CL8800 Sequential Linear LED Driver Features Description • Minimal component count (base config: CL8800 + 6 resistors + diode bridge) • No magnetics, no capacitors • Up to 7.5W output (13W w/ heat sink) • >110Lm/W using efficient LEDs • 85% typical electrical efficiency • >0.95 power factor • <20% THD line current • Low conducted EMI w/o filters • 85% LED luminous utilization • Phase dimmer compatible with an RC network CL8800 is designed to drive a long string of inexpensive, low-current LEDs directly from the AC mains. A basic driver circuit consists of CL8800, six resistors, and a bridge rectifier. Two to four additional components are optional for various levels of transient protection. No capacitors, EMI filters, or power factor correction circuits are needed. Applications • Fluorescent tube retrofit • Incandescent & CFL bulb replacement • General LED lighting A string of series/parallel LEDs is tapped at six locations. Six linear current regulators sink current at each tap and are sequentially turned on and off. Thereby tracking the input sine wave voltage. Voltage across each regulator is minimized when conducting, providing high efficiency. Output current at each tap is individually resistor-adjustable. Cross-regulation, as the CL8800 switches from one regulator to another, provides smooth transitions. The current waveform can be tailored to optimize for input voltage range, line/load regulation, output power/current, efficiency, power factor, THD, dimmer compatibility, and LED utilization. With the addition of an RC network, the driver is compatible with phase dimming. 2015 Microchip Technology Inc. DS20005357A-page 1 CL8800 TAP6 TAP5 TAP4 TAP3 TAP2 BIAS TAP1 Package Type 33 GND 1 GND GND GND GND GND GND GND GND GND GND SET6 SET5 NC SET4 NC GND SET3 GND NC GND SET2 GND NC GND SET1 GND See Table 2-1 for pin information Typical Application Circuit Transient Protection AC Mains TAP1 TAP2 TAP3 SET1 SET2 SET3 BIAS 100 - 120VAC additional components for 230VAC DS20005357A-page 2 TAP4 TAP5 TAP6 SET5 SET6 CL8800 GND SET4 2015 Microchip Technology Inc. CL8800 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS VBIAS, VTAP1 .................................................... -0.5V to +550V VTAP2-6 ............................................................. -50V to +320V VSET1-6 .............................................................................4.0V Operating temperature ..................................-55°C to +125°C Storage temperature, TS ...............................-65°C to +150°C Note: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Continuous operation of the device at the absolute rating level may affect device reliability. All voltages are referenced to device ground. 1.1 ELECTRICAL SPECIFICATIONS TABLE 1-1: Symbol RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max TAP1 Output Current IOUT VOUT Output Voltage 1 Symbol TAP2 90 mA TAP3 115 mA TAP4 115 mA TAP5 115 mA TAP6 115 mA TAP1 400 V Non-conducting TAP2-6 300 V Non-conducting TAP1-6 varies1 V Conducting 440 V ELECTRICAL CHARACTERISTICS1 Parameter Min BIAS pin input current IBIAS ITAP(ON) ITAP(OFF) 1 mA Voltage capability is determined by power dissipation (V * I). TABLE 1-2: VREG 60 Applied BIAS voltage VBIAS Units Conditions Output current, on Max 250 410 Units Conditions µA VBIAS = 340V VTAP1 = 30V, VSET1-6 = GND TAP1 60 mA TAP2 90 mA VTAP2 = 17V, VSET1-6 = GND TAP3 115 mA VTAP3= 17V, VSET1-6 = GND TAP4 115 mA VTAP4 = 17V, VSET1-6 = GND TAP5 115 mA VTAP5 = 17V, VSET1-6 = GND TAP6 115 mA VTAP6 = 17V, VSET1-6 = GND 0 10 µA Tap 1-5, VBIAS = 312V SET1-5 1.80 2.00 2.20 V SET6 1.89 2.10 2.31 V Output current, off Regulation voltage at SET pins Typ Over recommended operating conditions at 25°C, unless specified otherwise. 2015 Microchip Technology Inc. DS20005357A-page 3 CL8800 TABLE 1-3: 1 2 THERMAL RESISTANCE Package θja1 θjc2 33-Lead QFN 24°C/W 2.5°C/W 1.0 oz Cu 4-layer board, 3x4” PCB with thermal pad and thermal via array. Junction to exposed heat slug. FIGURE 1-1: OUTPUT CURRENT THERMAL CHARACTERISTICS Maximum Output Current 250 200 Taps 4&5 IOUT (mA) 150 Taps 3&6 100 Tap 2 50 Tap 1 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS20005357A-page 4 2015 Microchip Technology Inc. CL8800 2.0 PIN DESCRIPTION The locations of the pins are listed in Package Type. TABLE 2-1: PIN DESCRIPTION Pin # Function 1-8 GND Circuit common (use for heat sink ground plane pass through). 9 SET1 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 10 NC 11 SET2 12 NC 13 SET3 14 NC 15 SET4 16 NC 17 SET5 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 18 SET6 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 19 - 20 GND Circuit common (use for heat sink ground plane pass through). GND Circuit common. Connect to bridge rectifier return (use for heat sink ground plane pass through). 22 - 26 GND Circuit common (use for heat sink ground plane pass through). 27 TAP6 28 TAP5 29 TAP4 30 TAP3 31 TAP2 32 TAP1 33 BIAS 21 Underside plate (GND) 2015 Microchip Technology Inc. Description No internal connection. Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. No internal connection. Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. No internal connection. Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. No internal connection. Current regulator outputs. Connect to taps along the LED string. Provides bias for driver. Connect to rectified AC. For heat sinking purposes, it should be soldered to a 4.0cm2 exposed copper area. It should also be electrically connected to circuit common (GND). DS20005357A-page 5 CL8800 3.0 APPLICATION INFORMATION 3.3 3.1 Overview Zener diodes may be substituted for LEDs in the bottom stages of the design. The last 1 or 2 stages of LEDs contribute little to the light output - they are mainly present to off-load the adjacent upstream regulator at high line voltages to minimize losses. The advantages of Zener substitution includes minimizing unlit LEDs at low line for better light uniformity, better line regulation at high line, fewer LEDs for lower cost and less PCB area, and fewer board-to-board connections. Disadvantages include slightly-reduced efficiency at high line, and additional heat load on the driver board. Designing a driver to meet particular requirements may be a difficult task considering the 18 design variables: tap current (6), number of series-connected LEDs per segment (6), and the number of parallel-connected LEDs per segment (6). Manually selecting values will provide light, but the chosen values may be far from optimal in regards to efficiency, LED utilization, and line regulation. Contact your nearest Microchip Field Applications Engineer for design assistance. In addition to configuring the driver, several circuits may be employed to increase reliability, performance, and cost. The following sections briefly describe these circuits. 3.2 Transient Protection The driver circuits have no need for capacitors that could otherwise absorb transient energy, nor is there a need for EMI filters that would block transients. Therefore, the full burden of transient protection is borne by the protection circuit. The two-stage approach in the following schematics provide 2.5kV protection, both pulse and ring per EN 61000-4-5 and EN 61000-4-12, six hits each. FIGURE 3-1: 100 TO 120 VAC TRANSIENT PROTECTION 3.4 Zener Diode Substitution Phase Dimming As with any light load, the LED lamp might not draw enough current to ensure proper dimmer operation. This is especially true for 230VAC dimmers. Triodes for Alternating Current (TRIAC) used in dimmers require a minimum latching current when triggered to place the TRIAC in the latched-on state. Once latched, a minimum holding current is required to maintain the TRIAC in the on state. Latching current is many times greater than the holding current, and is the main concern with dimmer compatibility. Higher latching current can be provided by a simple series RC network across the AC line. A short time constant provides a current spike at the turn-on edge. Less common is inadequate holding current. The minimum dimmer holding current is typically 10-20mA. Tap1 at 60mA (max) exceeds the minimum. FIGURE 3-3: 22Ω AC Line 150VAC 10mm FIGURE 3-2: AC Line 33Ω AC Line 275VAC 10mm DS20005357A-page 6 500Ω Bridge Rectifier 100 - 200nF 230VAC TRANSIENT PROTECTION 22Ω Transient Protection PHASE DIMMING 440VDC 1.5kW 3.5 Strobing Twice per AC line cycle the line voltage crosses zero volts, during which time there is no light output. The circuit in Figure 3-4 can provide 5-10% valley fill. It has little effect on input current wave shape (THD, PF) and efficiency. This circuit is intended to prevent the output from reaching zero. It will not significantly reduce output ripple. 2015 Microchip Technology Inc. CL8800 3.6 Power Boost FIGURE 3-4: POWER BOOST to LEDs Higher output power can be achieved by off-loading a portion of the power dissipation from the CL8800 to external Field-Effect Transistors (FET). The circuit below drops most of the tap voltage across the FETs, thereby shifting the bulk of the dissipation to the FET. to LEDs 200kΩ 15V TAP6 FIGURE 3-5: TAP7 VALLEY FILL CIRCUIT Optional flicker reduction circuit (valley fill) CF1 RF1 10kΩ RF3 QF1 TAP1 QF2 DN3135 RF2 150kΩ TAP2 TAP3 TAP4 TAP5 TAP6 CL8800 BIAS SET1 SET2 RS1 2015 Microchip Technology Inc. SET3 RS2 GND SET4 RS3 SET5 RS4 RS5 SET6 RS6 DS20005357A-page 7 CL8800 FIGURE 3-6: SIMPLIFIED BLOCK DIAGRAM Transient Protection 22Ω 33Ω 275VAC 10mm 440VDC 1.5kW AC Mains TAP1 TAP2 TAP3 1 0 BIAS 1 0 in reg in reg TAP4 1 0 TAP5 in reg TAP6 1 0 1 0 1 0 in reg in reg GND 100 - 120VAC additional components for 230VAC CL8800 SET1 SET2 RSET1 SET3 RSET2 SET4 RSET3 SET5 RSET4 SET6 RSET5 RSET6 DS20005357A-page 8 2015 Microchip Technology Inc. CL8800 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 33-lead QFN XXXXXXX XXXXXXXX XXXXXX e3 YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: Example CL8800 K63 e3 1449343 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or may not include the corporate logo. 2015 Microchip Technology Inc. DS20005357A-page 9 CL8800 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. DS20005357A-page 10 2015 Microchip Technology Inc. CL8800 APPENDIX A: REVISION HISTORY Revision A (January 2015) • Update file to new format 2015 Microchip Technology Inc. DS20005357A-page 11 CL8800 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device - XX X - Package Environmental Options X Media Type Device: CL8800 = Sequential Linear LED Driver Package: K6(3) = QFN (6x6 mm body), 33-lead Environmental G = Lead (Pb)-free/ROHS-compliant package Media Type: DS20005357A-page 12 (blank) = 490/Tray M935 = 3000/Reel Examples: a) CL8800K63-G: 33-lead QFN package, 490/Tray. b) CL8800K63-G-M935 33-lead QFN package, 3000/Reel 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-63276-957-2 QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV == ISO/TS16949== 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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