3535HP Series 0 3535HP LEDs IR ◆Outline：3.5*3.5*2.0mm 3.5*3.5*2.9mm ◆High efficiency ◆Good thermal dissipation & optical uniformity 0000000000000000000000000000000000000000000000000000000 Table of Contents: Features Features----------------------------------------------------1 RoHS and REACH-compliant Product Code---------------------------------------------2 MSL2 qualified according to J-STD 020 Product List------------------------------------------------3 ESD 2KV (HBM : MIL-STD-883 Class 2) Maximum Rating-----------------------------------------4 Intensity binning------------------------------------------5 Forward Voltage Binning-------------------------------5 Applications Relative Spectral Power Distribution----------------6 Automotive Electronic-Optical Characteristics--------------------7 Data Communication 00000000000000 Typical spatial distribution------------------------------8 0 0 Thermal Design for De-rating--------------------------8 0 Dimensions-------------------------------------------------9 Surveillance Suggest Stencil Pattern--------------------------------10 Packing-----------------------------------------------------11 Reflow Profile---------------------------------------------13 Precautions------------------------------------------------14 Test items and results of reliability------------------17 0 0 http://www.ystone.com.tw 1/17 3535HP Series 0 Product Code V – Z – HP35 – A – F37C – H – 0 – 2 – Z – 4 V – Z – HP35 – B – F37C – H – 0 – 2 – Z – 4 V – Z – HP35 – A – F37B – H – 0 – 1 – Z – 4 V – Z – HP35 – B – F37B – H – 0 – 1 – Z – 4 V – Z – HP35 – A – F36A – H – 0 – 1 – Z – 4 V – Z – HP35 – B – F36A – H – 0 – 1 – Z – 4 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ 0000000000000000000000000000000000000000000000000000000 ① ② ③ Process type V: Eutectic Category Z: SMD LED process Specification HP35: Ceramic 3535 ④ Lens code ⑤ Dice wavelength & Luminous rank A: 120° Fxxx: B: 60° Infrared product (Emission pipe) 00000000000000 ⑥ 0 0 Support code 0 H: HTCC ⑦ ⑧ Zener & High CRI Cap color code 0: None Zener 1: Series No. ⑨ Module & Lens code Z: Molding ⑩ Current code 4: 350mA 2: Series No. 0 0 http://www.ystone.com.tw 2/17 3535HP Series 0 Product list Radiant Power (mW) Color 350mA 1400mA Min. Min. P23 250 756 P24 275 832 P31 300 907 P32 325 981 Group IR Radiant Power (mW) Color Group 350mA 1000mA Peak Wavelength (nm) 840-870 Peak Wavelength (nm) Forward Voltage (V) @350mA Min. 1.4 IR 225 585 P23 250 650 P24 275 715 P31 300 780 Radiant Power (mW) Color 350mA 600mA Min. Min. 200 340 225 382 P23 250 425 P24 275 467 Group 00000000000000 0 P21 0 P22 0 IR 840-870 Peak Wavelength (nm) 840-870 Angle Part Number 120° VZHP35AF37CH02Z4 60° VZHP35BF37CH02Z4 2.0 Forward Voltage (V) @350mA Min. 0000000000000000000000000000000000000000000000000000000 Min. Min. P22 Max. Viewing 1.4 Max. Viewing Angle Part Number 120° VZHP35AF37BH01Z4 60° VZHP35BF37BH01Z4 2.0 Forward Voltage (V) @350mA Min. 1.4 Max. Viewing Angle Part Number 120° VZHP35AF36AH01Z4 60° VZHP35BF36AH01Z4 2.0 Notes: 1. Forward voltage (VF ) ±0.05V, Radiant power (PO) ±7%. 2. IS standard testing. 3. Viewing angle(2θ1/2) ±10° 0 0 http://www.ystone.com.tw 3/17 3535HP Series 0 Maximum Rating (Ta : 25℃) VZHP35AF37CH02Z4 / VZHP35BF37CH02Z4 Characteristics Symbol DC Forward Current1 IF Pulse Forward Current2 Min. Typical Max. Unit 350 1400 mA IPF 1800 mA Reverse Voltage VR -5 V Reverse Current (-5V) IR 10 μA Junction Temperature3 Tj 150 ℃ Storage Temperature Range Tstg 100 ℃ Soldering Temperature Tsol 260 ℃ Typical Max. Unit 350 1000 mA -40 – VZHP35AF37BH01Z4 / VZHP35BF37BH01Z4 Characteristics Symbol Min. DC Forward Current1 IF 0000000000000000000000000000000000000000000000000000000 Pulse Forward Current2 IPF 1200 mA Reverse Voltage VR 5 V Reverse Current (-5V) IR 10 μA Junction Temperature3 Tj 150 ℃ Storage Temperature Range Tstg 100 ℃ Soldering Temperature Tsol 260 ℃ Typical Max. Unit 350 600 mA IPF 800 mA Reverse Voltage VR 5 V Reverse Current (-5V) IR 10 μA Junction Temperature3 Tj 150 ℃ Storage Temperature Range Tstg 100 ℃ Soldering Temperature Tsol 260 ℃ -40 – VZHP35AF36AH01Z4 / VZHP35BF36AH01Z4 00000000000000 Characteristics 0 DC Forward Current1 0 Pulse Forward Current2 0 Symbol Min. IF -40 – Notes: 0 1. For other ambient, limited setting of current will depend on de-rating curves. 2. D=0.01s duty 1/10. 3. When drive on maximum current , Tj must be kept below 150℃ http://www.ystone.com.tw 0 4/17 3535HP Series 0 Intensity Binning Bin code Min. Po Max. Po (350mA) (mW) (mW) P21 200 225 P22 225 250 P23 250 275 P24 275 300 P31 300 325 P32 325 350 0000000000000000000000000000000000000000000000000000000 Forward Voltage Binning Bin code Min. VF Max. VF (350mA) (V) (V) V1416 1.4 1.6 V1618 1.6 1.8 V1820 1.8 2.0 00000000000000 0 0 0 0 0 http://www.ystone.com.tw 5/17 3535HP Series 0 Relative spectral power distribution 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 http://www.ystone.com.tw 6/17 3535HP Series 0 Electronic-Optical Characteristics VZHP35AF37CH02Z4 / VZHP35BF37CH02Z4 Forward Current vs. Forward Voltage (Ta=25℃) Relative Radiant Power vs. Forward Current (Ta=25℃) VZHP35AF37BH01Z4 / VZHP35BF37BH01Z4 0000000000000000000000000000000000000000000000000000000 Forward Current vs. Forward Voltage (Ta=25℃) 00000000000000 0 0 0 Relative Radiant Power vs. Forward Current (Ta=25℃) VZHP35AF36AH01Z4 / VZHP35BF36AH01Z4 Forward Current vs. Forward Voltage (Ta=25℃) Relative Radiant Power vs. Forward Current (Ta=25℃) 0 0 http://www.ystone.com.tw 7/17 3535HP Series 0 Typical Spatial Distribution 60° 120° Thermal Design for De-rating The maximum forward current is determined by the thermal resistance between the LED junction 0000000000000000000000000000000000000000000000000000000 and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. VZHP35AF37CH02Z4 / VZHP35BF37CH02Z4 VZHP35AF37CH01Z4 / VZHP35BF37CH01Z4 00000000000000 0 0 0 VZHP35AF36AH01Z4 / VZHP35BF36AH01Z4 0 0 http://www.ystone.com.tw 8/17 3535HP Series 0 Dimensions 120° 0000000000000000000000000000000000000000000000000000000 60° 00000000000000 0 0 0 § All dimensions are in millimeters. § Tolerance is ±0.13mm unless other specified. 0 0 http://www.ystone.com.tw 9/17 3535HP Series 0 Suggest Stencil Pattern (Recommendations for reference) § Suggest stencil t =0.12 mm 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 http://www.ystone.com.tw 10/17 3535HP Series 0 Packing - + 0000000000000000000000000000000000000000000000000000000 Trailer 160(min) of empty pockets sealed 00000000000000 with tape 0 Loaded Pockets (1000 pcs) Leader 400mm (min) of empty pockets sealed with tape 0 0 0 0 http://www.ystone.com.tw 11/17 3535HP Series 0 Label Label Label 0000000000000000000000000000000000000000000000000000000 00000000000000 0 Notes: 0 1. Each reel (minimum number of pieces is 100 and maximum is 1000 for 120 degree 0 product / 500 for 60 degree product) is packed in a moisture-proof bag along with 2 packs of desiccant and a humidity indicator card; 2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 240mm x 200mm x 105mm ±5mm) 3. A maximum of 4 inner boxes are put in an outer box (size: 410mm x 255mm x 230mm ±5mm) 4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and the cardboard box. 0 0 http://www.ystone.com.tw 12/17 3535HP Series 0 Reflow Profile IR reflow soldering Profile Lead Free solder 0000000000000000000000000000000000000000000000000000000 Lead solder 300 ℃ 1-5℃/sec temperature 250 Pre heating 150-180℃ 200 240℃ max 10sec. max 210℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 00000000000000 0 0 0 Notes: 0 25℃ 0 50 100 Time 150 200 250 300 sec 1. The recommended reflow temperature is 240℃(±5℃). The maximum soldering temperature should be limited to 260℃. 2. Do not stress the silicone resin while it is exposed to high temperature. 3. The reflow process should not exceed 3 times. 0 0 http://www.ystone.com.tw 13/17 3535HP Series 0 Precautions 1. Recommendation for using LEDs 1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may cause a drastic decrease in the luminosity. 1.2 Avoid mechanical stress on LED lens. 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’ damage. 1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel packaging 2. Pick & place nozzle The pickup tool was recommended and shown as below 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 3. Lens handling Please follow the guideline to pick LEDs. 3.1 Use tweezers to pick LEDs. 3.2 Do not touch the lens by using tweezers. 3.3 Do not touch lens with fingers. 3.4 Do not apply more than 4N (400gw) directly onto the lens. 0 0 http://www.ystone.com.tw 14/17 3535HP Series 0 Correct ( ) Wrong ( X ) 4. Lens cleaning In the case which a small amount of dirt and dust particles remain on the lens surface, a 0000000000000000000000000000000000000000000000000000000 suitable cleaning solution can be applied. 4.1 Try a gentle wiping with dust-free cloth. 4.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface. 4.3 Do not use other solvents as they may directly react with the LED assembly. 4.4 Do not use ultrasonic cleaning which will damage the LEDs. 5. Carrier tape handling 00000000000000 The following items are recommended when handling the carrier tape of LEDs. 0 5.1 Do not twist the carrier tape. 0 5.2 The inward bending diameter should not be smaller than 6cm for each carrier tape. 0 5.3 Do not bend the tape outward. 0 0 http://www.ystone.com.tw 15/17 3535HP Series 0 6. Storage 6.1 The moisture-proof bag is sealed： The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. 6.2 The moisture-proof bag is opened： The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within 168hrs. If the humidity indicator card shows the pink color in 10% even higher or exceed the storage limiting time since opened, that we recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return to the moisture-proof bag, it’s recommended to be with workable desiccants. 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 http://www.ystone.com.tw 16/17 3535HP Series 0 Test Items and Results of Reliability Test Item Test Conditions Duration/ Number of Cycle Damage 100 cycles 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 Reference –40℃ 30min Thermal Shock ↑↓5min AEC-Q101 125℃ 30min High Temperature Ta=100℃ Storage Humidity Heat Ta=85℃ Storage RH=85% Low Temperature Ta=-40℃ Storage 0000000000000000000000000000000000000000000000000000000 Ta=25℃ Life Test If=350mA High Humidity Heat 85℃ RH=85% Operation If=350mA High Temperature Ta=85℃ Operation If=350mA ESD(HBM) 2KV at 1.5kΩ;100pf 00000000000000 0 Item 0 0 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 3 Times 0/22 EIAJ ED-4701 200 201 EIAJ ED-4701 100 103 EIAJ ED-4701 200 202 MIL-STD-883 Criteria for Judging the Damage Symbol Condition Forward Voltage VF Reverse Current Radiant Power Criteria for Judgment Min Max If=350mA _ USL1×1.1 IR VR =5V _ 100μA PO If=350mA LSL2×0.7 _ Notes: 1. USL: Upper specification level 2. LSL: Lower specification level 0 0 http://www.ystone.com.tw 17/17