1SC3528V22D0CE01

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COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION
Part No: 1SC3528V22D0CE01
Characters
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2.8mm×3.5mm SMT LED , 1.9mm THICKNESS.
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LOW POWER CONSUMPTION.
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VIEWING ANGLE 120°.
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VARIOUS COLORS AND LENS TYPES AVAILABLE.
§ PACKAGE: 2000 PCS/REEL.
ITEM
MATERIALS
Resin(Mold)
Silicone
Lens Color
Water Transparent
Dice
AlGaInP
Emitted color
Red
Absolute Maximum Ratings(Ta=25℃)
Item
Symbol
PD
Power Dissipation/DICE
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Value
Unit
100
mW
30
mA
100※
mA
DC Forward Current/DICE
IF
Single Chip Pulsed Forward Current
IFP
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ +80
℃
Tstg
-40 ~ +100
℃
Tsol
260for5sec△
℃
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Soldering Temperature
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※ Duty 1/10,Pulse Width 0.1ms .
△ Soldering time max 10sec
please refer to IF-Ta diagram of curves for the temperature during application
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Electrical-Optical Characteristics(Ta=25℃)
Value
Symbol
Parameter
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
Vf
1.7
1.9
2.4
V
If=20mA
Luminous intensity
Iv
120
210
﹍
mcd
If=20mA
λ d
620
635
nm
If=20mA
Ir
﹍
﹍
10
μ A
Vr=5V
﹍
120
﹍
Deg
If=20mA
Wavelength
Reverse Current
Viewing angle
2θ
1/2
▲ Luminous intensity (IV) ±10%, Forward Voltage (VF)
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±0.1V, Wavelength(λd) ±0.5nm
IS standard testing
Range of bins
Bin
Bin1-a
Bin1-b
Bin1-c
Bin1-d
Bin1-e
Bin2
Bin3
Iv(mcd) 3-6
6-9
9-13
13-20
20-30
30-40
40-55
Bin
Bin5
Bin6
Bin7
Bin8
Bin9
Bin10
Iv(mcd) 55-70
70-90
90-120
120-160
160-210
210-270
270-350
Bin
Bin12
Bin13
Bin14
Bin15
Bin16
Bin17
460-600
600-780
780-1000
1000-1300
1300-1700
1700-2200
Bin19
Bin20
Bin21
Bin22
Bin23
Bin24
2800-3600
3600-4600
4600-6000
6000-7800
7800-10100 10100-13130
Bin4
Bin11
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0 Iv(mcd) 350-460
Bin18
0 Bin
0 Iv(mcd) 2200-2800
Bin
Bin25
Bin26
Iv(mcd) 13130-17000 17000-22100
Bin
WL(nm)
C
D
E
620-625
625-630
630-635
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Outline Dimensions
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All dimensions are in millimeters(inch).
Tolerance is ±0.1 ㎜(0.004〞) unless other
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Specifications are subject to change without notice.
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specified
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COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION
DEVICE NUMBER:
1SC3528V22D0CE01
Fig.2 Relative Luminous Intensity-IF
(Ta=25℃)
Relative Luminous Intensity
Forward Current IF(mA)
Fig.1 IF-VF(Ta=25℃)
Forward Voltage VF(V)
Forward Current IF(mA)
Fig.3 Wavelength Characteristics
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Fig.4 Relative Luminous Intensity-Ta
Relative Luminous Intensity
Relative Luminous Intensity
(Ta=25℃)
Wavelength λ (nm)
Fig.5 IF-Ta
Ambient Temperature Ta (℃)
Directive Characteristics(Ta=25℃)
Forward Current IF(mA)
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Ambient Temperature Ta (℃)
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Reflow Profile
 Reflow Temp/Time
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NOTES:
1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
 Handling precautions
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1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x(12~24hrs) and <5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
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Test items and results of reliability
Type
Test Item
Test Conditions
Note
Number of
Damaged
100 cycle
0/22
100 cycle
0/22
-45℃ 30min
Temperature Cycle
↑↓20 min
105℃ 30min
-10℃ 15min
Environmental
Sequence
Thermal Shock
↑↓5sec
100℃ 15min
High Humidity Heat Cycle
30℃ 65℃
90%RH 24hrs/1cycle
10 cycle
0/22
High Temperature Storage
Ta=100℃
1000 hrs
0/22
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Humidity Heat Storage
Ta=85℃
RH=85%
1000 hrs
0/22
Low Temperature Storage
Ta=-40℃
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
Operation
Sequence
Life Test
High Humidity Heat Life Test
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Low Temperature Life Test
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Ta=25℃
IF=20mA
85℃ RH=85%
IF=15mA
Ta=-20℃
IF=20mA
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3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
Feeding Direction
 Dimensions of Tape (Unit: mm)
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 Arrangement of Tape
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 2,000pcs/Reel
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3528 Single-Color High Performance SMD Top LEDs Packaging Specifications

Packaging specifications
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NOTES:
Reeled products (The most numbers of products are 2,000pcs) packed in a seal off
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0 moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total
0 maximum number of products are 14,000pcs) packed in an inside box (size: about 238mm x about
0 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about
410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot
No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should
appear on the in section request form on the cardboard box.) .
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LED Usage and Handling Instructions
No.1、soldering
A、It’s not better to be manual soldering
B、Reflow soldering:
1、Soldering according to the following temperature chart is highly recommended
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2、Soldering paste
Use soldering paste with the melting point at 230℃ is recommended
No.2、Collet
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different
from other electronic components, which is not only about electrical output but also for optical output.
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This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height
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is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which
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will cause the LED fail to light up, light up now and then or other quality problems
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2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of
lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets
fit for different products, please refer to the following pictures cross out:.
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Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will
directly affect the quality of products during SMT is that if the collect go down too
much, it will press lens and cause the distortion or breaking of gold wire. The setting
of collet position should follow the pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
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A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
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B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and
cross out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and
should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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