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HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
2
Typical Applications
Features
The HMC650 through HMC658 are ideal for:
Wide Bandwidth: DC - 50 GHz
• Fiber Optics
9 Attenuator Products:
0, 2, 3, 4, 6, 10, 15, & 20 dB Fixed Levels
PASSIVES - CHIP
• Microwave Radio
• Military & Space Hybrids
• Test & Measurement
Power Handling: +25 dBm
HMC651 & HMC658
Die Size: 0.57 x 0.45 x 0.1 mm
• Scientific Instruments
• RF / Microwave Circuit Prototyping
HMC650, HMC652, HMC653, HMC654
HMC655, HMC656 & HMC657
Die Size: 0.42 x 0.45 x 0.1 mm
Included in the HMC-DK006 Designer’s Kit
Functional Diagrams
General Description
The HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657
/ 658 are a line of wideband fixed value 50 Ohm matched attenuator chips which offer relative attenuation
levels of 0, 2, 3, 4, 6, 10, 15 and 20 dB. These passive
though-lines and attenuators are ideal for microstrip,
hybrid, and multi-chip module applications where
extremely flat attenuation, and excellent VSWR vs.
frequency are required.
HMC650, HMC652, HMC653, HMC654,
HMC655, HMC656 & HMC657
These wideband attenuators feature low inductance
on-chip vias, and require no additional ground
connections. The HMC650 through HMC658 are
backside metallized with gold, and are suitable for
eutectic or epoxy die attach. Each of the 9 products
can be purchased individually by their respective
part number or in a set of 10 each in the HMC-DK006
Fixed Attenuator Chip Designer’s Kit.
HMC651, HMC658
2-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Electrical Specifi cations, TA = +25° C, 50 Ohm system [1]
Attenuation Tolerance
Return Loss
Attenuation Tolerance
Units
Attenuator Value
DC - 25
HMC650
Thru Line (short)
20.3
25 - 50
GHz
±0.2
12.4
±0.8
dB
HMC651
Thru Line (long)
19.0
±0.3
12.3
±0.9
dB
HMC652
2 dB
22.0
±0.2
15.3
±0.6
dB
HMC653
3 dB
23.0
±0.2
22.1
±0.5
dB
HMC654
4 dB
20.5
±0.2
22.4
±0.5
dB
HMC655
6 dB
16.5
±0.2
17.0
±0.6
dB
HMC656
10 dB
16.9
±0.1
18.8
±0.7
dB
HMC657
15 dB
20.0
±0.4
19.7
±1.3
dB
HMC658
20 dB
17.5
±0.5
16.2
±1.6
dB
RF Data with Wire Bonds [1]
Attenuation vs. Temperature
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
2
PASSIVES - CHIP
Return Loss
Part Number
0
HMC652
-5
ATTENUATION (dB)
ATTENUATION (dB)
-2
HMC653
-4
HMC654
-6
HMC655
-8
HMC656
-10
-15
-20
-10
0
5
10
15
20
25
30
35
40
45
-25
0
50
HMC657
HMC658
5
10
15
20
25
30
Return Loss
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
0
-5
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
Return Loss
-10
-15
HMC655
HMC654
-20
HMC653
-25
35
40
45
50
FREQUENCY (GHz)
FREQUENCY (GHz)
-10
-15
HMC658
HMC656
-20
HMC657
-25
HMC652
-30
-30
0
10
20
30
FREQUENCY (GHz)
40
50
0
10
20
30
40
50
FREQUENCY (GHz)
[1] Data taken with die mounted to plate and RF probed through two 1 mil diameter wire bonds.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2-3
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
RF Data with Ribbon Bonds [2]
2
Attenuation vs. Temperature
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
0
ATTENUATION (dB)
ATTENUATION (dB)
-5
HMC653
-4
HMC654
-6
HMC655
-8
HMC656
-10
HMC657
-15
HMC658
-20
-10
0
5
10
15
20
25
30
35
40
45
-25
0
50
5
10
15
20
25
30
Return Loss
Return Loss
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
-5
-5
RETURN LOSS (dB)
0
-10
-15
HMC655
HMC654
-20
HMC653
-25
35
40
50
-10
-15
HMC657
HMC658
-20
HMC656
-25
HMC652
-30
-30
0
10
20
30
FREQUENCY (GHz)
40
50
0
10
20
30
40
FREQUENCY (GHz)
[2] Data taken with die mounted to plate and RF probed through two 3 x 0.5 mil ribbon bonds.
2-4
45
FREQUENCY (GHz)
FREQUENCY (GHz)
RETURN LOSS (dB)
PASSIVES - CHIP
HMC652
-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
50
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
RF Data Die Only [3]
Attenuation vs. Temperature
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
2
0
ATTENUATION (dB)
ATTENUATION (dB)
-5
HMC653
-4
HMC654
-6
HMC655
HMC656
-10
-15
-8
-20
-10
0
5
10
15
20
25
30
35
40
45
-25
0
50
HMC657
HMC658
5
10
15
20
25
30
Return Loss
HMC652, HMC653, HMC654, HMC655
HMC656, HMC657, HMC658
0
0
-5
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
Return Loss
-10
-15
HMC655
HMC654
-20
HMC653
-25
35
40
45
50
FREQUENCY (GHz)
FREQUENCY (GHz)
-10
PASSIVES - CHIP
HMC652
-2
HMC656
-15
HMC658
-20
HMC657
-25
HMC652
-30
-30
0
10
20
30
40
50
0
10
FREQUENCY (GHz)
20
30
40
50
FREQUENCY (GHz)
Absolute Maximum Ratings
Part Number
HMC650
HMC651
HMC652
HMC653
HMC654
HMC655
HMC656
HMC657
HMC658
Units
RF Input Power (CW)
N/A
N/A
27
26
25
26
25
25
25
dBm
DC Voltage Terminated
N/A
N/A
5.6
5.2
4.9
5.2
4.9
4.4
4.8
V
DC Voltage Open
N/A
N/A
5.6
5.1
4.6
6.0
5.3
4.6
4.9
V
Storage Temperature
-65 to +150
°C
Operating Temperature
-55 to +85
°C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
[3] Data taken with die mounted to a plate and RF probed directly on die.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2-5
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
PASSIVES - CHIP
2
Outline Drawing
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657
Die Packaging Information
Standard
Alternate
GP-5 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
7. DO NOT BOND ON TOP OF GROUND VIAS
8. OVERALL DIE SIZE ±0.002”
Outline Drawing
HMC651 & HMC658
2-6
[1]
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Pad Descriptions
Function
Description
1, 2
RF1, RF2
This pad is DC coupled and matched to 50 Ohms.
Use DC Blocking capacitors if the input / output signals
have non-zero DC potential
GND
Die bottom must be connected to RF ground.
Interface Schematic
Assembly Diagram
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2
PASSIVES - CHIP
Pad Number
2-7
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
PASSIVES - CHIP
2
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity:
strikes.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Follow ESD precautions to protect against ESD
Transients: Suppress instrument and bias supply transients while bias
is applied. Use shielded signal and bias cables to minimize inductive
pick-up.
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
2-8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Notes:
PASSIVES - CHIP
2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2-9