INTEGRATED CIRCUITS 74LVC04A Hex inverter Product specification Supersedes data of 1997 Mar 28 IC24 Data Handbook 1997 Jun 30 Philips Semiconductors Product specification 74LVC04A Hex inverter FEATURES DESCRIPTION • Wide supply range of 1.2V to 3.6V • Complies with JEDEC standard no. 8-1A • Inputs accept voltages up to 5.5V • CMOS low power consumption • Direct interface with TTL levels • 5-volt tolerant inputs, for interfacing with 5-volt logic The 74LVC04A is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V/5 V environment. The 74LVC04A provides six inverting buffers. QUICK REFERENCE DATA GND = 0 V; Tamb = 25°C; tr = tf 2.5 ns PARAMETER SYMBOL tPHL/tPLH Propagation delay nA to nY CI Input capacitance CPD CONDITIONS CL = 50 pF; VCC = 3.3 V Power dissipation capacitance per gate Notes 1 and 2 TYPICAL UNIT 2.5 ns 5.0 pF 25 pF NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW) PD = CPD VCC2 x fi (CL VCC2 fo) where: fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V; (CL VCC2 fo) = sum of the outputs. 2. The condition is VI = GND to VCC. ORDERING INFORMATION TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 14-Pin Plastic SO PACKAGES –40°C to +85°C 74LVC04A D 74LVC04A D SOT108-1 14-Pin Plastic SSOP Type II –40°C to +85°C 74LVC04A DB 74LVC04A DB SOT337-1 14-Pin Plastic TSSOP Type I –40°C to +85°C 74LVC04A PW 74LVC04APW DH SOT402-1 PIN CONFIGURATION PIN DESCRIPTION PIN NUMBER SYMBOL 1A 1 14 V CC 1, 3, 5, 9, 11, 13 1A to 6A Data inputs NAME AND FUNCTION 1Y 2 13 6A 2, 4, 6, 8, 10, 12 1Y to 6Y Data outputs 2A 3 12 6Y 7 GND Ground (0 V) 2Y 4 11 5A 14 VCC Positive supply voltage 3A 5 10 5Y 3Y 6 9 4A GND 7 8 4Y SV00396 1997 Jun 30 2 853-1953 18162 Philips Semiconductors Product specification 74LVC04A Hex inverter LOGIC SYMBOL LOGIC DIAGRAM (ONE GATE) 1 1A 1Y 2 3 2A 2Y 4 5 3A 3Y 6 9 4A 4Y 8 5A 5Y 10 11 6A 13 A SV00399 FUNCTION TABLE SV00397 LOGIC SYMBOL (IEEE/IEC) 1 1 2 3 1 4 5 1 6 9 1 8 11 1 10 13 1 12 SV00398 1997 Jun 30 INPUTS OUTPUTS nA nY L H H L NOTES: H = HIGH voltage level L = LOW voltage level 12 6Y Y 3 Philips Semiconductors Product specification 74LVC04A Hex inverter RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL PARAMETER CONDITIONS UNIT MIN MAX VCC DC supply voltage (for max. speed performance) 2.7 3.6 V VCC DC supply voltage (for low-voltage applications) 1.2 3.6 V 0 5.5 V VI DC Input voltage range VO DC output voltage range Tamb Operating ambient temperature range in free-air tr, tf Input rise and fall times VCC = 1.2 to 2.7V VCC = 2.7 to 3.6V 0 VCC V –40 +85 °C 0 0 20 10 ns/V ABSOLUTE MAXIMUM RATINGS1 Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) PARAMETER SYMBOL VCC CONDITIONS UNIT –0.5 to +6.5 V IIK DC input diode current VI 0 –50 mA VI DC input voltage Note 2 –0.5 to +5.5 V IOK DC output diode current VO VCC or VO 0 VO DC output voltage Note 2 IO DC output source or sink current VO = 0 to VCC IGND, ICC Tstg PTOT DC supply voltage RATING DC VCC or GND current Storage temperature range Power dissipation per package – plastic mini-pack (SO) – plastic shrink mini-pack (SSOP and TSSOP) above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K 50 mA VCC + 0.5 V 50 mA 100 mA –65 to +150 °C 500 500 mW NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1997 Jun 30 4 Philips Semiconductors Product specification 74LVC04A Hex inverter DC CHARACTERISTICS Over recommended operating conditions voltages are referenced to GND (ground = 0V) LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C TYP1 MIN VIH HIGH level Input voltage VIL LOW level Input voltage VCC = 1.2V VCC VCC = 2.7 to 3.6V 2.0 V VCC = 1.2V GND V VCC = 2.7 to 3.6V VOH O HIGH level output voltage VOL LOW level output voltage II ICC ∆ICC UNIT MAX 0.8 VCC = 2.7V; VI = VIH or VIL; IO = –12mA VCC*0.5 VCC = 3.0V; VI = VIH or VIL; IO = –100µA VCC*0.2 VCC = 3.0V; VI = VIH or VIL; IO = –18mA VCC*0.6 VCC = 3.0V; VI = VIH or VIL; IO = –24mA VCC*0.8 VCC V VCC = 2.7V; VI = VIH or VIL; IO = 12mA 0.40 VCC = 3.0V; VI = VIH or VIL; IO = 100µA 0.20 VCC = 3.0V; VI = VIH or VIL; IO = 24mA 0.55 Input leakage current VCC = 3 3.6V; 6V; VI = 5 5.5V 5V or GND Quiescent supply current VCC = 3.6V; VI = VCC or GND; IO = 0 Additional quiescent supply current per input pin VCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 0 V "0 1 "0.1 "5 µA 0.1 10 µA 5 500 µA NOTES: 1. All typical values are at VCC = 3.3V and Tamb = 25°C. AC CHARACTERISTICS GND = 0 V; tr = tf v 2.5 ns; CL = 50 pF LIMITS SYMBOL PARAMETER tPHL/ tPLH VCC = 3.3V ±0.3V WAVEFORM Propagation delay nA to nY 1 VCC = 2.7V VCC = 1.2V MIN TYP1 MAX MIN TYP MAX TYP 1.5 2.5 4.5 1.5 3.2 5.5 16.0 UNIT ns NOTE: 1. These typical values are at VCC = 3.3V and Tamb = 25°C. AC WAVEFORMS TEST CIRCUIT VM = 1.5 V at VCC w 2.7 V VM = 0.5 VCC at VCC < 2.7 V VOL and VOH are the typical output voltage drop that occur with the output load. PULSE GENERATOR VI nA INPUT S1 VCC 500Ω VO VI 2 < VCC Open GND D.U.T. RT VM CL 50pF 500Ω GND tPHL tPLH VOH nY OUTPUT VM VCC VI t 2.7V VCC 2.7V – 3.6V 2.7V Test S1 tPLH/tPHL Open VOL SY00077 SV00395 Waveform 1. Input (nA) to output (nY) propagation delays. 1997 Jun 30 Waveform 2. Load circuitry for switching times. 5 Philips Semiconductors Product specification Hex inverter 74LVC04A SO14: plastic small outline package; 14 leads; body width 3.9 mm 1997 Jun 30 6 SOT108-1 Philips Semiconductors Product specification Hex inverter 74LVC04A SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm 1997 Jun 30 7 SOT337-1 Philips Semiconductors Product specification Hex inverter 74LVC04A TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm 1997 Jun 30 8 SOT402-1 Philips Semiconductors Product specification Hex inverter 74LVC04A NOTES 1997 Jun 30 9 Philips Semiconductors Product specification Hex inverter 74LVC04A DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Copyright Philips Electronics North America Corporation 1997 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: 1997 Jun 30 10 Date of release: 05-96 9397-750-04478