0 Features § forward current ≦30*3mA § Wide viewing angle:120° § Operating Temperature -40~80℃ § Storage temperature-40~100℃ § Junction Temperature110℃ § ROHS and REACH-compliant § PACKAGE:1000 PCS/REEL. § Qualified according to JEDEC moisturevity Level 3 § Chip material: InGaN § Reverse Voltage:5V § Duty 1/10，Pulse Width 0.1ms Product Identification Code 0000000000000000000000000000000000000000000000000000000 1 Process Type Category LED Type 00000000000000 0 Size 0 0 T C 5003 W32E 2 W F 02 Special White code PCB module code Cap color Lap polarity Dice wavelength 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Value Parameter Symbol Min. Typ. Max. 3.8 Forward Voltage Vf 2.8 3.2 Luminous intensity Iv 6000 6900 X 0.3233 ﹍ Y 0.3375 ﹍ Wavelength Reverse Current Viewing angle Color Rendering Index Unit Test condition V If=20mA*3 mcd If=20mA*3 ﹍ If=20mA*3 ﹍ If=20mA*3 Ir ﹍ ﹍ 10 μA Vr=5V 2θ1/2 ﹍ 120 ﹍ Deg If=20mA*3 CRI ﹍ 70 ﹍ % If =20mA*3 ﹍ K If =20mA*3 ﹍ Color Temperature CCT 6300 0000000000000000000000000000000000000000000000000000000 ▲ 1.Luminous intensity (IV) ±10%, Forward Voltage(VF) ±0.1V, Wavelength(X,Y) ±0.01 2.IS standard testing Range of bins BinC BinD Bin 2.9-3.0 3.0-3.1 VF(V) Bin22 Bin23 Bin 00000000000000 Iv(mcd) 6000-7800 7800-10100 0 Bin 0 WL(nm) SP4/5 SQ4/5 BinE BinF BinG BinH 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 0 0 0 0 Color Coordinate Comparison 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0000000000000000000000000000000000000000000000000000000 BIN 碼 X Y X Y X Y X Y SP4 0.3222 0.3331 0.3229 0.324 0.3332 0.3323 0.3338 0.3432 SP5 0.3214 0.3434 0.3222 0.3331 0.3338 0.3432 0.3339 0.3545 SQ4 0.311 0.323 0.3124 0.3142 0.3229 0.324 0.3222 0.3331 SQ5 0.3095 0.332 0.311 0.323 0.3222 0.3331 0.3214 0.3434 00000000000000 0 0 0 0 0 Dice wavelength 0 Optical Characteristics-1 100% 80% 60% 40% 20% 0% 350 450 550 650 750 850 Typical Spatial Distribution Relative luminous Intensity(%) Relative Radiant Power(%) Relative Spectral Power Distribution Genealogies angle Wavelength(nm) Relative Luminous Flux .Ambient Temperature Relative Luminous Flux(%) Relative Lumious Flux(%) Relative Luminous Flux .Current 150 110% 125 0000000000000000000000000000000000000000000000000000000 90% 100 75 50 25 0 0 10 5 15 20 25 30 70% 50% 30% 20 Forward Current (mA) Electrical Characteristics Maximum Current(mA) Forward Current IF(mA) 10 5 2.5 Forward Voltage VF(V) 3 100 115 80 Thermal Design 15 2 60 Junction Temperature(°) 00000000000000 30 0 25 0 20 0 0 1.5 40 Rth=600°/W Rth=700°/W 3.5 Ambient Temperature(°) 0 0 0 Optical Characteristics-2 Light effect VS Current Forward Light effect(%) Voltage(%) Forward Voltage Temperature Temperature(℃) Forward Current (mA) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 Outline Dimensions 0.6 3 5 4 5.0 6 0.6 0.2 5 3 1 6 1.1 4 2 1.1 5.0 5.4±0.1 1 2 C1.0 3.34 0.8 1.6 5 20mA 3 20mA 20mA 1 45° 0000000000000000000000000000000000000000000000000000000 3.4 unit:mm 2 4 6 00000000000000 0 0 0 § All dimensions are in millimeters. Tolerance is ±0.1 ㎜ unless other specified § Specifications are subject to change without notice. § 0 0 0 Reflow Profile 1.IR reflow soldering Profile Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2.IR reflow soldering Profile 0000000000000000000000000000000000000000000000000000000 Lead solder 300 ℃ 1-5℃/sec temperature 250 10sec. max 210℃ max Pre heating 150-180℃ 200 240℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 00000000000000 0 0 0 25℃ 0 0 50 100 Time 150 200 250 300 sec NOTES: 1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2.Don’t cause stress to the silicone resin while it is exposed to high temperature. 3.Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof 0000000000000000000000000000000000000000000000000000000 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 0 ≦20%R.H. with zip-lock sealed. 0 3.Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x 24hrs and ＜5%RH, taped reel type 3.2 100±3℃ x 2hrs , bulk type 3.3 130±3℃ x(15~30min), bulk type It shall be normal to see slight color fading of carrier(light yellow) after baking in process 0 0 0 Packing-1 5050 Single-Color High Performance SMD Top LEDs Packaging Specifications Feeding Direction Dimensions of Reel (Unit: mm) 0000000000000000000000000000000000000000000000000000000 Dimensions of Tape (Unit: mm) 00000000000000 0 0 0 NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4.1,000pcs/Reel 0 0 0 Packing-2 5050 Single-Color High Performance SMD Top LEDs Packaging Specifications Packaging specifications 0000000000000000000000000000000000000000000000000000000 NOTES: Reeled products (The most numbers of products are 1,000pcs) packed in a seal off moisture-proof bag 00000000000000 0 along with a desiccant one by one, Five moisture-proof bag of maximums (total maximum number of 0 products are 5,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and 0 four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the insection request form on the cardboard box.) . 0 0 0 Precautions 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. Outer diameter of collet should be larger than the lighting area Outer diameter of collet 0000000000000000000000000000000000000000000000000000000 Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 00000000000000 0 0 0 Picture 3（） Picture 4（×） No.3、Other points for attention A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0 0 Test items and results of reliability Type Test Item Test Standard Test Conditions Environmental Sequence Temperature Cycle Thermal Shock High Temperature Storage Humidity Heat Storage JEITA ED-4701 300 303 JEITA ED-4701 200 303 JEITA ED-4701 200 201 ↑↓5 min ↑↓5sec Ta=100℃ RH=90% Operation Sequence standard High Humidity Heat Life Test Tested with Brightek standard Tested with Ta=-40℃ Ta=25℃ IF=60mA 60℃ RH=90% IF=30mA Ta=-20℃ 00000000000000 IF=60mA standard 0 0 0 15、Judgment criteria of failure for the reliability Low Temperature Life Test Brightek 20 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 100℃ 15min 100 103 Brightek Life Test 0/50 -10℃ 15min Ta=60℃ Tested with 100 cycle 100℃ 30min JEITA ED-4701 200 202 Number of Damaged -40℃ 30min 0000000000000000000000000000000000000000000000000000000 JEITA ED-4701 Low Temperature Storage Note Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage Vf(V) IF=60mA Over U×1.2 Reverse current IR(uA) Vr=5V Over U×2 0 0