controller Memory Interface External Memory Bus MPC5200B e300 400 MHz, 16K I/D 760 MIPS None 300 MBs Single port None None 16/32-bit DDR-I NOR Flash 6 2 2 MPC5121e e300 400 MHz, 32K I/D 800 MIPS AXE, 200 MHz, 32-bit RISC OpenGL-ES 1.1 OpenVG 1.0 1280x720 24-bit 3-plane blend 16/32-bit DDR-I/II & MobileDDR-I Controller 8/16-bit NAND Flash controller 12 3 4 1100 MBs 5-port 64-bit @200MHz 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C SG187 (Selector Guide) (1Q2014) – 31 PSC I2C CAN USB 2.0 2 (USB 1.1) 2 Secure Digital MMC SD SDIO Ethernet Temp1 Package In (100 Production BaseT) √ C 272 TE-PBGA √ √ C 516 PBGA √ I.MX 32-BIT APPLICATIONS PROCESSORS The AEC-Q100 automotive-qualified i.MX applications processors are based on ARM9 and ARM11 CPU cores coupled with a wide rage of connectivity peripherals and hardware accelerators. Target automotive applications include infotainment, navigation, hands-free calling, telematics and fully configurable Instrumentation clusters. For additional information, visit: Freescale Semiconductor Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive i.MX Applications Processors Device Core Platform CPU Frequency Cache SRAM DMA i.MX285 ARM926 454 MHz L1: 16 KB/32 KB I/D 128 KB 32-Ch. i.MX281 ARM926 454 MHz L1: 16 KB/132B I/D 128 KB i.MX251 ARM926 400 MHz L1: 16 KB/16 KB I/D i.MX255 ARM926 400 MHz i.MX351 ARM1136 w/Vector Floating Point i.MX355 Display Interface DRAM Support Flash Support USB (2.0) CAN TFT up to WVGA mDDR, DDR2 SLC NAND, MLC NAND, QSPI Flash HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 32-Ch. mDDR, DDR2 SLC NAND, MLC NAND, QSPI Flash 128 KB 32-Ch. SDRAM , mDDR, DDR2 L1: 16 KB/16 KB I/D 128 KB 32-Ch. 532 MHz L1: 16 KB/16 KB I/D L2: 128 KB Unified 128 KB 32-Ch. ARM1136 w/Vector Floating Point 532 MHz L1: 16 KB/16 KB I/D L2: 128 KB Unified 128 KB 32-Ch. i.MX356 ARM1136 w/Vector Floating Point 532 MHz L1: 16 KB/16 KB I/D L2: 128 KB Unified 128 KB 32-Ch. i.MX514 ARM Cortex A8 with VPU and NEON 600 MHz L1: 32KB/32KB I/D L2: 256KB Unified 96 KB 32 Ch i.MX516 ARM Cortex A8 with VPU and NEON 600 MHz L1: 32KB/32KB I/D L2: 256KB Unified 96 KB i.MX534 ARM Cortex A8 with VPU and NEON 800 MHz L1: 32KB/32KB I/D L2: 256KB Unified i.MX536 ARM Cortex A8 with VPU and NEON 800 MHz 852 MHz, 1 GHz i.MX6D4 Dual ARM Cortex A9 Video Accelerator Graphics Accelerator Image Processor Camera Input CCIR656 TFT up to 800x600 MLB SD/ MMC SDIO I2C SPI UART Ethernet HDD (100BaseT) Interface SSI/ I2S Sample Rate Converter SP PIT 3.3V DIF GPIO I/O Voltage Temp. Range1 Package Options In Production 2 x3 x2 x3 x6 10/100 x1 GMII orx2 RMII with IEEE 1588 ATA-6 x3 1x 8 √ Internally Generated C 289 MAPBGA √ HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 x3 x2 x3 x6 10/100 x1 GMII orx2 RMII with IEEE 1588 ATA-6 x3 1x 8 √ 1.38V to 1.52V C 289 MAPBGA √ NOR, SLC NAND MLC NAND HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 2 3 3 5 √ ATA-6 2 4 √ 1.38V to 1.52V C 400 MAPBGA √ SDRAM , mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 2 3 3 5 √ ATA-6 2 4 √ 1.38V to 1.52V C 400 MAPBGA √ SDRAM , mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 √ 3 3 2 3 √ ATA-6 2+ES AI Yes, Async. Yes 3 √ 1.22V to 1.47V C 400 MAPBGA √ √ CCIR656 TFT up to 800x600 SDRAM , mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 √ 3 3 2 3 √ ATA-6 2+ES AI Yes, Async. Yes 3 √ 1.22V to 1.47V C 400 MAPBGA √ √ CCIR656 TFT up to 800x600 SDRAM , mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy HS Host+FS Phy or ext. HS Phy 2 √ 3 3 2 3 √ ATA-6 2+ES AI Yes, Async. Yes 3 √ 1.22V to 1.47V C 400 MAPBGA √ OpenVG 1.1; OpenGL ES2.0 √ CCIR656 WXGA; Dual TFT mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy and 3x HS Host 4 3 2 3 √ ATA-6 3 Yes (Tx) 3 √ 0.95V to 1.10V C 529 MAPBGA √ 32 Ch. D1 encode; OpenVG HD720 1.1; decode OpenGL ES2.0 √ CCIR656 WXGA; Dual TFT mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy and 3x HS Host 4 3 2 3 √ ATA-6 3 Yes (Tx) 3 √ 0.95V to 1.10V C 529 MAPBGA √ 128 KB 32 Ch. OpenVG 1.1; OpenGL ES2.0 √ CCIR656 UXGA; Dual TFT DDR2, DDR3, LPDDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy and HS Host+FS Phy and 2x HS Host 2 25/ 50 4 3 3 5 10/100 with IEEE 1588 SATA, PATA 3+ ESAI Yes, Asyncronous Yes 3 √ 0.95V to 1.10V C 529 MAPBGA √ L1: 32KB/32KB I/D L2: 256KB Unified 128 KB 32 Ch OpenVG 1.1; OpenGL ES2.0 √ CCIR656 UXGA; Dual TFT DDR2, DDR3, LPDDR2 NOR, SLC NAND MLC NAND HS OTG+HS Phy and HS Host+FS Phy and 2x HS Host 2 25/ 50 4 3 3 5 10/100 with IEEE 1588 SATA, PATA 3+ ESAI Yes, Asyncronous Yes 3 √ 0.95V to 1.10V C 529 MAPBGA √ L1: 32KB/32KB I/D L2: 512KB Unified 256 KB 32 Ch OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition √ CCIR656 Up to 4xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 5 5 1 GB with IEEE 1588 SATA 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 Flip Chip BGA √ OpenVG 1.1 HD720 encode; HD1080 decode SG187 (Selector Guide) (1Q2014) – 32 i.MX Applications Processors cont. Device Core Platform CPU Frequency Cache SRAM DMA Video Accelerator Graphics Accelerator Multi-Format 1080p Encode and Decode OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition √ OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition i.MX6D6 Dual ARM Cortex A9 852 MHz, 1 GHz L1: 32KB/32KB I/D L2: 512KB Unified 256 KB 32 Ch i.MX6Q4 Quad ARM Cortex A9 852 MHz, 1 GHz L1: 32KB/32KB I/D L2: 512KB Unified 256 KB 32 Ch i.MX6Q6 Quad ARM Cortex A9 852 MHz, 1 GHz L1: 32KB/32KB I/D L2: 512KB Unified 256 KB 32 Ch i.MX6S1 ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch i.MX6S4 ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch i.MX6S6 ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch i.MX6U1 Dual ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch i.MX6U4 Dual ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch i.MX6U6 Dual ARM Cortex A9 800 MHz L1: 32KB/32KB I/D L2: 512KB Unified 128 KB 32 Ch Multi-Format 1080p Encode and Decode Multi-Format 1080p Encode and Decode Image Processor DRAM Support Flash Support USB (2.0) CAN MLB SD/ MMC SDIO I2C SPI UART MIPI, Up to CCIR656 4xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 5 √ MIPI, Up to CCIR656 4xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 √ MIPI, Up to CCIR656 4xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 x32 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 Display Interface Ethernet HDD (100BaseT) Interface SSI/ I2S Sample Rate Converter SP DIF I/O PIT 3.3V GPIO Voltage Temp. Range2 Package Options In Production 5 1 GB with IEEE 1588 SATA 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 Flip Chip BGA √ 3 5 1 GB with IEEE 1588 SATA 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 Flip Chip BGA √ 4 5 5 1 GB with IEEE 1588 SATA 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 Flip Chip BGA √ 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition √ MIPI, Up to CCIR656 2xWXGA x32 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition √ MIPI, Up to CCIR656 2xWXGA x32 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ UXGA; Dual TFT x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ MIPI, Up to CCIR656 2xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ MIPI, Up to CCIR656 2xWXGA x64 DDR3, LVDDR3, LPDDR2 x16 NOR, x8 SLC/ MLC NAND HS OTG+HS Phy, HS Host+HS Phy, x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asyncronous Yes 3 √ 1.275V to 1.50V C 625 MAPBGA √ I2S Sample Rate Converter SP PIT 3.3V DIF GPIO I/O Voltage Temp. Range1 Package Options In Production 4x SAI 1x ESAI yes yes 3.0 V to 3.6 V C 176 LQFP 364 BGA √ OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition HD720 encode; HD1080 decode Camera Input OpenVG 1.1; (3D Core) OpenGL ES2.0, 3.0 Display Composition √ 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C 2. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C 32-bit Vybrid Controller Solutions Device Core Platform CPU Frequency Cache SRAM DMA Vybrid SVFxxxR ARM® Cortex®A5/M4 400 MHz L1: 32 KB/ 32 KB I/D L2: 512 KB Up to 1.5 MB Up to 1.5 MB √. Video Accelerator Graphics Accelerator OpenVG 1.1 Image Processor Camera Input Display Interface DRAM Support Flash Support USB (2.0) CAN MLB SD/ MMC SDIO I2C SPI UART 18-bit Composi te (4 to 1) + VADC 2 (Up to WVGA) + Segment Display (40 x 4) DDR3 LPDDR2 Dual Quad SPI, NAND, FlexBus 2x USB OTG HS + Phy 50 √ 2 4 4 6 1. C = -40°C to +85°C, V = -40°C to +105°C, M = -40°C to +125°C, J = -40°C to +140°C, W = -40°C to +150°C SG187 (Selector Guide) (1Q2014) – 33 Ethernet HDD (100BaseT) Interface 2x 10/100 — Definitions — ADC — Analog-to-Digital Converter ASK — Amplitude Shift Keying Modulation BDM — Background Debug Mode CAN — Controller Area Network CDIP — Ceramic Dual In-Line Package CLCC — Ceramic Leaded Chip Carrier COP — Computer Operating Properly (Watchdog Timer) CPU16 — 16-bit Central Processor Unit (HC11 Compatible) CPU32 — 32-bit Central Processor Unit (68000 Compatible) CTM — Configurable Timer Module (Various Hardware Options) DAB — Digital Audio Broadcasting DIP — Dual In-line Package DSPI — Deserial Peripheral Interface EBI — External Bus Interface ECT — Enhanced Capture Timer eDMA — Enhanced Direct Memory Access Controller eTPU — Enhanced Timing Processor Unit eMIOS — Enhanced Modular Input Output System eQADC — Enhanced Queued Analog-to-Digital Converter eSCI — Enhanced Serial Communications Interface FSK — Frequency Shift Keying Modulation GPT — General-Purpose Timer Module (4 IC, 5 OC, 2 PWM) HQFP — Heatsink Quad Flat Package HSOP — Heatsink Small Outline Package i — Input-Only Port Pins i/o — Bidirectional Input and Output Port Pins I2C — Inter-Integrated Circuit IC — Input Capture ISPI — Interval Serial Peripheral Interface LQFP — Low-Profile Quad Flat Package (1.4mm thick) LVI — Low-Voltage Interrupt LVR — Low-Voltage Reset MCCI — Multi-Channel Communication Interface (2 SCI, SPI) MFT — Multi-Function Timer MUX — Multiplexed OC — Output Compare OOK — On-Off Keying PBGA — Plastic Ball Grid Array PDIP — Plastic Dual In-Line Package PEEP — Personality EEPROM PEP — Personality EPROM PLCC — Plastic Leaded Chip Carrier PLL — Phase-Locked Loop PQFP — Plastic Quad Flat Pack PWM — Pulse-Width Modulation QADC — Queued Analog-to-Digital Converter (10-bit) PQFN — Quad Flat No-Lead Package QFN — Quad Flat No-Lead Package QFP — Quad Flat Package QSM — Queued Serial Module (SCI + QSPI) QSPI — Queued SPI RTI — Real-Time Interrupt SCI — Serial Communication Interface SCIE — Enhanced SCI SCIM — Single-Chip Integration Module SDIP — Shrink Dual In-line Package SIM — System Integration Module SIML — Low-Power System Integration Module SIOP — Simple Serial I/O Port SOICN — Small Outline Package Narrow Body SOICW — Small Outline Package Wide Body SPI — Serial Peripheral Interface ESPI — Enhanced SPI SRAM — Standby RAM Module SSOP — Shrink Small Outline Package TPU — Time Processor Unit (16 Programmable Channels) TPURAM — Standby RAM Module with TPU Emulation Capability TQFP — Thin Quad Flat Package (1.0mm thick) TSSOP — Thin Shrink Small Outline Package UART — Universal AsynchroNous Receiver/Transmitter UDFN— Ultra-thin dual flat no-lead package USB — Universal Serial Bus — Package Designators — B — Shrink DIP (70 mil spacing) DW — Small Outline (Wide-Body SOIC) DWB — Small Outline (Wide body SDIB) 0.65 pitch FA — 7 x 7 mm Quad Flat Pack (QFP) FB — 10 x 10 mm Quad Flat Pack (QFP) FC — QFN Quad Flat Pack FE — CQFP (windowed) — Samples Only FN — Plastic Quad (PLCC) FS — CLCC (windowed) — Samples Only FT — 28 x 28 mm Quad Flat Pack (QFP) FU — 14 x 14 mm Quad Flat Pack (QFP) FZ — CQFP (windowed) — Samples Only K — Cerdip (windowed) — Samples Only L — Ceramic Sidebraze P — Dual in-Line Plastic PNA — PQFN Power QFN PNB — PQFN Power QFN PNC — PQFN Power QFN PU — 14 x 14 mm Low-Profile Quad Flat Pack (LQFP) PV — 20 x 20 mm Low-Profile Quad Flat Pack (LQFP) S — Cerdip (windowed) — Samples Only TM — Mechatronics Connector VR — Plastic Ball Grid Array (PBGA) with PB-free solder balls ZP — 27 x 27 mm Plastic Ball Grid Array (PBGA) SG187 (Selector Guide) (1Q2014) – 34 — Pb-free — AA — Pb-free 44 to 100 pin QFP AB — Pb-free 112 to 288 pin QFP AC — Pb-free 16 to 44 pin LQFP AE — Pb-free 48 to 64 pin LQFP AF — Pb-free 68 to 100 pin LQFP AG — Pb-free 108 to 144 pin LQFb AH — Pb-free 80 to 100 pin TQFP AI — Pb-free FQFP AJ — Pb-free CQFP AE — Pb-free 22 to 64 pin PDIP ED — Pb-free 6 yo 20 pin PDIP EE — Pb-free PSDIP EF — Pb-free 8 to 16 in SOIC EG — Pb-free 16 to 28 pin SOIC WIDE EH — Pb-free 132 pin PQFP EI — Pb-free PLCC EJ — Pb-free 8 to 24 pin TSSOP EK — Pb-free 32 to 54 pin SOIC WIDE EL — Pb-free 26 to 56 pin TSSOP EN — Pb-free 8 to 24 pin SSOP EO — Pb-free 26 to 56 pin SSOP EP — Pb-free QFN & MLF (Exposed Pad) ER — Pb-free CATV ES — Pb-free SENSOR ET — Pb-free RF (POWER CHIPS) EU — Pb-free MAC PAAC EV — Pb-free MFP (SOEIAJ) FC — Pb-free QFN & MLF (Regular) FE — Pb-free CerQuads VK — Pb-free MAPBGA <=1.3mm (THINMAP) <.7mm Pitch VL — Pb-free MAPBGA <=1.3mm (THINMAP) >.7mm Pitch VM — Pb-free MAPBGA 1.6mm > .7mm Pitch VN — Pb-free MAPBGA 1.6mm < .7mm Pitch VO — Pb-free MAPBGA 1.35mm < .7mm Pitch VP — Pb-free MAPBGA 1.36mm > .7mm Pitch VR — Pb-free PBGA VS — Pb-free FC-HiTCE LGA (without C5 sphere) VT — Pb-free FC PBGA VU — Pb-free FC-HiTCE VV — Pb-free TBGA VW — Pb-free HSOP VX — Pb-free SMT VY — Pb-free UNIBODY SG187 (Selector Guide) (1Q2014) – 35 Product Numbering System for MC56F8300 Digital Signal Controllers MC 56F83 XX M 60 BUS SPEED QUALIFICATION STATUS PC PRE-QUALIFICATION, ENGINEERING SAMPLES MC FULLY QUALIFIED PACKAGE TYPE PRODUCT DESIGNATOR AUTOMOTIVE CONTROLLER SERIES WITH FLASH XX TEMPERATURE RANGE V -40°C TO 105°C M -40°C TO 125°C SG187 (Selector Guide) (1Q2014) – 36 Product Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 M S P, X PRODUCT CATEGORY QUALIFIED STANDARD CUSTOM PRODUCT PROTOTYPE PRODUCT PRESSURE SENSORS NONE A/V AZ/VZ H HZ M Y 0 1–2 3–5 6–7 PACKAGING TYPE UNIBODY SMALL OUTLINE PACKAGE SMALL OUTLINE MEDIA RESISTANT PACKAGE SUPER SMALL OUTLINE PACKAGE SUPER SMALL OUTLINE MEDIA RESISTANT PACKAGE M-PAK SUPER SMALL OUTLINE PACKAGE (TPM) PORTING STYLE C P A G D V PRODUCT FEATURES NONE 2 3 4 UNCOMPENSATED TEMPERATURE COMPENSATED/CALIBRATED OPEN TEMPERATURE COMPENSATED/CALIBRATED/ SIGNAL CONDITIONED AUTOMOTIVE ACCURACY 5 TEMPERATURE COMPENSATED/CALIBRATED/ SIGNAL CONDITIONED HIGH TEMPERATURE POSITIVE/NEGATIVE PRESSURE CMOS 6 7 8 LEADFORM OPTION OPEN CONSULT FACTORY OPEN SOP* ONLY SHIPPING METHOD NONE TRAYS T1 TAPE AND REEL U RAIL MAXIMUM PRESSURE IN kPa EXCEPT FOR MPX2300 EXPRESSED IN mmHg SG187 (Selector Guide) (1Q2014) – 37 PRODUCT TYPE ABSOLUTE GAUGE DIFFERENTIAL VACUUM/GAUGE S SX W AXIAL PORT (SMALL OUTLINE PACKAGE) PORTED (UNIBODY) P SINGLE PORT Dp DIFFERENTIAL PORT STOVEPIPE PORT (UNIBODY) AXIAL PORT (UNIBODY) ROBUST AXIAL PORT Product Numbering System for ARM Devices MAC 7 1 x x C FV 50 xx STATUS OF PRODUCT: MAC FULLY QUALIFIED SAC FULLY QUALIFIED AVAIL FOR AUTO CUSTOMERS PAC PRODUCT ENGINEERING EXTRA PACKAGE DESIGNATORS BUS SPEED CORE PACKAGE TYPE FU 100 LQFP PV 112/144 LQFP VF 208 MAP BGA GENERATION (FAMILY) PINOUT/PACKAGE OPTION DESIGNATOR TEMPERATURE RANGE C -40°C TO 85°C V -40°C TO 105°C M -40°C TO 125°C SEQUENTIAL DEVICE NUMBER Product Numbering System for Analog and Power Management Devices MCx PRODUCT CATEGORY MC - QUALIFIED STANDARD SC - CUSTOM DEVICE PC - PROTOTYPE DEVICE xxZ - ENVIRONMENTAL PKG (SOIC only) MXX PRODUCT CATEGORY MC/MPC - QUALIFIED STANDARD SC/SPC - CUSTOM DEVICE PC/PPC - PROTOTYPE DEVICE tt or xxx TEMPERATURE RANGE 33 = AUTO -40°C TO +(105°C - 125)°C 34 = IND -40°C TO +(70°C - 85)°C 35 = -55°C TO +(125 − 150)°C 900 - CUSTOM xxx r v CORE/TARGET REVISION (default blank) OPTIONAL VARIATION (default blank) xxxxx r CORE/TARGET REVISION (default blank) OPTIONAL PPP r PPP PACKAGING TAPE AND REEL DESIGNATOR INDICATOR RR PACKAGING REVISION TAPE AND REEL DESIGNATOR (default blank) INDICATOR OPTIONAL SG187 (Selector Guide) (1Q2014) – 38 RR Product Numbering System for Analog eXtreme Switch Devices MC rd XS PRODUCT CATEGORY MC - QUALIFIED STANDARD SC - CUSTOM DEVICE PC - PROTOTYPE DEVICE g FAMILY XS = eXtreme SWITCH o GENERATION AUTO IND 3 = Gen 3 = C 4 = Gen 4 = D 5 = Gen 5 = E 6 = Gen 6 = F ON-RESISTANCE (mOhm) rd r # OF OUTPUTS 2 = DUAL 4 = QUAD 5 = PENTA PPP REVISION (default blank) RR PACKAGING TAPE AND REEL DESIGNATOR INDICATOR ON-RESISTANCE (mOhm) 00 - All outputs same Product Numbering System for Analog Embedded MCU + Power and SiP Devices MM 9 PRODUCT CATEGORY MM - QUALIFIED STANDARD SM - CUSTOM STANDARD PM - PROTOTYPE DEVICE MEMORY TYPE 9 = FLASH, OTP BLANK = ROM CC f V xxx r t v PPP RR MEMORY SIZE REVISION TEMPERATURE PACKAGING TAPE AND REEL CORE 08 = HC08 RANGE (default blank) DESIGNATOR INDICATOR A = 1K 12 = HC12 B = 2K I = 0°C TO 85°C 16 = HC16 ANALOG C = 4K C = -40°C TO 85°C (IND) Z1: S12Z - FXPU CORE/TARGET D = 8K V = -40°C TO 105°C (W/ FIX POINT UNIT) E = 16K M = -40°C TO 125°C Z2: S12Z - FPU F = 32K PROCESSOR (W/ FLOATING POINT UNIT) CORE G = 48K VARIATION VARIANT H = 64K (default blank) (default blank) I = 96K SiP devices: J = 128K P=S12P K = 256K S=S12XS L = 512K E=S12XEP M = 768K SG187 (Selector Guide) (1Q2014) – 39 8-Bit Automotive Microcontroller Part Numbering System* EXAMPLES: S S 9 9 S08 S08 SL DZ 16 128 F F 1 M 2 M TJ LF S SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE QUALIFIED MC = GENERAL MARKET QUALIFIED SC = CUSTOM BUILD PACKAGE OPTION TEMPERATURE OPTIONS C = -40°C TO +85°C V = -40°C TO +105°C M = -40°C TO +125°C J = -40°C TO +140°C W = -40°C TO +150°C MEMORY TYPE 9 = FLASH 3 = ROM (IF AVAILABLE) CORE DEVICE FAMILY PRODUCT REVISION FLASH SIZE MANUFACTURING SITE *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. 16-Bit Automotive Microcontroller Part Numbering System* EXAMPLES: S S 9 9 S12 HZ S12 EG 256 128 J J 3 C AL 2 C AA R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE QUALIFIED MC = GENERAL MARKET QUALIFIED SC = CUSTOM BUILD PACKAGE OPTION TEMPERATURE OPTIONS C = -40°C TO +85°C V = -40°C TO +105°C M = -40°C TO +125°C J = -40°C TO +140°C MEMORY TYPE 9 = FLASH 3 = ROM (IF AVAILABLE) CORE PRODUCT REVISION DEVICE FAMILY MANUFACTURING SITE FLASH SIZE *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. SG187 (Selector Guide) (1Q2014) – 40 32-Bit Automotive Microcontroller Part Numbering System for Qorivva 55xx Devices* EXAMPLES: M PC 5554 M VR 132 S PC 5514E A C LQ 48 R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE MC = GENERAL MARKET QUALIFIED BUS SPEED PACKAGE OPTION POWER ARCHITECTURE CORE TEMPERATURE OPTIONS A = -55°C TO +125°C C = -40°C TO +85°C V = -40°C TO +105°C M = -40°C TO +125°C PRODUCT NAME RESERVED/OPTIONAL FIELD *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. 32-Bit Automotive Microcontroller Part Numbering System for Qorivva 56xx Devices* EXAMPLES: P PC 5604B E M VR S PC 5604S E M LQ R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE MC = GENERAL MARKET QUALIFIED PACKAGE OPTION POWER ARCHITECTURE CORE TEMPERATURE OPTIONS C = -40°C TO +85°C V = -40°C TO +105°C M = -40°C TO +125°C PRODUCT NAME RESERVED/OPTIONAL FIELD *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. SG187 (Selector Guide) (1Q2014) – 41 SG187 (Selector Guide) (1Q2014) – 42 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support Freescale, the Freescale logo and SMARTMOS are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc. SG187 Q1 2014, Rev 54 1/2014