1TC5003W32E2WF02

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Features
§
forward current ≦30*3mA
§
Wide viewing angle:120°
§
Operating Temperature -40~80℃
§
Storage temperature-40~100℃
§
Junction Temperature110℃
§
ROHS and REACH-compliant
§
PACKAGE:1000 PCS/REEL.
§
Qualified according to JEDEC moisturevity Level 3
§
Chip material: InGaN
§
Reverse Voltage:5V
§
Duty 1/10,Pulse Width 0.1ms
Product Identification Code
0000000000000000000000000000000000000000000000000000000
1
Process
Type
Category
LED Type
00000000000000
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Size
0
0
T
C 5003 W32E 2 W F 02
Special
White code
PCB module
code
Cap color
Lap polarity
Dice wavelength
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0
0
Electrical-Optical Characteristics(Ta=25℃)
Value
Parameter
Symbol
Min.
Typ.
Max.
3.8
Forward Voltage
Vf
2.8
3.2
Luminous intensity
Iv
6000
6900
X
0.3233
﹍
Y
0.3375
﹍
Wavelength
Reverse Current
Viewing angle
Color Rendering Index
Unit
Test
condition
V
If=20mA*3
mcd
If=20mA*3
﹍
If=20mA*3
﹍
If=20mA*3
Ir
﹍
﹍
10
μA
Vr=5V
2θ1/2
﹍
120
﹍
Deg
If=20mA*3
CRI
﹍
70
﹍
%
If =20mA*3
﹍
K
If =20mA*3
﹍
Color Temperature
CCT
6300
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▲ 1.Luminous intensity (IV) ±10%, Forward Voltage(VF) ±0.1V, Wavelength(X,Y) ±0.01
2.IS standard testing
Range of bins
BinC
BinD
Bin
2.9-3.0
3.0-3.1
VF(V)
Bin22
Bin23
Bin
00000000000000
Iv(mcd) 6000-7800 7800-10100
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Bin
0 WL(nm)
SP4/5
SQ4/5
BinE
BinF
BinG
BinH
3.1-3.2
3.2-3.3
3.3-3.4
3.4-3.5
0
0
0
0
Color Coordinate Comparison
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0000000000000000000000000000000000000000000000000000000
BIN 碼
X
Y
X
Y
X
Y
X
Y
SP4
0.3222
0.3331
0.3229
0.324
0.3332
0.3323
0.3338
0.3432
SP5
0.3214
0.3434
0.3222
0.3331
0.3338
0.3432
0.3339
0.3545
SQ4
0.311
0.323
0.3124
0.3142
0.3229
0.324
0.3222
0.3331
SQ5
0.3095
0.332
0.311
0.323
0.3222
0.3331
0.3214
0.3434
00000000000000
0
0
0
0
0
Dice wavelength
0
Optical Characteristics-1
100%
80%
60%
40%
20%
0%
350
450
550
650
750
850
Typical Spatial Distribution
Relative luminous Intensity(%)
Relative Radiant Power(%)
Relative Spectral Power Distribution
Genealogies angle
Wavelength(nm)
Relative Luminous Flux .Ambient Temperature
Relative Luminous Flux(%)
Relative Lumious Flux(%)
Relative Luminous Flux .Current
150
110%
125
0000000000000000000000000000000000000000000000000000000
90%
100
75
50
25
0
0
10
5
15
20
25
30
70%
50%
30%
20
Forward Current (mA)
Electrical Characteristics
Maximum Current(mA)
Forward Current IF(mA)
10
5
2.5
Forward Voltage VF(V)
3
100 115
80
Thermal Design
15
2
60
Junction Temperature(°)
00000000000000
30
0
25
0
20
0
0
1.5
40
Rth=600°/W
Rth=700°/W
3.5
Ambient Temperature(°)
0
0
0
Optical Characteristics-2
Light effect VS Current
Forward
Light effect(%)
Voltage(%)
Forward Voltage Temperature
Temperature(℃)
Forward Current (mA)
0000000000000000000000000000000000000000000000000000000
00000000000000
0
0
0
0
0
0
Outline Dimensions
0.6
3
5
4
5.0
6
0.6
0.2
5
3
1
6
1.1
4
2
1.1
5.0
5.4±0.1
1
2
C1.0
3.34
0.8
1.6
5
20mA
3
20mA
20mA
1
45°
0000000000000000000000000000000000000000000000000000000
3.4
unit:mm
2
4
6
00000000000000
0
0
0
§
All dimensions are in millimeters.
Tolerance is ±0.1 ㎜ unless other specified
§
Specifications are subject to change without notice.
§
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Reflow Profile
1.IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
300
sec
2.IR reflow soldering Profile
0000000000000000000000000000000000000000000000000000000
Lead solder
300
℃
1-5℃/sec
temperature
250
10sec. max
210℃ max
Pre heating 150-180℃
200
240℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
50
00000000000000
0
0
0
25℃
0
0
50
100
Time
150
200
250
300
sec
NOTES:
1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2.Don’t cause stress to the silicone resin while it is exposed to high temperature.
3.Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
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Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
00000000000000
Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃
x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
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Packing-1
5050 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
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 Dimensions of Tape (Unit: mm)
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA
RS-481 specifications;
4.1,000pcs/Reel
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Packing-2
5050 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Packaging specifications
0000000000000000000000000000000000000000000000000000000
NOTES:
Reeled products (The most numbers of products are 1,000pcs) packed in a seal off moisture-proof bag
00000000000000
0 along with a desiccant one by one, Five moisture-proof bag of maximums (total maximum number of
0 products are 5,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and
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four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about
229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the
label on the moisture-proof bag, part No. And quantity should appear on the insection request form on the
cardboard box.) .
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Precautions
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not
well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will
cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out:.
Outer diameter of collet should
be larger than the lighting area
Outer diameter of collet
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Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly affect
the quality of products during SMT is that if the collect go down too much, it will press lens and cause the
distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and
should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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Test items and results of reliability
Type
Test Item
Test Standard Test Conditions
Environmental
Sequence
Temperature Cycle
Thermal Shock
High Temperature Storage
Humidity Heat Storage
JEITA ED-4701
300 303
JEITA ED-4701
200 303
JEITA ED-4701
200 201
↑↓5 min
↑↓5sec
Ta=100℃
RH=90%
Operation
Sequence
standard
High Humidity
Heat Life Test
Tested with
Brightek
standard
Tested with
Ta=-40℃
Ta=25℃
IF=60mA
60℃ RH=90%
IF=30mA
Ta=-20℃
00000000000000
IF=60mA
standard
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0 15、Judgment criteria of failure for the reliability
Low Temperature Life Test
Brightek
20 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
100℃ 15min
100 103
Brightek
Life Test
0/50
-10℃ 15min
Ta=60℃
Tested with
100 cycle
100℃ 30min
JEITA ED-4701
200 202
Number of
Damaged
-40℃ 30min
0000000000000000000000000000000000000000000000000000000
JEITA ED-4701
Low Temperature Storage
Note
Measuring items
Symbol
Measuring conditions
Judgement criteria for failure
Forward voltage
Vf(V)
IF=60mA
Over U×1.2
Reverse current
IR(uA)
Vr=5V
Over U×2
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