CL2 DATA SHEET (11/18/2015) DOWNLOAD

CL2
Simple 90V, 20mA, Temperature Compensated,
Constant-Current LED Driver IC
Features
Description
•
•
•
•
CL2 is a high voltage, temperature compensated, constant-current source. The device is trimmed to provide
a constant current of 20 mA ±10% at an input voltage
of 5–90V. The device can be used as a two-terminal,
constant-current source or constant-current sink.
5.0 to 90V operating range (VA-B)
20 mA ±10% at 5.0 - 90V
0.01%/°C typical temperature coefficient
Available in TO-243AA (SOT-89), TO-252(DPAK), & TO-92 packages
• Can be paralleled for higher current
A typical application for the CL2 is to drive LEDs with a
constant current of 20 mA. Multiple CL2s can also be
used in parallel to provide higher currents such as
40 mA, 60 mA or 80 mA. The device is available in TO243AA (SOT-89), TO-252 (D-PAK), and TO-92 packages.
Applications
•
•
•
•
•
•
•
LED driver
Industrial lamp indicators
Signage
Accent lighting
Automotive
Constant current source
Constant current sink
Package Type
VB
VB
VB
VA
N/C
NC
TO-92
VA
TO-252 (D-PAK)
VA
VB
N/C
TO-243AA (SOT-89)
See Table 2-1 for pin information
 2015 Microchip Technology Inc.
DS20005448A-page 1
CL2
Typical Application Circuit
VA
Functional Circuit
Diagram
VA
CL2
Up to 90V
+ VLED(total)
100nF
VB
+
ILED
<20mA
Control Circuit
and Temperature
Compensation
VLED(total)
VB
-
DS20005448A-page 2
 2015 Microchip Technology Inc.
CL2
1.0
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS†
Operating voltage, VA-B ........................................................................................................................................... 100V
Operating junction temperature, Tj ........................................................................................................... -40 to +125 °C
Storage Temperature, Ts .......................................................................................................................... -55 to +150 °C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC AND AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, for all specifications TA = +25°C
Parameter
Operating voltage
Current regulation
IA-B temperature coefficient
Operating junction temperature
Dynamic resistance
Symbol
Min
Typ
Max
VA-B
5.0
-
90
Units Conditions
V
---
IA-B
18.0
20
22
mA
∆IA-B/∆T
-
0.01
-
%/°C
VA-B= 5.0V - 90V
Tj
-40
-
125
°C
---
RA-B
-
300
-
kΩ
---
VA-B= 45V, Tj= -40°C to +100°C
TEMPERATURE SPECIFICATIONS
Parameter
Symbol
Min
Typ
Max
Units Conditions
Operating Junction Temperature
Tj
-40
–
125
°C
Storage Temperature
Ts
-55
–
150
°C
Thermal Resistance, TO-92
θja
–
132
–
°C/W
Thermal Resistance, TO-252
θja
–
81
–
°C/W Note 1
Thermal Resistance, TO-243AA
θja
–
133
–
°C/W Note 1
Temperature Ranges
Package Thermal Resistances
Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm
TABLE 1-1:
THERMAL CHARACTERISTICS
Package
Power Dissipation
@TA = 2.5°C (W)
Conditions
TO-92
0.6
TO-252
2.0
Note 1
TO-243AA
1.3
Note 1
Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm
 2015 Microchip Technology Inc.
DS20005448A-page 3
CL2
2.0
PIN DESCRIPTION
The locations of the pins are listed in Package Type
and Packaging Information.
TABLE 2-1:
PIN DESCRIPTION
Pin # TO-92
Pin # TO-252
Pin # To-243AA
Symbol
Function
1
1
1
VA
Current in
2
3
3
NC
No connect
3
4
2,4
VB
Current out
DS20005448A-page 4
 2015 Microchip Technology Inc.
CL2
3.0
FUNCTIONAL DESCRIPTION
Figure 3-1 provides the Functional Circuit diagram and
its equivalent block diagram for CL2. Performance
information is available in Figure 3-2 and Figure 3-3.
Figure 3-4 and Figure 3-5 provide example schematics.
VA
VA
Control Circuit
and Temperature
Compensation
20mA
±10%
VB
VB
Equivalent Block Diagram
Functional Circuit Diagram
FIGURE 3-1:
Functional Circuit Diagram and Equivalent Block Diagram
Current, normalized to 25°C
1.03
1.02
5.0V
45V
1.01
90V
1.00
0.99
0.98
-55
-35
-15
5
25
45
65
85
105
125
145
Temperature (°C)
FIGURE 3-2:
Temperature Characteristics
 2015 Microchip Technology Inc.
DS20005448A-page 5
CL2
25
IA-B (mA)
20
15
10
5
0
0
10
20
30
40
50
60
70
80
90
100
VA-B
FIGURE 3-3:
Output Current vs Voltage
VA
CL2
Up to 90V
+VLED(total)
VA
CL2
VA
VA
CL2
CL2
100nF
VB
VB
VB
VB
+
ILED
~20mA
ILED
~20mA
ILED
~20mA
ILED
~20mA
+VLED(total)
-
FIGURE 3-4:
DS20005448A-page 6
CL2 for Multiple LED Strings
 2015 Microchip Technology Inc.
CL2
VA
Up to 90V
+VLED(total)
VA
CL2
CL2
VA
CL2
100nF
VB
VB
VB
+
ILED
~60mA
VLED(total)
_
FIGURE 3-5:
CL2 for Higher Current
 2015 Microchip Technology Inc.
DS20005448A-page 7
CL2
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
3-lead TO-92
Example
XXXXXX
XXXX e3
YWWNNN
CL2
N3 e3
541343
Example
XXXX
XXXXX e3
YYWWNNN
2K4
1541343
e3
Note:
DS20005448A-page 8
XXXXYWW
NNN
TO-252 (D-PAK)
Legend: XX...X
Y
YY
WW
NNN
*
3-lead TO-243AA *
(SOT-89)
Example
CL2541
343
CL
e3
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
 2015 Microchip Technology Inc.
CL2
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
 2015 Microchip Technology Inc.
DS20005448A-page 9
CL2
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
DS20005448A-page 10
 2015 Microchip Technology Inc.
CL2
3-Lead TO-243AA (SOT-89) Package Outline (N8)
D
D1
C
E H
L
1
2
E1
3
b
b1
e
A
e1
Side View
Top View
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Symbol
Dimensions
(mm)
A
b
b1
C
D
D1
E
E1
e
e1
†
MIN
1.40
0.44
0.36
0.35
4.40
1.62
2.29
2.00
NOM
-
-
-
-
-
-
-
-
MAX
1.60
0.56
0.48
0.44
4.60
1.83
2.60
2.29
1.50
BSC
3.00
BSC
H
L
3.94
0.73†
-
-
4.25
1.20
JEDEC Registration TO-243, Variation AA, Issue C, July 1986.
† This dimension differs from the JEDEC drawing
Drawings not to scale.
 2015 Microchip Technology Inc.
DS20005448A-page 11
CL2
APPENDIX A:
REVISION HISTORY
Revision A (November 2015)
• Updated file to Microchip format
DS20005448A-page 12
 2015 Microchip Technology Inc.
CL2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
-
XX
X
-
Package Environmental
Options
CL2
X
Media
Type
= Simple 90V, 20 mA, Temperature-Compensated, Constant-Current LED Driver IC
Package:
N3
K4
N8
= TO-92, 3-lead
= TO-252 (D-PAK), 3-lead
= TO-243AA (SOT-89), 3-lead
Environmental
G
= Lead (Pb)-free/ROHS-compliant package
Media Type:
(blank)
=
=
=
=
P002
 2015 Microchip Technology Inc.
Examples:
a)
CL2N3-G
b)
CL2K4-G
c)
CL2N8-G
d)
CL2N3-G-P002
TO-92 package,
1000/Bag
TO-252 package,
2000/Reel
TO-243AA package,
2000/Reel
TO-92 package,
2000/Reel
1000/Bag for N3 packages
2000/Reel for K4 packages
2000/Reel for N8 packages
2000/Reel for N3
DS20005448A-page 13
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
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ViewSpan, WiperLock, Wireless DNA, and ZENA are
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0014-1
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CERTIFIEDBYDNV
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DS20005448A-page 14
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DS20005448A-page 15
 2015 Microchip Technology Inc.
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