CL8800 DATA SHEET (01/12/2015) DOWNLOAD

CL8800
Sequential Linear LED Driver
Features
Description
• Minimal component count (base config: CL8800 +
6 resistors + diode bridge)
• No magnetics, no capacitors
• Up to 7.5W output (13W w/ heat sink)
• >110Lm/W using efficient LEDs
• 85% typical electrical efficiency
• >0.95 power factor
• <20% THD line current
• Low conducted EMI w/o filters
• 85% LED luminous utilization
• Phase dimmer compatible with an RC network
CL8800 is designed to drive a long string of inexpensive, low-current LEDs directly from the AC mains. A
basic driver circuit consists of CL8800, six resistors,
and a bridge rectifier. Two to four additional components are optional for various levels of transient protection. No capacitors, EMI filters, or power factor
correction circuits are needed.
Applications
• Fluorescent tube retrofit
• Incandescent & CFL bulb replacement
• General LED lighting
A string of series/parallel LEDs is tapped at six locations. Six linear current regulators sink current at each
tap and are sequentially turned on and off. Thereby
tracking the input sine wave voltage. Voltage across
each regulator is minimized when conducting, providing high efficiency. Output current at each tap is individually resistor-adjustable. Cross-regulation, as the
CL8800 switches from one regulator to another, provides smooth transitions. The current waveform can be
tailored to optimize for input voltage range, line/load
regulation, output power/current, efficiency, power factor, THD, dimmer compatibility, and LED utilization.
With the addition of an RC network, the driver is compatible with phase dimming.
 2015 Microchip Technology Inc.
DS20005357A-page 1
CL8800
TAP6
TAP5
TAP4
TAP3
TAP2
BIAS
TAP1
Package Type
33
GND
1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
SET6
SET5
NC
SET4
NC
GND
SET3
GND
NC
GND
SET2
GND
NC
GND
SET1
GND
See Table 2-1 for pin information
Typical Application Circuit
Transient Protection
AC
Mains
TAP1
TAP2
TAP3
SET1
SET2
SET3
BIAS
100 - 120VAC additional
components
for 230VAC
DS20005357A-page 2
TAP4
TAP5
TAP6
SET5
SET6
CL8800
GND
SET4
 2015 Microchip Technology Inc.
CL8800
1.0
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
VBIAS, VTAP1 .................................................... -0.5V to +550V
VTAP2-6 ............................................................. -50V to +320V
VSET1-6 .............................................................................4.0V
Operating temperature ..................................-55°C to +125°C
Storage temperature, TS ...............................-65°C to +150°C
Note: Absolute Maximum Ratings are those values beyond
which damage to the device may occur. Functional operation
under these conditions is not implied. Continuous operation of
the device at the absolute rating level may affect device reliability. All voltages are referenced to device ground.
1.1
ELECTRICAL SPECIFICATIONS
TABLE 1-1:
Symbol
RECOMMENDED OPERATING CONDITIONS
Parameter
Min
Typ
Max
TAP1
Output Current
IOUT
VOUT
Output Voltage
1
Symbol
TAP2
90
mA
TAP3
115
mA
TAP4
115
mA
TAP5
115
mA
TAP6
115
mA
TAP1
400
V
Non-conducting
TAP2-6
300
V
Non-conducting
TAP1-6
varies1
V
Conducting
440
V
ELECTRICAL CHARACTERISTICS1
Parameter
Min
BIAS pin input current
IBIAS
ITAP(ON)
ITAP(OFF)
1
mA
Voltage capability is determined by power dissipation (V * I).
TABLE 1-2:
VREG
60
Applied BIAS voltage
VBIAS
Units Conditions
Output current, on
Max
250
410
Units Conditions
µA
VBIAS = 340V
VTAP1 = 30V, VSET1-6 = GND
TAP1
60
mA
TAP2
90
mA
VTAP2 = 17V, VSET1-6 = GND
TAP3
115
mA
VTAP3= 17V, VSET1-6 = GND
TAP4
115
mA
VTAP4 = 17V, VSET1-6 = GND
TAP5
115
mA
VTAP5 = 17V, VSET1-6 = GND
TAP6
115
mA
VTAP6 = 17V, VSET1-6 = GND
0
10
µA
Tap 1-5, VBIAS = 312V
SET1-5
1.80
2.00
2.20
V
SET6
1.89
2.10
2.31
V
Output current, off
Regulation voltage at
SET pins
Typ
Over recommended operating conditions at 25°C, unless specified otherwise.
 2015 Microchip Technology Inc.
DS20005357A-page 3
CL8800
TABLE 1-3:
1
2
THERMAL RESISTANCE
Package
θja1
θjc2
33-Lead QFN
24°C/W
2.5°C/W
1.0 oz Cu 4-layer board, 3x4” PCB with thermal pad and thermal via array.
Junction to exposed heat slug.
FIGURE 1-1:
OUTPUT CURRENT THERMAL CHARACTERISTICS
Maximum Output Current
250
200
Taps 4&5
IOUT (mA)
150
Taps 3&6
100
Tap 2
50
Tap 1
0
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (°C)
DS20005357A-page 4
 2015 Microchip Technology Inc.
CL8800
2.0
PIN DESCRIPTION
The locations of the pins are listed in Package Type.
TABLE 2-1:
PIN DESCRIPTION
Pin #
Function
1-8
GND
Circuit common (use for heat sink ground plane pass through).
9
SET1
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
10
NC
11
SET2
12
NC
13
SET3
14
NC
15
SET4
16
NC
17
SET5
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
18
SET6
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
19 - 20
GND
Circuit common (use for heat sink ground plane pass through).
GND
Circuit common. Connect to bridge rectifier return (use for heat sink ground plane
pass through).
22 - 26
GND
Circuit common (use for heat sink ground plane pass through).
27
TAP6
28
TAP5
29
TAP4
30
TAP3
31
TAP2
32
TAP1
33
BIAS
21
Underside plate
(GND)
 2015 Microchip Technology Inc.
Description
No internal connection.
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
No internal connection.
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
No internal connection.
Current sense for linear current regulators for each tap. Resistors on these pins
sets the tap currents.
No internal connection.
Current regulator outputs. Connect to taps along the LED string.
Provides bias for driver. Connect to rectified AC.
For heat sinking purposes, it should be soldered to a 4.0cm2 exposed copper
area. It should also be electrically connected to circuit common (GND).
DS20005357A-page 5
CL8800
3.0
APPLICATION INFORMATION
3.3
3.1
Overview
Zener diodes may be substituted for LEDs in the bottom stages of the design. The last 1 or 2 stages of
LEDs contribute little to the light output - they are
mainly present to off-load the adjacent upstream regulator at high line voltages to minimize losses. The
advantages of Zener substitution includes minimizing
unlit LEDs at low line for better light uniformity, better
line regulation at high line, fewer LEDs for lower cost
and less PCB area, and fewer board-to-board connections. Disadvantages include slightly-reduced efficiency at high line, and additional heat load on the
driver board.
Designing a driver to meet particular requirements may
be a difficult task considering the 18 design variables:
tap current (6), number of series-connected LEDs per
segment (6), and the number of parallel-connected
LEDs per segment (6). Manually selecting values will
provide light, but the chosen values may be far from
optimal in regards to efficiency, LED utilization, and line
regulation.
Contact your nearest Microchip Field Applications
Engineer for design assistance.
In addition to configuring the driver, several circuits
may be employed to increase reliability, performance,
and cost. The following sections briefly describe these
circuits.
3.2
Transient Protection
The driver circuits have no need for capacitors that
could otherwise absorb transient energy, nor is there a
need for EMI filters that would block transients. Therefore, the full burden of transient protection is borne by
the protection circuit. The two-stage approach in the
following schematics provide 2.5kV protection, both
pulse and ring per EN 61000-4-5 and EN 61000-4-12,
six hits each.
FIGURE 3-1:
100 TO 120 VAC
TRANSIENT PROTECTION
3.4
Zener Diode Substitution
Phase Dimming
As with any light load, the LED lamp might not draw
enough current to ensure proper dimmer operation.
This is especially true for 230VAC dimmers. Triodes for
Alternating Current (TRIAC) used in dimmers require a
minimum latching current when triggered to place the
TRIAC in the latched-on state. Once latched, a minimum holding current is required to maintain the TRIAC
in the on state. Latching current is many times greater
than the holding current, and is the main concern with
dimmer compatibility.
Higher latching current can be provided by a simple
series RC network across the AC line. A short time constant provides a current spike at the turn-on edge.
Less common is inadequate holding current. The minimum dimmer holding current is typically 10-20mA.
Tap1 at 60mA (max) exceeds the minimum.
FIGURE 3-3:
22Ω
AC Line
150VAC
10mm
FIGURE 3-2:
AC Line
33Ω
AC Line
275VAC
10mm
DS20005357A-page 6
500Ω
Bridge
Rectifier
100 - 200nF
230VAC TRANSIENT
PROTECTION
22Ω
Transient
Protection
PHASE DIMMING
440VDC
1.5kW
3.5
Strobing
Twice per AC line cycle the line voltage crosses zero
volts, during which time there is no light output.
The circuit in Figure 3-4 can provide 5-10% valley fill. It
has little effect on input current wave shape (THD, PF)
and efficiency.
This circuit is intended to prevent the output from
reaching zero. It will not significantly reduce output ripple.
 2015 Microchip Technology Inc.
CL8800
3.6
Power Boost
FIGURE 3-4:
POWER BOOST
to LEDs
Higher output power can be achieved by off-loading a
portion of the power dissipation from the CL8800 to
external Field-Effect Transistors (FET). The circuit
below drops most of the tap voltage across the FETs,
thereby shifting the bulk of the dissipation to the FET.
to LEDs
200kΩ
15V
TAP6
FIGURE 3-5:
TAP7
VALLEY FILL CIRCUIT
Optional flicker
reduction circuit
(valley fill)
CF1
RF1
10kΩ
RF3
QF1
TAP1
QF2
DN3135
RF2
150kΩ
TAP2
TAP3
TAP4
TAP5
TAP6
CL8800
BIAS
SET1
SET2
RS1
 2015 Microchip Technology Inc.
SET3
RS2
GND
SET4
RS3
SET5
RS4
RS5
SET6
RS6
DS20005357A-page 7
CL8800
FIGURE 3-6:
SIMPLIFIED BLOCK DIAGRAM
Transient Protection
22Ω
33Ω
275VAC
10mm
440VDC
1.5kW
AC
Mains
TAP1
TAP2
TAP3
1 0
BIAS 1 0
in reg
in reg
TAP4
1 0
TAP5
in reg
TAP6
1 0
1 0
1 0
in reg
in reg
GND
100 - 120VAC additional
components
for 230VAC
CL8800
SET1
SET2
RSET1
SET3
RSET2
SET4
RSET3
SET5
RSET4
SET6
RSET5
RSET6
DS20005357A-page 8
 2015 Microchip Technology Inc.
CL8800
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
33-lead QFN
XXXXXXX
XXXXXXXX
XXXXXX e3
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
CL8800
K63 e3
1449343
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
may not include the corporate logo.
 2015 Microchip Technology Inc.
DS20005357A-page 9
CL8800
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
DS20005357A-page 10
 2015 Microchip Technology Inc.
CL8800
APPENDIX A:
REVISION HISTORY
Revision A (January 2015)
• Update file to new format
 2015 Microchip Technology Inc.
DS20005357A-page 11
CL8800
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
-
XX
X
-
Package Environmental
Options
X
Media
Type
Device:
CL8800 = Sequential Linear LED Driver
Package:
K6(3)
= QFN (6x6 mm body), 33-lead
Environmental
G
= Lead (Pb)-free/ROHS-compliant package
Media Type:
DS20005357A-page 12
(blank)
= 490/Tray
M935
= 3000/Reel
Examples:
a)
CL8800K63-G:
33-lead QFN package,
490/Tray.
b)
CL8800K63-G-M935
33-lead QFN package,
3000/Reel
 2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
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PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
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MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
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Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
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© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-63276-957-2
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
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DS20005357A-page 13
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DS20005357A-page 14
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