1SC3020W32F0WC05

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Features
§
forward current ≦30mA
§
Wide viewing angle:120°
§
Operating Temperature -30~80℃
§
Storage temperature-40~100℃
§
Junction Temperature110℃
§
ROHS and REACH-compliant
§
PACKAGE:2000 PCS/REEL.
§
Qualified according to JEDEC moisturevity Level 3
§
Chip material: InGaN
§
Reverse Voltage:5V
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Product Identification Code
1
Process
Type
Category
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0
LED Type
0
Size
S
C 3020 W32F 0 W C 05
Special
White code
PCB module
code
Cap color
Lap polarity
Dice wavelength
0
0
0
Electrical-Optical Characteristics(Ta=25℃)
Value
Symbol
Parameter
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
Vf
2.8
3.2
3.8
V
If=20mA
Luminous intensity
Iv
1850
2050
﹍
mcd
If=20mA
X
0.312
﹍
﹍
If=20mA
Y
0.3188
﹍
﹍
If=20mA
﹍
﹍
10
μ A
Vr=5V
﹍
120
﹍
Deg
If=20mA
Wavelength
Reverse Current
Ir
Viewing angle
2θ
1/2
▲ .Luminous intensity (IV) ±10%, Forward Voltage(VF) ±0.1V, Wavelength(X、Y )±0.01
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2.IS standard testing
Range of bins
Bin
BinB
BinC
BinD
BinE
BinF
BinG
BinH
VF(v)
2.8-2.9
2.9-3.0
3.0-3.1
3.1-3.2
3.2-3.3
3.3-3.4
3.4-3.5
Bin
BinI
VF(v)
3.5-3.6
Bin6
Bin7
Bin8
2050-2250
2250-2450
2450-2650
SQ4
SQ5
SR3
SR4
SR5
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Bin5
Bin
0 Iv(mcd) 1850-2050
0
Bin
0 WL(nm)
SQ3
0
0
0
Color Coordinate Comparison
X
Y
X
Y
X
BIN 碼
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Y
X
Y
SQ3
0.3124
0.3142
0.3136
0.3060
0.3234
0.3151
0.3229
0.3240
SQ4
0.3110
0.3230
0.3124
0.3142
0.3229
0.3240
0.3222
0.3331
SQ5
0.3095
0.3320
0.3110
0.3230
0.3222
0.3331
0.3214
0.3434
SR3
0.3030
0.3050
0.3050
0.2972
0.3136
0.3060
0.3124
0.3142
SR4
0.3011
0.3127
0.3030
0.3050
0.3124
0.3142
0.3110
0.3230
SR5
0.2989
0.3213
0.3011
0.3127
0.3110
0.3230
0.3095
0.3320
Relative Radiant Intensity
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0
Relative Spectral Power Distribution
0
1.0
0
0.75
0.5
0.25
0
350
400
450
500
550
600
650
Wavelength(nm)
0
700
750
Relative luminous Intensity(%)
Optical Characteristics-1
Typical Spatial Distribution
Genealogies angle
0
0
Optical Characteristics -2
150
125
100
75
50
25
0
0
10
5
15
20
25
Relative Luminous Flux .Ambient Temperature
Relative Luminous intensity(%)
Relative Lumious Flux(%)
Relative Luminous Flux .Current
30
Forward Current (mA)
Ambient Temperature(°)
Electrical Characteristics
Thermal Design
25
20
15
10
5
0
1.5
2
2.5
3
3.5
Maximum Current(mA)
Forward Current IF(mA)
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30
Forward Voltage VF(V)
Ambient Temperature(°)
Ambient Temperature(°)
Light effect VS Current
Light effect(%)
Relative Forward Voltage(%)
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Forward Voltage Temperature
0
0
0
Forward Current (mA)
0
0
0
Outline Dimensions
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REC0MMEND PADLAYOUT
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0
0
§
All dimensions are in millimeters.
§
Tolerance is ±0.1 ㎜ unless other specified
§
Specifications are subject to change without notice.
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Reflow Profile
1. IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
300
sec
2.IR reflow soldering Profile
Lead solder
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300
℃
1-5℃/sec
temperature
250
10sec. max
210℃ max
Pre heating 150-180℃
200
240℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
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0
0
NOTES:
0
0
50
100
Time
150
200
250
300
sec
1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2.Don’t cause stress to the silicone resin while it is exposed to high temperature.
3.Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
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Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
0
≦20%R.H. with zip-lock sealed.
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3.Baking
0
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃
x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
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Packing -1
3020 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
Feeding Direction
 Dimensions of Tape (Unit: mm)
Polarity Mark
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 Arrangement of Tape
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA
RS-481 specifications;
4. 2,000pcs/Reel
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Packing-2
3020 Single-Color High Performance SMD Top LEDs Packaging Specifications

Packaging specifications
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NOTES:
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Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag
0
0 along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of
0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and
four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about
229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the
label on the moisture-proof bag, part No. And quantity should appear on the section request form on the
cardboard box.) .
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Precautions
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not
well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will
cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out:.
Outer diameter of collet should
be larger than the lighting area
Outer diameter of collet
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Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly affect
the quality of products during SMT is that if the collect go down too much, it will press lens and cause
the distortion or breaking of gold wire. The setting of collet position should follow the pictures
belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy
to break.
C、LED should be used as soon as possible when being taken out of the original package, and should be
stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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Test items and results of reliability
Type
Test Item
Test Standard Test Conditions
Environmental
Sequence
Temperature Cycle
Thermal Shock
High Temperature Storage
Humidity Heat Storage
JEITA ED-4701
300 303
JEITA ED-4701
200 303
JEITA ED-4701
200 201
Note
Number of
Damaged
100 cycle
0/50
20 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
-40℃ 30min
↑↓5 min
100℃ 30min
-10℃ 15min
↑↓5sec
100℃ 15min
Ta=100℃
JEITA ED-4701
Ta=60℃
100 103
RH=90%
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Low Temperature Storage
JEITA ED-4701
200 202
Tested with
Life Test
Brightek
Operation
Sequence
standard
High Humidity
Heat Life Test
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Low Temperature Life Test
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Tested with
Brightek
standard
Tested with
Brightek
standard
Ta=-40℃
Ta=25℃
IF=20mA
60℃ RH=90%
IF=15mA
Ta=-20℃
IF=20mA
Judgment criteria of failure for the reliability
Measuring items
Symbol
Measuring conditions
Judgement criteria for failure
Forward voltage
Vf(V)
IF=20mA
Over U×1.2
Reverse current
IR(uA)
Vr=5V
Over U×2
0
0
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