0 Customer Part No: Part No: 3535DP HTCC Warm White: VZDP35AW57FHDDZ4 Specification: Documents No: Prepared By: Alex Hsieh / Time: 2013/03/20 Checked By: Kiwi Liao / Time: 2013/03/20 Customer Confirmation: FEATURES § Eutectic chip bonding process § Forward maximum pulse current 700mA (HTCC type) § Wide viewing angle: Typ.135° § Operating temperature -30~85℃ § Storage temperature-40~100℃ 0000000000000000000000000000000000000000000000000000000 § ROHS-compliant § Outline (L x W x H) of 3.5*3.5*2.0mm § Reverse voltage: 5V CATALOG Electrical-Optical Characteristics …………………….…..………………... High Power Product Identification Code 2-3 ……..……...…………………….. 3 Color coordinate Comparison ……………………….………………………… 4-5 Optical Characteristics ………………………………….………………………. 00000000000000 Outline Dimensions …………………...…………………………………………. 0 Reflow Profile ……………………………………………………………………… 0 Test items and results of reliability ……………………………………………. 0 Packing 6-8 9 10 11 ………………………………………………………….………..……. 12-13 …………………….……………... 14-15 Test circuit and handling precautions 0 0 0 PART NUMBER TABLE Substrate Color Emitter Warm White CRI>80 VZDP35AW57FHDDZ4 HTCC (1~3W) WARM –WHITE VZDP35AW57FHDDZ4 Value Typ. Parameter Symbol Forward Voltage Vf --- 3.25 Reverse Current Ir --- --- Min. 0000000000000000000000000000000000000000000000000000000 Viewing angle 2θ1/2 --135 Unit Test condition 3.4 V If=350mA 10 μA Vr=5V --- Deg If=350mA Max. X --- 0.4338 --- --- Y --- 0.4030 --- --- Color Temperature CCT --- 3000 --- K If=350mA Color Index CRI Luminous Flux Φv --- Lm If=350mA Chromaticity coordinate If=350mA 80 --- 90 1. Luminous intensity (Iv) ±5%, Forward Voltage (VF ) ±0.05V, Viewing angle(2θ1/2) ±5% 2. IS standard testing 3. Electrical-Optical Characteristics（Ta=25℃） 00000000000000 0 0 0 0 0 0 3535DP IDENTIFICATION CODE 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 COLOR COORDINATE (CIE-1931) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 PERFORMANCE GROUPS – CHROMATICITY 0000000000000000000000000000000000000000000000000000000 PERFORMANCE GROUPS – BRIGHTNESS Bin VF(v) Bin Flux(lm) E 3.0-3.2 31 80-90 F 3.2-3.4 32 90-100 33 100-110 00000000000000 0 0 0 0 0 0 OPTICAL CHARACTERISTICS 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 Thermal Design 0 0 0 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 OUTLINE DIMENSIONS § All dimensions are in millimeters. § Tolerance is ±0.13 ㎜ unless other specified 0000000000000000000000000000000000000000000000000000000 Circuit Type 00000000000000 0 0 0 ps.Suggest stencil t =0.12 mm 0 0 0 REFLOW PROFILE IR reflow soldering Profile Lead Free solder 0000000000000000000000000000000000000000000000000000000 NOTES: 1. We recommend the reflow temperature 180℃(±5℃).the maximum soldering temperature 00000000000000should be limited to 190℃. 2. Don’t stress the silicone resin while it is exposed to high temperature. 0 0 3. Number of reflow process shall be 1 time. 0 4. Recommend Solder: 1.TAMURA-TLF-401-11 2. PF602-P 0 0 0 TEST ITEMS AND RESULTS OF RELIABILITY Test Item Test Conditions Duration/ Cycle Number of Damage Reference Temperature Cycle –40℃ 30min ↑↓25℃(5 min) 100℃ 30min 100 cycles 0/22 JEITA ED-4701 300 303 ↑↓5sec 110℃ 30min 100 cycles 0/22 JEITA ED-4701 200 303 Ta=85℃ 1000 hrs 0/22 EIAJED-4701 200 201 1000 hrs 0/22 EIAJED-4701 100 103 1000 hrs 0/22 EIAJED-4701 200 202 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard 3 Times 0/22 MIL-STD-883D –40℃ 30min Thermal Shock High Temperature Storage Humidity Heat Storage Ta=85℃ RH=85% 0000000000000000000000000000000000000000000000000000000 Low Temperature Storage Life Test High Humidity Heat Life Test Ta=-40℃ Ta=25℃ If=500mA 60℃ RH=90% If=500mA Ta=-40℃ Low Temperature Life Test If=500mA ESD(HBM) 1KV at 1.5kΩ;100pf 00000000000000 0 *Criteria for Judging the Damage 0 Item Symbol 0 Condition Criteria for Judgement MIN MAX _ USL*1×1.1 Forward Voltage VF If=350mA Reverse Current IR VR=5V _ 100μA If=350mA *2 _ Luminous Intensity Iv LSL ×0.7 1 [Note]* USL: Upper Specification Level 2 * LSL: Lower Specification Level 0 0 0 PACKING Tape and Reel 0000000000000000000000000000000000000000000000000000000 Trailer 160(min) of empty Loaded Pockets Leader 400mm (min) of pockets sealed with tape (500 Lamps) empty pockets sealed with tape Leader 40mm (min) of empty pockets sealed with 00000000000000 0 0 0 tape (10 pockets min,) 0 0 0 0000000000000000000000000000000000000000000000000000000 NOTES: Reeled products (numbers of products are 500pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, five moisture-proof bag of maximums (total maximum number of products are 2,500pcs) packed in an inside box (size: about 240mm x about 195mm x about 100mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 255mm x about 240mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the insertion 00000000000000 0 request form on the cardboard box.) . 0 0 0 0 0 TEST CIRCUIT AND HANDLING PRECAUTIONS Test circuit V LED Handling precautions 1、The following items are recommended when handling LEDs 1.1 The lens of LEDs should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease in light output. 0000000000000000000000000000000000000000000000000000000 1.2 Avoid mechanical stress on LED lens 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’ damage 1.4 Pick & place tool was recommended to use for the remove of LEDs from the factory tape & reel packaging 2、Pick & Place Nozzle The pickup tool was recommended and shown as below 00000000000000 0 0 0 Unit : mm Tolerance : ±0.1 0 0 0 3、Lens handling Please follow the guideline to grab LEDs 3.1 Use tweezers to grab LEDs 3.2 Do not touch lens with the tweezers 3.3 Do not touch lens with fingers 3.4 Do not apply more than 4N of lens (400g) directly onto the lens Wrong (X) Correct ( ) 0000000000000000000000000000000000000000000000000000000 4、Lens cleaning In the case where a minimal level of dirt and dust particles can’t be guaranteed, a suitable cleaning solution can be applied to the lens surface 4.1 Try a gentle swabbing using a lint-free swab 4.2 If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the lens surface. 4.3 Do not use other solvents as they may directly react with the LED assembly 00000000000000 4.4 Do not use ultrasonic cleaning that the LED will be damaged 0 0 5、Carrier Tape Handling 0 The following items are recommended when handling the Carrier tape of LEDs 5.1 Do not twist the carrier tape 5.2 The inward bending diameter should not smaller than 6cm for carrier tape. 5.3 Do not bend the tape outward. <6cm 0 0