2Z2835AW55DFCKN2

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Features
§
forward current ≦150mA
§
Wide viewing angle:120°
§
Operating Temperature -40~80℃
§
Storage temperature-40~100℃
§
Junction Temperature110℃
§
ROHS and REACH-compliant
§
PACKAGE:4000 PCS/REEL.
§
Qualified according to JEDEC moisturevity Level 3
§
Chip material: InGaN
§
Reverse Voltage:5V
§
Duty 1/10,Pulse Width 0.1ms
Product Identification Code
0000000000000000000000000000000000000000000000000000000
00000000000000
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Electrical-Optical Characteristics(Ta=25℃)
Symbol
Parameter
Value
Min.
Typ.
Max.
2.8
3.2
3.4
Vf
Φ
Wavelength
Reverse Current
Viewing angle
53
Unit
Test
condition
V
If=150mA
lm
If=150mA
X
﹍
0.3828
﹍
﹍
Y
﹍
0.3803
﹍
﹍
Ir
﹍
﹍
10
μA
Vr=5V
2θ 1/2
﹍
120
﹍
Deg
If=150mA
80
﹍
%
If=150mA
3985
---
K
If=150mA
Color Rendering Index
CRI
Color Temperature
CCT
---
If=150mA
1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(X,Y) ±0.01, CRI±5.
2.IS standard testing
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Range of bins
Bin
VF(v)
Bin
LM(lm)
B
2.8-2.9
C
2.9-3.0
D
3.0-3.1
24
25
26
45-50
50-55
55-60
5A2
5B1
00000000000000
WL
5A1
0
0
0
E
3.1-3.2
F
3.2-3.3
G
3.3-3.4
5B2
0
0
0
Color Coordinate Comparison
0000000000000000000000000000000000000000000000000000000
BIN 碼
X
Y
X
Y
X
Y
X
Y
5A1
0.3871
0.3959
0.3736
0.3874
0.3703
0.3726
0.3828
0.3803
5A2
0.3828
0.3803
0.3703
0.3726
0.3670
0.3578
0.3784
0.3647
5B1
0.4006
0.4044
0.3871
0.3959
0.3828
0.3803
0.3952
0.3880
5B2
0.3952
00000000000000
0
0
0
0.3880
0.3828
0.3803
0.3784
0.3647
0.3898
0.3716
0
0
0
Optical Characteristics-1
Typical Spatial Distribution
1.0
0.75
0.5
0.25
0
350
400
450
500
550
600
650
700
750
Wavelength(nm)
Relative luminous Intensity(%)
Relative Radiant Intensity
Relative Spectral Power Distribution
125
Relative Luminous Flux .Ambient Temperature
Relative Luminous intensity(%)
Relative Lumious Flux(%)
Relative Luminous Flux .Current
150
0000000000000000000000000000000000000000000000000000000
100
75
50
25
0
50
25
0
75
100 125
150 175
Forward Current (mA)
Ambient Temperature(°)
Electrical Characteristics
200
Maximum Current (mA)
Forward Voltage
3.60
00000000000000
0
3.40
0
3.30
0
3.10
2.90
2.70
0
Thermal Design
25
50
75
100 125 150 175
Forward Current (mA)
150
100
50
0
0
20
40
60
80
Ambient Temperature(°)
0
0
100
0
Optical Characteristics-2
Forward Voltage Temperature
Relative Forward Voltage(%)
Relative Luminous efficienct(%)
Light effect VS Current
Ambient Temperature(°)
Forward Current (mA)
0000000000000000000000000000000000000000000000000000000
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0
0
0
0
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Outline Dimensions
1
2.8
2
0000000000000000000000000000000000000000000000000000000
1
2
RECOMMEND PADLAYOUT
1.2
2.15
2.2
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0
0.6
0
§
All dimensions are in millimeters.
§
Tolerance is ±0.1 ㎜ unless other specified
§
Specifications are subject to change without notice.
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Reflow Profile
1.IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
0000000000000000000000000000000000000000000000000000000
300
sec
2.IR reflow soldering Profile
Lead solder
300
℃
1-5℃/sec
temperature
250
10sec. max
210℃ max
Pre heating 150-180℃
200
240℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
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0
0
0
50
25℃
0
0
50
100
Time
150
200
250
300
sec
NOTES:
1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2.Don’t cause stress to the silicone resin while it is exposed to high temperature.
3.Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
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Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃
x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
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Packing-1
285 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Dimensions of Reel (Unit: mm)
60±0.50
13±0.2
173±0.10
Unit:mm
9±0.5
Labelposition
8.0±0.15
1.75±0.10
 Dimensions of Tape (Unit: mm)
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2.0±0.05
1.55±0.05
0.20
0.10
4.0±0.10
8.00±0.10
5.25±0.10
4.0±0.10
1.0
 Arrangement of Tape
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Empty parts
Loaded Parts
Empty Parts
(min.10)
(LED:4000Pcs)
(min.40)
Feeding Direction
Cover Tape
Emboss Tape
Conclusion Parts
Introduction Parts
(Min.40mm)
(Min.160mm)
NOTES
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1. Empty component pockets are sealed with top cover tape;
2 .The maximum number of missing smd is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA0
RS-481 specifications;
4. 4,000pcs/Reel
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Packing-2
285 Single-Color High Performance SMD Top LEDs Packaging Specifications

Packaging specifications
Reel(4,000pcs)
Moisture-poof bag
Loble
insection request form
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Inside box Maximums seven reels
Loble
Outside box
Maximums for inside
boses
NOTES:
Reeled products (The max numbers of each reel are 4,000pcs; for incompletely reel, quantity is
00000000000000
100pcs*N) packed in a seal off moisture-proof bag along with a desiccant one by one, Seven
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moisture-proof bag of maximums (total maximum number of products are 28,000pcs) packed in an
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inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums
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are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer
material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof
bag, part No. And quantity should appear on the insertion request form on the cardboard box.) .
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Precautions
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not
well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will
cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out:.
Outer diameter of collet should
be larger than the lighting area
Outer diameter of collet
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Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly affect
the quality of products during SMT is that if the collect go down too much, it will press lens and cause the
distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and
should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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Test items and results of reliability
Type
Test Item
Test Standard Test Conditions
Environmental
Sequence
Temperature Cycle
Thermal Shock
High Temperature Storage
Humidity Heat Storage
↑↓5 min
300 303
↑↓5sec
200 303
Ta=100℃
200 201
JEITA ED-4701
Ta=60℃
100 103
RH=90%
Ta=-40℃
200 202
Ta=25℃
IF=150mA
Operation
Sequence
standard
Heat Life Test
Brightek
60℃ RH=90%
standard
Tested with
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standard
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0 Judgment criteria of failure for the reliability
Low Temperature Life Test
0/50
20 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
100℃ 15min
JEITA ED-4701
Tested with
100 cycle
-10℃ 15min
JEITA ED-4701
Brightek
High Humidity
`
100℃ 30min
Tested with
Life Test
Number of
Damaged
-40℃ 30min
JEITA ED-4701
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JEITA ED-4701
Low Temperature Storage
Note
Brightek
IF=75mA
Ta=-30℃
IF=150mA
Measuring items
Symbol
Measuring conditions
Judgement criteria for failure
Forward voltage
Vf(V)
IF=150mA
Over U×1.2
Reverse current
IR(uA)
Vr=5V
Over U×2
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