Soldering Conditions

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SOLDERING CONDITIONS FOR CHIP TYPE
■ Recommended land pattern and size
 Standard type
Unit：mm
Case Size
ø DL
Land Size
X
Y
W
Thickness of
Solder paste
35.3
1.6
2.2
0.8
0.15
45.3, 5.7, 5.8
1.6
2.6
1.0
0.15
55.3, 5.7, 5.8
1.6
3.0
1.4
0.15
6.35.3, 5.7, 5.8
1.6
3.6
1.9
0.15
6.37.7
1.6
3.6
1.9
0.15
86.5, 6.7
1.6
4.0
2.1
0.15
810, 10.5
2.5
3.5
3.0
0.15
2.5
4.0
4.0
0.15
107.7, 10, 10.5
■ Recommended soldering conditions
 Standard type (Lead free)
(1) Methods
0000000000000000000000000000000000000000000000000000000
see the following
Methods
Reflow soldering
Soldering iron
Flow soldering
Advisability
○
○

(2) Soldering iron conditions
Iron tip temperature shall be 400℃ 5℃ within the duration of 3
1
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seconds.
(3) Reflow soldering conditions
T200: Duration while capacitor head
temperature exceeds 200℃(s)
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T230: Duration while capacitor head
temperature exceeds 230℃(s)
The measurement temperature point
is the case top.
1. Preheating shall be under 180℃ within
120 seconds.
2. Peak temperature shall be within the
peak temperature matrix.
3. For conditions exceeding the
tolerances, consult with us.
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NOTE
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.