1SC3020W32F0WC01

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COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION
Part No: 1SC3020W32F0WC01
Characters
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3.0mm×2.0mm SMT LED , 1.3mm THICKNESS.
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LOW POWER CONSUMPTION.
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VIEWING ANGLE 120°.
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VARIOUS COLORS AND LENS TYPES AVAILABLE.
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PACKAGE: 2000 PCS/REEL.
ITEM
MATERIALS
Resin(Mold)
Silicon
Lens Color
Yellow
Dice
InGaN
Emitted color
White
Absolute Maximum Ratings（Ta=25℃）
Symbol
Value
Unit
Power Dissipation/DICE
PD
120
mW
DC Forward Current/DICE
IF
30
mA
Single Chip Pulsed Forward Current
IFP
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ +80„
℃
Tstg
-40 ~ +100
℃
Tsol
260for5sec△
℃
Item
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Storage Temperature
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Soldering Temperature
100※
mA
※Duty 1/10, Pulse Width 0.1ms.
„please refer to IF-Ta diagram of curves for the temperature during application
△Soldering time max 10sec
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Electrical-Optical Characteristics（Ta=25℃）
Value
Symbol
Parameter
Forward Voltage
Unit
Test condition
If=20mA
Min.
Typ.
Max.
Vf
2.8
3.2
3.6
V
Iv
2050
2250
﹍
mcd
Luminous intensity
If=20mA
Φv
6
6.5
X
0.3176
Y
0.3270
Wavelength
Reverse Current
Lm
﹍
﹍
﹍
﹍
If=20mA
If=20mA
Ir
﹍
﹍
10
μA
Vr=5V
Viewing angle
2θ1/2
﹍
120
﹍
Deg
If=20mA
Color Rendering Index
CRI
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70
If=20mA
▲ 1.Luminous intensity (IV) ±10%, Forward Voltage (VF ) ±0.1V,
CRI±5.
Wavelength (X,Y) ±0.01
2.IS standard testing
Range of bins
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Bin
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VF(V)
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Bin
BinB
BinC
BinD
BinE
BinF
BinG
BinH
2.8-2.9
2.9-3.0
3.0-3.1
3.1-3.2
3.2-3.3
3.3-3.4
3.4-3.5
BinI
VF(V)
3.5-3.6
Bin
Bin6
Bin7
Bin8
Iv(mcd)
2050-2250
2250-2450
2450-2650
SP
SQ
SR
Bin
WL(nm)
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Color coordinate Comparison
0.37
5450K
0.35
6000K
SP
6650K
0.33
SQ
7400K
SR
0.31
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0.29
0.29
Bin Code
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SR
0
SQ
0
SP
0
0.3
0.31
0.32
0.33
0.34
X
Y
X
Y
X
Y
X
Y
0.3011
0.3127
0.305
0.2972
0.3136
0.3095
0.311
0.3276
0.311
0.3276
0.3136
0.3095
0.3229
0.324
0.3214
0.344
0.3214
0.344
0.3229
0.324
0.3336
0.34
0.334
0.364
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Outline Dimensions
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REC0MMEND PADLAYOUT
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All dimensions are in millimeters.
Tolerance is ±0.1 ㎜ unless other specified
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Specifications are subject to change without notice.
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COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION
DEVICE NUMBER: 1SC3020W32F0WC01
Fig.2 Relative Luminous Intensity-IF
(Ta=25℃)
Forward Current IF(mA)
Relative Luminous Intensity
Fig.1 IF-VF(Ta=25℃)
Forward Voltage VF(V)
Fig.4 Relative Luminous Intensity-Ta
Wavelength λ (nm)
Fig.5 IF-Ta
Ambient Temperature Ta (℃)
Directive Characteristics（Ta=25℃）
Forward Current IF(mA)
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Forward Current IF(mA)
Relative Luminous Intensity
Relative Luminous Intensity
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Fig.3 Wavelength Characteristics(Ta=25℃)
Ambient Temperature Ta (℃)
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Reflow Profile
„ Reflow Temp/Time
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NOTES:
1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time .
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Test circuit and handling precautions
„ Test circuit
„ Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
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2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
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It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x(12~24hrs) and ＜5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
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Test items and results of reliability
Environmental
Sequence
Type
Test Item
Test Conditions
Note
Number of
Damaged
Temperature Cycle
-45℃ 30min
↑↓20 min
105℃ 30min
100 cycle
0/22
Thermal Shock
-10℃ 15min
↑↓5min
100℃ 15min
100 cycle
0/22
10 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
High Humidity Heat Cycle
High Temperature Storage
30℃⇔ 65℃
90%RH 24hrs/1cycle
Ta=100℃
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Humidity Heat Storage
Low Temperature Storage
Operation
Sequence
Life Test
High Humidity Heat Life Test
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Low Temperature Life Test
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Ta=85℃
RH=85%
Ta=-40℃
Ta=25℃
IF=20mA
85℃ RH=85%
IF=15mA
Ta=-20℃
IF=20mA
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3020 Single-Color High Performance SMD Top LEDs Packaging Specifications
z Feeding Direction
z Dimensions of Reel (Unit: mm)
Feeding Direction
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Polarity Mark
z Dimensions of Tape (Unit: mm)
z Arrangement of Tape
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 2,000pcs/Reel
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3020 Single-Color High Performance SMD Top LEDs Packaging Specifications
z
Packaging specifications
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NOTES:
Reeled products (The most numbers of products are 2,000pcs) packed in a seal off
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0 moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total
0 maximum number of products are 14,000pcs) packed in an inside box (size: about 238mm x about
0 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about
410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot
No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should
appear on the section request form on the cardboard box.) .
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LED Usage and Handling Instructions
No.1、soldering
A、It’s not better to be manual soldering.
B、Reflow soldering：
（1）Soldering according to the following temperature chart is highly recommended
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（2）Soldering paste
Use soldering paste with the melting point at 230℃ is recommended
No.2、Collet
（1）Abnormal situation caused by improper setting of collet
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To choose the right collet is the key issue in improving the product’s quality. LED is different
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from other electronic components, which is not only about electrical output but also for optical output.
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This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height
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is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which
will cause the LED fail to light up, light up now and then or other quality problems
（2）How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of
lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets
fit for different products, please refer to the following pictures cross out:.
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Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1（√）
Picture 2（×）
（3）How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will
directly affect the quality of products during SMT is that if the collect go down too much,
it will press lens and cause the distortion or breaking of gold wire. The setting of collet
position should follow the pictures belowed.
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Picture 3（√）
Picture 4（×）
No.3、Other points for attention
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A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
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B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and
should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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