5913

Package Information
Vishay Siliconix
POWER IC THERMALLY ENHANCED PowerPAKR TSSOP: 14/16-LEAD
3
8
D
CL
6
N
e
−B−
7
R
4
E1
CL
8
GAUGE PLANE
−H−
0.25
E
SEATING PLANE
q1
0.7500
R1
L
L1
DETAIL A
1
0.7500
2 3
Ğ 0.07600
0.025−0.075 DP
PIN 1 INDICATOR
POLISH
e
TOP VIEW
7
−A−
CL
CL
DETAIL A
ccc S
A2
aaa C
A
−C−
B
SEATING PLANE
9
B
A1
b
bbb M C B S A S
Y
c1
CL
5
(b)
X
c
b1
DETAIL B-B
BOTTOM VIEW
EXPOSED PAD
Document Number: 72778
31-Mar-05
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Package Information
Vishay Siliconix
POWER IC THERMALLY ENHANCED PowerPAKR TSSOP: 14/16-LEAD
MILLIMETERS
Dim
A
A1
A2
b
b1
c
c1
D
e
E
E1
L
L1
R
R1
q1
N (14)
N (16)
X
Y (14)
Y (16)
aaa
bbb
ccc
ddd
INCHES*
Min
Nom
Max
Min
Nom
Max
−
−
1.20
−
−
0.0472
0.025
−
0.100
0.001
−
0.0039
0.80
0.90
1.05
0.0315
0.0354
0.0413
0.19
−
0.30
0.0075
−
0.0118
0.19
0.22
0.25
0.0075
0.0087
0.0098
0.09
−
0.20
0.0035
−
0.0079
0.09
−
0.16
0.0035
−
0.0063
4.9
5.0
5.1
0.1929
0.1968
0.2008
0.65 BSC
0.0256 BSC
6.2
6.4
6.6
0.2441
0.2520
0.2598
4.3
4.4
4.5
0.1693
0.1732
0.1772
0.45
0.60
0.75
0.0177
0.0236
0.0295
1.0 REF
0.0394 REF
0.09
−
−
0.0035
−
−
0.09
−
−
0.0035
−
−
0
−
0
0
−
0
14
14
16
16
2.95
3.0
3.05
0.116
0.118
0.120
3.15
3.2
3.25
0.124
0.126
0.128
3.0
3.05
0.116
0.118
0.120
2.95
0.10
0.0039
0.10
0.0039
0.05
0.0020
0.20
0.0079
ECN: S-50568—Rev. B, 04-Apr-05
DWG: 5913
*Dimensions are in mm converted to inches.
NOTES:
1. All dimensions are in millimeters (angles in degrees).
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include internal flash or protrusion.
5. Dimension “b” does not include Dambar protrusion.
6. “N” is the maximum number of lead terminal positions for the specified package length.
7. Datums −A−
and −B− to be determined at datum plane −H− .
8. Dimensions “D” and “E1” are to be determined at datum plane −H− .
9. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip.
10. Refer to JEDEC MO-153, Issue C., Variation ABT.
11. Exposed pad will depend on the pad size of the L/F.
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Document Number: 72778
31-Mar-05