View the Part Number Specific Data Sheet for full specifications

ECLIPTEK
PART NUMBER DATA SHEET
CORPORATION
ECX-6363-20.250M
REGULATORY COMPLIANCE
R
(Data Sheet downloaded on Jun 28, 2016)
2011/65 +
2015/863
163 SVHC
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers,
certain parameters are intentionally excluded from this specification sheet.
ELECTRICAL SPECIFICATIONS
Nominal Frequency
20.250MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
Gross Leak Test
MIL-STD-883, Method 1014 Condition C
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 1 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6363-20.250M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
ECX6363
4.50
MAX
13.30 MAX
0.50 MIN (x2)
4.88 ±0.20
4.85
MAX
0.80 ±0.30 (x2)
11.60 MAX
NOTE: Coplanarity 0.360 MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0
Solder Land
(X2)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 2 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6363-20.250M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 3 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6363-20.250M
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
5°C/Second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 4 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200