Material Content Data Sheet Sales Product Name SAK-XC2336B-40F20L AA MA# MA001026352 Package PG-LQFP-64-6 Issued 29. August 2013 Weight* 372.45 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 28.688 7.70 0.032 0.01 0.130 0.03 349 2.600 0.70 6980 105.558 28.34 29.08 283417 290833 1.862 0.50 0.50 4999 4999 1.096 0.29 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 7.70 77025 77025 87 2943 29.600 7.95 188.562 50.64 58.88 506278 588695 4.066 1.09 1.09 10916 10916 1.611 0.43 0.43 4325 4325 2.161 0.58 6.482 1.74 79474 5802 2.32 17405 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 23207 1000000