PDF Data Sheet Rev. B

30 MHz to 6 GHz
RF/IF Gain Block
ADL5611
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
Fixed gain of 22.2 dB
Broad operation from 30 MHz to 6 GHz
High dynamic range gain block
Input and output internally matched to 50 Ω
Integrated bias circuit
OIP3 of 40.0 dBm at 900 MHz
P1dB of 21.0 dBm at 900 MHz
Noise figure of 2.1 dB at 900 MHz
Single 5 V power supply
Low quiescent current of 94 mA
Wide operating temperature range of −40°C to +105°C
Thermally efficient SOT-89 package
ESD rating of ±1.5 kV (Class 1C)
GND
(2)
ADL5611
BIAS
1
2
3
RFIN
GND
RFOUT
11508-001
FEATURES
Figure 1.
GENERAL DESCRIPTION
The ADL5611 is a single-ended RF/IF gain block amplifier that
provides broadband operation from 30 MHz to 6 GHz. The
ADL5611 provides a low noise figure of 2.1 dB with a very
high OIP3 of 40.0 dBm simultaneously, which delivers a high
dynamic range.
The ADL5611 provides a gain of 22.2 dB that is stable over
frequency, temperature, and power supply, and from device to
device. The amplifier is offered in the industry-standard SOT-89
package and is internally matched to 50 Ω at the input and output,
making the ADL5611 easy to implement in a wide variety of
applications.
Rev. B
The only external parts required are the input and output ac
coupling capacitors, power supply decoupling capacitors, and
bias inductor.
The ADL5611 has a high ESD rating of ±1.5 kV (Class 1C) and
is fully specified for operation across a wide temperature range
of −40°C to +105°C.
A fully populated RoHS compliant evaluation board is available.
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Technical Support
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ADL5611
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
30 MHz to 500 MHz Frequency Band..................................... 10
Functional Block Diagram .............................................................. 1
General......................................................................................... 11
General Description ......................................................................... 1
Applications Information .............................................................. 13
Revision History ............................................................................... 2
Basic Connections ...................................................................... 13
Specifications..................................................................................... 3
Typical Scattering Parameters (S-Parameters) ......................... 5
Soldering Information and Recommended PCB Land Pattern
....................................................................................................... 14
Absolute Maximum Ratings ............................................................ 7
W-CDMA ACPR Performance ................................................ 14
Thermal Resistance ...................................................................... 7
Evaluation Board ............................................................................ 15
ESD Caution .................................................................................. 7
Outline Dimensions ....................................................................... 16
Pin Configuration and Function Descriptions ............................. 8
Ordering Guide .......................................................................... 16
Typical Performance Characteristics ............................................. 9
500 MHz to 6 GHz Frequency Band.......................................... 9
REVISION HISTORY
12/15—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 16
9/13—Rev. 0 to Rev. A
Added Figure 19; Renumbered Sequentially .............................. 11
Changes to Figure 29 ...................................................................... 14
Updated Outline Dimensions ....................................................... 16
7/13—Revision 0: Initial Version
Rev. B | Page 2 of 16
Data Sheet
ADL5611
SPECIFICATIONS
VPOS = 5 V and TA = 25°C, unless otherwise noted.
Table 1.
Parameter
OVERALL FUNCTION
Frequency Range
FREQUENCY = 30 MHz
Gain
Output 1 dB Compression Point (P1dB)
Output Third-Order Intercept (OIP3)
Noise Figure 1
FREQUENCY = 140 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 350 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 700 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 900 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 1900 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
Test Conditions/Comments
Min
Typ
30
Δf = 1 MHz, output power (POUT) = 0 dBm per tone
±10 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±10 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
Rev. B | Page 3 of 16
6000
MHz
21.8
16.0
27.6
3.9
dB
dBm
dBm
dB
18.9
±0.42
±0.45
±0.09
16.3
27.2
3.3
dB
dB
dB
dB
dBm
dBm
dB
22.0
±0.04
±0.28
±0.06
20.9
34.0
2.4
dB
dB
dB
dB
dBm
dBm
dB
22.2
±0.02
±0.26
±0.08
21.0
39.6
2.1
dB
dB
dB
dB
dBm
dBm
dB
22.2
±0.02
±0.25
±0.10
21.0
40.0
2.1
23.2
dB
dB
dB
dB
dBm
dBm
dB
20.4
21.4
±0.07
±0.34
±0.20
20.6
37.0
2.4
22.4
dB
dB
dB
dB
dBm
dBm
dB
Δf = 1 MHz, POUT = 0 dBm per tone
Δf = 1 MHz, POUT = 0 dBm per tone
Unit
21.2
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Max
ADL5611
Parameter
FREQUENCY = 2140 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 2600 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 3500 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 4000 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 5000 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
FREQUENCY = 5800 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure1
Data Sheet
Test Conditions/Comments
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
±50 MHz
−40°C ≤ TA ≤ +105°C
4.75 V to 5.25 V
Δf = 1 MHz, POUT = 0 dBm per tone
Rev. B | Page 4 of 16
Min
Typ
Max
Unit
21.2
±0.05
±0.38
±0.23
20.6
35.8
2.6
dB
dB
dB
dB
dBm
dBm
dB
20.7
±0.06
±0.55
±0.25
19.4
32.3
2.8
dB
dB
dB
dB
dBm
dBm
dB
20.3
±0.03
±1.05
±0.26
17.4
28.6
3.1
dB
dB
dB
dB
dBm
dBm
dB
20.0
±0.13
±1.55
±0.27
16.2
27.4
3.2
dB
dB
dB
dB
dBm
dBm
dB
16.3
±0.16
±1.49
±0.28
16.0
27.0
4.4
dB
dB
dB
dB
dBm
dBm
dB
14.3
±0.11
±1.67
±0.23
12.8
23.0
6.0
dB
dB
dB
dB
dBm
dBm
dB
Data Sheet
ADL5611
Parameter
POWER INTERFACE
Supply Voltage
Supply Current
vs. Temperature
Power Dissipation
1
Test Conditions/Comments
Min
Typ
Max
Unit
VPOS
4.75
5
94
−7/+14
470
5.25
124
V
mA
mA
mW
−40°C ≤ TA ≤ +105°C
VPOS = 5 V
Noise figure specified includes printed circuit board (PCB) traces losses.
TYPICAL SCATTERING PARAMETERS (S-PARAMETERS)
VPOS = 5 V and TA = 25°C.
Table 2.
Frequency
(MHz)
30
50
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
3500
S11
Magnitude (dB)
−19.413
−13.165
−7.702
−10.283
−13.623
−16.531
−13.489
−15.012
−16.953
−18.750
−20.402
−22.020
−23.568
−25.331
−27.267
−29.729
−33.265
−35.854
−34.321
−29.745
−26.887
−24.113
−21.301
−19.164
−17.568
−16.338
−15.187
−14.370
−13.733
−13.062
−12.653
−12.418
−12.019
−11.809
−11.972
−12.388
−12.849
Angle (°)
−26.158
+18.866
−16.728
−70.711
−97.401
−116.624
−133.038
−155.101
−173.278
−191.016
−209.005
−226.338
−243.133
−258.964
−272.170
−280.677
−281.069
−260.621
−226.683
−218.694
−221.152
−228.131
−235.040
−245.484
−257.372
−268.596
−279.362
−290.528
−301.461
−311.936
−322.355
−332.177
−342.619
−354.255
−366.792
−377.671
−390.154
S21
Magnitude (dB)
+21.776
+20.450
+17.424
+20.615
+21.750
+22.133
+21.878
+22.109
+22.166
+22.175
+22.157
+22.123
+22.077
+22.018
+21.957
+21.882
+21.812
+21.737
+21.648
+21.569
+21.438
+21.331
+21.256
+21.164
+21.078
+20.965
+20.863
+20.734
+20.606
+20.519
+20.435
+20.380
+20.411
+20.422
+20.411
+20.419
+20.412
Angle (°)
+172.769
+161.606
+169.845
+170.893
+153.718
+137.323
−227.398
−242.602
−258.309
−273.359
−287.987
−302.271
−316.366
−330.209
−343.987
−357.634
−371.163
−384.666
−398.040
−411.423
−424.771
−438.049
−451.001
−464.099
−477.290
−490.408
−503.418
−516.421
−529.269
−541.969
−554.516
−567.048
−579.843
−592.914
−606.400
−619.528
−633.251
Rev. B | Page 5 of 16
S12
Magnitude (dB)
−27.133
−28.149
−31.453
−28.530
−27.648
−27.393
−27.654
−27.407
−27.340
−27.310
−27.272
−27.262
−27.273
−27.269
−27.264
−27.273
−27.273
−27.266
−27.267
−27.245
−27.233
−27.225
−27.272
−27.274
−27.248
−27.207
−27.219
−27.195
−27.127
−27.084
−26.970
−26.772
−26.724
−26.607
−26.511
−26.359
−26.200
Angle (°)
+0.556
−13.136
−6.433
−3.592
−17.328
−29.469
−30.240
−41.040
−52.626
−63.591
−74.251
−84.772
−94.790
−104.782
−114.842
−124.700
−134.354
−144.166
−154.033
−163.652
−173.766
−183.324
−193.034
−202.461
−212.036
−221.732
−231.237
−240.889
−250.483
−259.695
−269.348
−279.469
−289.424
−299.778
−309.746
−320.482
−331.064
S22
Magnitude (dB)
−11.297
−7.839
−5.303
−7.558
−9.628
−10.723
−9.139
−9.456
−9.852
−10.087
−10.220
−10.281
−10.316
−10.341
−10.329
−10.350
−10.363
−10.357
−10.400
−10.392
−10.531
−10.566
−10.674
−10.724
−10.708
−10.706
−10.737
−10.755
−10.775
−10.809
−10.888
−11.086
−11.163
−11.348
−11.533
−12.017
−12.489
Angle (°)
−165.214
−163.448
−189.380
−220.163
−229.758
−234.863
−242.984
−252.814
−259.624
−266.406
−273.138
−280.106
−286.874
−293.925
−300.962
−308.089
−314.919
−321.662
−328.324
−334.645
−341.717
−347.988
−352.991
−358.726
−364.342
−370.531
−376.605
−383.283
−390.170
−397.037
−404.594
−412.962
−420.818
−430.470
−440.976
−452.391
−465.304
ADL5611
Frequency
(MHz)
3600
3700
3800
3900
4000
4100
4200
4300
4400
4500
4600
4700
4800
4900
5000
5100
5200
5300
5400
5500
5600
5700
5800
5900
6000
Data Sheet
S11
Magnitude (dB)
−13.681
−14.819
−16.480
−18.415
−20.901
−22.899
−20.175
−16.107
−12.487
−9.908
−8.294
−7.462
−6.742
−6.341
−5.850
−5.683
−5.393
−5.255
−4.941
−4.762
−4.751
−4.718
−4.803
−4.815
−4.846
Angle (°)
−403.841
−418.280
−433.535
−450.193
−481.302
−530.706
−574.613
−607.497
−632.642
−655.826
−676.352
−692.336
−707.212
−719.044
−730.317
−740.078
−749.333
−757.862
−766.095
−775.169
−783.296
−791.495
−798.324
−805.589
−812.180
S21
Magnitude (dB)
+20.385
+20.334
+20.321
+20.283
+20.107
+19.930
+19.528
+18.987
+18.248
+17.627
+17.415
+17.300
+17.180
+16.938
+16.723
+16.407
+16.142
+15.797
+15.601
+15.423
+15.212
+15.016
+14.811
+14.640
+14.474
Angle (°)
−647.042
−661.029
−675.145
−689.975
−704.970
−719.959
−735.700
−750.647
−764.216
−775.099
−785.594
−797.596
−810.719
−823.703
−836.856
−849.613
−862.399
−874.886
−886.816
−899.572
−912.138
−925.031
−937.622
−950.405
−963.642
Rev. B | Page 6 of 16
S12
Magnitude (dB)
−26.068
−25.962
−25.829
−25.641
−25.735
−25.751
−25.987
−26.349
−26.734
−26.846
−26.704
−26.413
−26.495
−26.376
−26.732
−26.564
−26.637
−26.764
−26.723
−26.813
−26.836
−26.865
−26.711
−26.625
−26.496
Angle (°)
−341.857
−352.974
−364.326
-375.829
−388.338
−400.117
−412.869
−424.046
−433.978
−442.104
−451.707
−463.172
−473.259
−485.497
−496.442
−506.443
−518.454
−527.731
−538.802
−550.352
−560.482
−570.790
−581.237
−592.240
−603.172
S22
Magnitude (dB)
−13.141
−13.812
−14.683
−15.473
−15.539
−15.329
−14.226
−12.606
−10.710
−9.069
−7.925
−7.360
−6.944
−6.709
−6.431
−6.520
−6.474
−6.577
−6.816
−7.136
−7.707
−8.420
−9.417
−10.700
−12.335
Angle (°)
−480.219
−497.201
−517.273
−540.432
−563.571
−589.891
−611.397
−631.788
−651.154
−671.887
−691.567
−709.087
−725.426
−738.970
−752.403
−764.449
−775.847
−787.719
−798.987
−810.139
−821.411
−832.448
−843.000
−853.572
−863.102
Data Sheet
ADL5611
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
Supply Voltage, VPOS
Input Power (50 Ω Impedance)
Internal Power Dissipation (Pad Soldered to
Ground)
ESD Human Body Model (HBM) Rating (ESDA/
JEDEC JS-001-2011)
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Table 4 lists the junction-to-air thermal resistance (θJA) and the
junction-to-case thermal resistance (θJC) for the ADL5611.
Rating
6.5 V
20 dBm
800 mW
Table 4. Thermal Resistance
Package Type
3-Lead SOT-89 (RK-3)
±1.5 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
θJC2
9
Unit
°C/W
Measured on the ADL5611 evaluation board. For more information about
board layout, see the Soldering Information and Recommended PCB Land
Pattern section.
2
Based on simulation with a standard JEDEC board per JESD51.
1
150°C
−40°C to +105°C
−65°C to +150°C
θJA1
52
ESD CAUTION
Rev. B | Page 7 of 16
ADL5611
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
RFIN 1
GND 2
ADL5611
TOP VIEW
(2) GND
(Not to Scale)
NOTES
1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THE
TAB AT THE TOP SIDE OF THE PACKAGE. SOLDER
THE EXPOSED PAD TO A LOW IMPEDANCE GROUND
PLANE FOR ELECTRICAL GROUNDING AND
THERMAL TRANSFER.
11508-002
RFOUT 3
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
2
3
Mnemonic
RFIN
GND
RFOUT
EPAD
Description
RF Input. This pin requires a dc blocking capacitor.
Ground. Connect this pin to a low impedance ground plane.
RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the
external power supply. The RF path requires a dc blocking capacitor.
Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed
pad to a low impedance ground plane for electrical grounding and thermal transfer.
Rev. B | Page 8 of 16
Data Sheet
ADL5611
TYPICAL PERFORMANCE CHARACTERISTICS
500 MHz TO 6 GHz FREQUENCY BAND
45
40
40
35
OIP3 (dBm)
25
GAIN (dB)
20
P1dB (dBm)
15
2600MHz
30
3500MHz
5000MHz
4000MHz
5800MHz
20
5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
15
–5
–3
–1
1
3
5
POUT PER TONE (dBm)
11508-106
NOISE FIGURE (dB)
FREQUENCY (GHz)
Figure 6. OIP3 vs. Output Power (POUT) and Frequency
Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
25
0
+25°C
20
–5
+85°C
–40°C
+105°C
15
S-PARAMETERS (dB)
10
5
S22
–10
–15
S11
–20
–25
S12
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
FREQUENCY (GHz)
–35
0.5
11508-104
0
0.5
45
8
40
40
7
35
35
30
30
25
25
+105°C
15
15
10
10
5
5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
6.0
FREQUENCY (GHz)
NOISE FIGURE (dB)
20
P1dB (dBm)
+85°C
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6
5
4
+105°C
+85°C
+25°C
–40°C
3
2
1
11508-105
+25°C
2.0
Figure 7. Output Return Loss (S22), Input Return Loss (S11), and
Reverse Isolation (S12) vs. Frequency
45
–40°C
1.5
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency and Temperature
20
1.0
11508-107
–30
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
FREQUENCY (GHz)
Figure 8. Noise Figure vs. Frequency and Temperature
Figure 5. OIP3 and P1dB vs. Frequency and Temperature
Rev. B | Page 9 of 16
6.0
11508-108
GAIN (dB)
900MHz
1900MHz
2140MHz
25
10
0
0.5
OIP3 (dBm)
700MHz
35
OIP3 (dBm)
30
11508-103
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
45
ADL5611
Data Sheet
30 MHz TO 500 MHz FREQUENCY BAND
45
40
40
35
OIP3 (dBm)
25
GAIN (dB)
20
P1dB (dBm)
15
140MHz
30
350MHz
25
10
20
5
NOISE FIGURE (dB)
0
50
100
150
200
250
300
350
400
450
500
FREQUENCY (MHz)
15
–5
–3
–1
1
3
5
POUT PER TONE (dBm)
Figure 9. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
Low Frequency Configuration
11508-112
0
Figure 12. OIP3 vs. Output Power (POUT) and Frequency,
Low Frequency Configuration
25
0
–40°C
–5
20
+25°C
15
S-PARAMETERS (dB)
+105°C
GAIN (dB)
30MHz
35
OIP3 (dBm)
30
11508-109
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
45
+85°C
10
S22
–10
S11
–15
–20
–25
S12
5
50
100
150
200
250
300
350
400
450
500
FREQUENCY (MHz)
–35
8
40
40
7
35
35
30
30
20
+25°C
NOISE FIGURE (dB)
25
P1dB (dBm)
+105°C
+85°C
5
10
10
5
5
1
0
500
0
50
100
150
200
250
300
350
400
450
250
300
350
400
450
500
FREQUENCY (MHz)
+25°C
+105°C
3
15
0
200
–40°C
4
15
0
150
6
2
11508-111
OIP3 (dBm)
45
20
100
Figure 13. Output Return Loss (S22), Input Return Loss (S11), and
Reverse Isolation (S12) vs. Frequency, Low Frequency Configuration
45
–40°C
50
FREQUENCY (MHz)
Figure 10. Gain vs. Frequency and Temperature,
Low Frequency Configuration
25
0
Figure 11. OIP3 and P1dB vs. Frequency and Temperature,
Low Frequency Configuration
+85°C
0
50
100
150
200
250
300
350
400
450
FREQUENCY (MHz)
Figure 14. Noise Figure vs. Frequency and Temperature,
Low Frequency Configuration
Rev. B | Page 10 of 16
500
11508-114
0
11508-110
0
11508-113
–30
Data Sheet
ADL5611
GENERAL
115
130
125
110
SUPPLY CURRENT (mA)
110
105
5.25V
100
5V
95
90
105
5.25V
100
80
–40 –30 –20 –10 0
4.75V
90
4.75V
85
5V
95
10 20 30 40 50 60 70 80 90 100 110
TEMPERATURE (°C)
85
–5
0
15
20
Figure 18. Supply Current vs. POUT at 900 MHz
40
115
35
110
30
105
SUPPLY CURRENT (mA)
25
20
15
10
5V, +105°C
5V, +85°C
100
5V, +25°C
95
5V, –40°C
90
85
80
5
22.10
22.20
22.30
22.40
22.50
GAIN (dB)
75
–6
11508-122
22.00
–4
–2
0
2
4
6
8
10
12
14
16
18
20
22
POUT (dBm)
Figure 16. Gain Distribution at 900 MHz
11508-219
PERCENTAGE (%)
10
POUT (dBm)
Figure 15. Supply Current vs. Temperature
0
5
11508-124
115
11508-121
SUPPLY CURRENT (mA)
120
Figure 19. Supply Current vs. POUT for Various Temperatures,
VCC = 5 V at 900 MHz
60
50
45
40
PERCENTAGE (%)
40
30
20
35
30
25
20
15
10
10
21.1
21.2
21.3
21.4
21.5
21.6
21.7
GAIN (dB)
21.7
0
20.3
20.4
20.5
20.6
20.7
20.8
20.9
GAIN (dB)
Figure 20. Gain Distribution at 2600 MHz
Figure 17. Gain Distribution at 1900 MHz
Rev. B | Page 11 of 16
21.0
11508-119
5
0
11508-117
PERCENTAGE (%)
50
ADL5611
Data Sheet
40
90
35
80
70
PERCENTAGE (%)
25
20
15
10
50
40
30
20
5
10
19.6
19.7
19.8
19.9
20.0
20.2
20.1
20.3
GAIN (dB)
0
11508-120
0
60
1.8
1.9
2.0
2.1
2.2
2.3
2.4
11508-126
PERCENTAGE (%)
30
2.5
NOISE FIGURE (dB)
Figure 24. Noise Figure Distribution at 900 MHz
Figure 21. Gain Distribution at 4000 MHz
0
60
–10
–20
HARMONICS (dBc)
PERCENTAGE (%)
50
40
30
20
–30
–40
–50
H2
–60
H3
–70
10
P1dB (dBm)
35
30
20
15
10
5
38
39
40
41
42
43
44
45
OIP3 (dBm)
11508-125
PERCENTAGE (%)
25
37
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
Figure 25. Single-Tone Harmonics vs. Frequency, POUT = 0 dBm
Figure 22. P1dB Distribution at 900 MHz
0
–90
0.5
Figure 23. OIP3 Distribution at 900 MHz, POUT = 0 dBm per Tone
Rev. B | Page 12 of 16
11508-127
20.5 20.6 20.7 20.8 20.9 21.0 21.1 21.2 21.3 21.4 21.5
11508-123
0
–80
Data Sheet
ADL5611
Figure 26 shows the basic connections for operating the ADL5611.
The device supports operation from 30 MHz to 6 GHz. However,
for optimal performance at lower frequency bands, the board configuration must be adjusted. Table 6 lists the recommended board
configuration to operate the device at various frequency bands.
GND VPOS
1µF
C5
1.2nF
C4
ADL5611
35
30
25
20
15
3
50
100
150
200
250
300
350
400
450
500
Figure 27. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
30 MHz to 500 MHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
RFOUT
C2
0
FREQUENCY (MHz)
L1
C1
NOISE FIGURE (dB), DEFAULT SETUP CONFIGURATION
NOISE FIGURE (dB), LOW FREQUENCY CONFIGURATION
5
0
11508-222
2
RFOUT
GND
RFIN
1
P1dB (dBm), DEFAULT SETUP CONFIGURATION
P1dB (dBm), LOW FREQUENCY CONFIGURATION
10
68pF
RFIN
OIP3 (dBm), DEFAULT SETUP CONFIGURATION
OIP3 (dBm), LOW FREQUENCY CONFIGURATION
GAIN (dB), DEFAULT SETUP CONFIGURATION
GAIN (dB), LOW FREQUENCY CONFIGURATION
40
0
Figure 26. Basic Connections
At low frequencies, the device exhibits improved performance
with the suggested setup configuration listed in Table 6. Figure 27
and Figure 28 provide a comparison of the performance of the
device at the 30 MHz to 500 MHz band when driven with the
optimal setup configuration and the default setup configuration.
S-PARAMETERS (dB)
A 5 V dc bias is supplied to the amplifier through the bias inductor
connected to RFOUT (Pin 3). Decouple the bias voltage using
68 pF, 1.2 nF, and 1 µF power supply decoupling capacitors. The
typical current consumption for the ADL5611 is 94 mA.
S22, DEFAULT SETUP CONFIGURATION
S11, DEFAULT SETUP CONFIGURATION
–5
–10
–15
S22, LOW FREQUENCY CONFIGURATION
S11, LOW FREQUENCY CONFIGURATION
–20
–25
–30
–35
S12, DEFAULT SETUP CONFIGURATION
S12, LOW FREQUENCY CONFIGURATION
0
50
100
150
200
250
300
350
FREQUENCY (MHz)
400
450
500
11508-130
(2)
GND
C6
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
45
BASIC CONNECTIONS
11508-129
APPLICATIONS INFORMATION
Figure 28. Output Return Loss (S22), Input Return Loss (S11), and
Reverse Isolation (S12), 30 MHz to 500 MHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
Table 6. Recommended Components for Basic Connections
Frequency Band
500 MHz to 6 GHz
30 MHz to 500 MHz
C1 (nF)
100
100
AC Coupling Capacitors (0402)
C2 (nF)
100
100
Rev. B | Page 13 of 16
DC Bias Inductor (0603HP)
L1 (nH)
43
1000
ADL5611
Data Sheet
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 29 shows the recommended land pattern for the ADL5611.
To minimize thermal impedance, the exposed pad on the
underside of the SOT-89 package is soldered to a ground plane,
along with Pin 2. If multiple ground layers exist, stitch the layers
together using vias.
1.80mm
Thermal simulation suggests a junction temperature that is
10°C higher than the top of package temperature. With additional
measurements of the ambient temperature and input/output
power, θJA can be determined.
W-CDMA ACPR PERFORMANCE
Figure 30 shows a plot of the adjacent channel power ratio
(ACPR) vs. POUT for the ADL5611. The signal type used is a
single wideband code division multiple access (W-CDMA)
carrier (Test Model 1-64) at 2140 MHz. This signal is generated
by a very low ACPR source. ACPR is measured at the output by
a high dynamic range spectrum analyzer that incorporates an
instrument noise correction function.
0.635mm
3.48mm
5.37mm
0.20mm
0.62mm
0.86mm
–10
–20
–30
–40
–50
–60
–70
–80
–90
–20
1.27mm
–15
–10
–5
0
5
10
POUT (dBm)
11508-138
0.762mm
ACPR AT 5MHz CARRIER OFFSET (dBc)
0
0.86mm
Figure 30. ACPR vs. POUT, Single W-CDMA Carrier (Test Model 1-64)
at 2140 MHz
3.00mm
The ADL5611 achieves an ACPR of −79 dBc at an output power
level of −5 dBm, at which point the device noise and not distortion
begins to dominate the power in the adjacent channels. At an
output power level of 5 dBm, ACPR is still very low at −62 dBc.
11508-229
1.50mm
Figure 29. Recommended Land Pattern
The land pattern on the ADL5611 evaluation board provides a
measured thermal resistance (θJA) of 52°C/W. To measure θJA,
the temperature at the top of the SOT-89 package is sensed with
an IR temperature gun.
Rev. B | Page 14 of 16
Data Sheet
ADL5611
EVALUATION BOARD
GND
Figure 31 shows the ADL5611 evaluation board layout. Figure 32
shows the schematic for the evaluation board. The board is
powered by a single 5 V supply. Table 7 lists the components
used on the evaluation board. Power can be applied to the
board through clip on terminals (VCC and GND).
VCC
(2)
GND
C6
R5
0Ω
1µF
C5
1.2nF
C4
ADL5611
3
C1
100nF
L1
43nH
RFOUT
C2
100nF
11508-327
Figure 32. Evaluation Board Schematic
Figure 31. Evaluation Board Layout (Top)
Table 7. Evaluation Board Configuration Options
Component
C1, C2
L1
R5
VCC and GND
C4, C5, C6
Description
AC coupling capacitors
DC bias inductor
Bias resistor
Clip on terminals for power supply
Power supply decoupling capacitors
Default Value
C1, C2 = 100 nF, 0402
L1 = 43 nH, 0603 (Coilcraft 0603HP or equivalent)
R5 = 0 Ω, 0402
Not applicable
C4 = 68 pF, 0603; C5 = 1.2 nF, 0603; C6 = 1 µF, 1206
Rev. B | Page 15 of 16
11508-228
2
RFOUT
RFIN
GND
RFIN
68pF
1
ADL5611
Data Sheet
OUTLINE DIMENSIONS
1.75
1.55
(2)
4.25
3.94
1
2
2.413
2.380
2.337
2.60
2.30
3
1.20
0.75
1.50 TYP
1.270
1.252
1.219
BOTTOM VIEW
0.635
0.569
0.508
3.00 TYP
TOP VIEW
2.29
2.14
4.60
4.40
SIDE VIEW
END VIEW
0.52
0.32
COPLANARITY
0.076 MAX
COMPLIANT TO JEDEC STANDARDS TO-243
11-09-2015-D
0.56
0.36
PKG-003480
1.60
1.40
0.44
0.35
Figure 33. 3-Lead Small Outline Transistor Package [SOT-89]
(RK-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADL5611ARKZ-R7
ADL5611-EVALZ
1
Temperature Range
−40°C to +105°C
−40°C to +105°C
Package Description
3-Lead Small Outline Transistor Package [SOT-89], 7“ Tape and Reel
Evaluation Board
Z = RoHS Compliant Part.
©2013–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11508-0-12/15(B)
Rev. B | Page 16 of 16
Package Option
RK-3