Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
The Multilayer High-Speed MHS Series is a very-low capacitance
extension to the Littelfuse ML family of Transient Voltage Surge
Suppression devices available in an 0402 and 0603-size surface
mount chip.
The MHS series provides protection from ESD and EFT in high-speed
data-line and other high frequency applications. The low capacitance of
the MHS Series permits usage in analog or digital circuits where it will
not attenuate or distort the desired signal or data.
Their small size is ideal for high-density printed circuit boards, being
typically applied to protect intergrated circuits and other sensitive
components. They are particularly well suited to suppress ESD events
including those specified in IEC 61000-4-2 or other standards used for
ElectroMagnetic Compliance (EMC) testing.
The MHS series is manufactured from semiconducting ceramics and is
supplied in a leadless, surface mount package. The MHS Series is also
compatible with modern reflow and wave soldering processes.
Littelfuse Inc. manufactures other Multilayer Varistor Series products,
see the ML, MLE, MLN and AUML series data sheets.
Features
• 3pF & 12pF Capacitance Versions Suitable for High Speed
Data-Rate Lines
• ESD Rated to IEC 61000-4-2 (Level 4)
• EFT/B Rated to IEC 61000-4-4 (Level 4)
• Low Leakage Currents
• -55oC to +125oC Operating Temperature Range
• Inherently Bi-directional
Applications
• Data, Diagnostic I/O Ports
• Universal Serial Bus (USB)
• Video & Audio Ports
• Portable/Hand-Held Products
• Mobile Communications
• Computer/DSP Products
• Industrial Instruments Including Medical
Absolute Maximum Ratings
For ratings of individual members of a series, see device ratings and specifications table.
MHS SERIES
UNITS
Continuous:
Steady State Applied Voltage: DC Voltage Range (VM(DC)):V0402/0603MHS03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 42
V0402/0603MHS12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 18
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
V
V
O
C
O
C
1
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Device Ratings and Specifications
MAX RATINGS
(125°C)
PERFORMANCE SPECIFICATIONS (25°C)
MAXIMUM NONREPETITIVE
SURGE ENERGY
(10/1000µS)
MAXIMUM
ESD CLAMP
VOLTAGE
(NOTE 1)
MAXIMUM
CLAMPING
VOLTAGE
AT 1A (8X20µs)
MAXIMUM LEAKAGE CURRENT AT
SPECIFIED DC VOLTAGE
TYPICAL
CAPACITANCE
AT 1MHz
(1V p-p)
TYPICAL
INDUCTANCE
(from Impedance
Analysis)
(NOTE 4)
C
L
(Note 2)
8kV
CONTACT
(Note 3)
15kV
AIR
3.5V
5.5V
9V
15V
Clamp
Clamp
P
IL
IL
IL
(V)
(V)
(µA)
(µA)
(µA)
(µA)
(pF)
(nH)
300
300
400
400
0.1
0.1
0.15
0.15
0.25
0.25
0.50
0.50
3
3
<1.0
<1.0
160
160
0.1
0.1
0.15
0.15
1.00
1.00
5.00
5.00
12
12
<1.0
<1.0
PART
NUMBER
WTM
(J)
(Vc)
V0402MHS03
V0603MHS03
0.010
0.010
110
110
V0402MHS12
V0603MHS12
0.025
0.025
55
55
125
125
NOTES:
1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preferred test method).
3. Corona discharge through air (represents actual ESD event).
4. Capacitance may be customized, contact your Littelfuse Sales Representative.
Temperature De-rating
For applications exceeding 125oC ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
NOMINAL VOLTAGE AT 1mADC
100
PERCENT OF RATED VALUE
60
80
60
40
V0402MHS03
V0603MHS03
50
40
30
V0402MHS12
V0603MHS12
20
20
10
0
-55
1
50
60
70
80
90
100
110 120
10
1000
100
10000
CURRENT (A)
130 140 150
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
30
0
INSERTION LOSS (dB)
25
VARISTOR VOLTAGE (V)
20
15
25o
10
85o
125o
V0402MHS03
V0603MHS03
-20
5
0
0.0001
0.001
0.01
0.1
CURRENT (mA)
FIGURE 2: STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
2
V0402MHS12
V0603MHS12
-10
1
-30
10
100
1000
10000
FREQUENCY (MHz)
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Soldering Recommendations
The principal techniques used for the soldering of components in
surface mount technology are infared (IR) re-flow, vapour phase re-flow
and wave soldering. Typical profiles are shown in Figures 5, 6 and 7.
When wave soldering, the MHS suppressor is attached to the circuit
board by means of an adhesive. The assembly is then placed on a
conveyor and run through the soldering process to contact the wave.
With IR and vapour phase re-flow, the device is placed in a solder paste
on a substrate. As the solder paste is heated, it re-flows and solders the
unit to the board.
The recommended solder for the MHS suppressor is a 63/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402-size devices,
IR reflow is recommended.
6.
When using a re-flow process, care should be taken to ensure that the
MHS chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating within 100 degrees of the solder’s peak
temperature is essentail to minimize thermal shock. Examples of the soldering conditions for the MHS suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
7.
Recommended Pad Outline
5.
TABLE 1: PAD LAYOUT DIMENSIONS
DIMENSION
C
B
A
mm
in
mm
in
mm
0402
1.70
0.067
0.510
0.020
0.610
0.024
0603
2.54
0.100
0.760
0.030
0.890
0.035
in
3
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Ordering Information
Multilayer High Speed - MHS Series
V
0402
MHS
03
W
Mechanical Dimensions
H
E
DEVICE FAMILY
Littelfuse TVSS Device
PACKING OPTIONS
H: 7in (178mm) Diameter Reel (Note)
END TERMINATION OPTION
DEVICE SIZE
i.e. 40Mil x 20Mil
(1.0mm x 0.5mm)
D
L
No Letter: Ag/Pt (Standard)
W: Ag/Pd
N: Nickel Barrier termination subject to availibility.
Please contact a Littelfuse sales representative
SERIES DESIGNATOR
W
Multilayer Hi-Speed
CAPACITANCE DESIGNATION
03 = 3PF
12 = 12PF
DEVICE DIMENSIONS
0402 SIZE
Standard Shipping Quantities
0603 SIZE
DIMENSION
INCH
MM
INCH
D Max.
0.024
0.60
0.035
0.9
E
0.10±0.006
0.25±0.15
0.015±0.008
0.4±0.2
MM
SIZE
7 INCH REEL ("H" OPTION)
13 IN REEL
"T" OPTION
0402
10,000
––
L
0.039±0.004
1.00±0.10
0.063±0.006
1.6±1.5
10,000
W
0.020±0.004
0.50±0.10
0.032±0.006
0.8±1.5
2,500
0603
Tape and Reel Specifications
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
SYMBOL
DESCRIPTION
DIMENSIONS IN MILLIMETERS
A0
Width of Cavity
B0
Length of Cavity
Dependant on chip size to minimize rotation
Dependant on chip size to minimize rotation
K0
Depth of Cavity
Dependant on chip size to minimize rotation
W
Width of Tape
8 ±0.2
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 ±0.05
E1
Distance Between Drive Hole Centers and Tape Edge
1.75±0.1
P1
Distance Between Cavity Center
2±0.05
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Hole Centers
2 ±0.1
P0
Axial Drive Distance Between Drive Hole Centers
4 ±0.1
1.55 ±0.05
D0
Drive Hole Diameter
D1
Nominal Paper Thickness
T1
Top & Bottom Tape Thickness
D0
0.61
0.10 Max
PRODUCT
IDENTIFYING
LABEL
P0
P2
EMBOSSED PAPER CARRIER
T
E
F
W
B0
t1
4
P1
A0
TOP TAPE
8mm
NOMINAL
178mm
DIA. REEL