CH390 High Gain Optocoupler

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ISOCOM LTD
PART NUMBER
CH390/L2S
COMPONENT
ISSUE 1
SPECIFICATION
September 2013
Component Specification
For Ceramic Hermetically Sealed, Radiation Hard
High Gain Optocoupler
M1077 IECQ
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Ceramic Hermetically Sealed, Radiation Hard
High Gain Optocoupler
■ CH390
■ CH390/L2
■ CH390/L2S
Features
Applications
▪ Released to European Standard
and Complies to Mil Std
▪ Space Radiation Equipment
▪ Military, high reliability system
▪ High Current Transfer Ratio (Typically 1000%)
▪ Medical instruments
▪ Displacement Damage Tested to 3 MEV x10¹²
▪ Mos, Cmos Applications
▪ Hermetically Sealed
▪ Logic Interfacing
▪ High Withstand Test Voltage
▪ Data Transmission
▪ 5 Pin Hybrid Package
▪ Power Supply
▪ Low Input Requirements 0.5mA
▪ Modems
Description
These devices are single, hermetically sealed optically coupled isolators. Each channel is composed of a Gallium
Arsenide infra-red emitting diode and a high gain photon detector. The high gain output stage features and open collector
output providing both lower output saturation and higher speed of operation than is possible with conventional photodarlington type couplers. The CH390 series are being used in environments encounted by space applications. It is
manufactured to meet the JANS standard in conjunction with MIL-PRF-19500 procedures (please see next page for all
other applicable specifications). Package styles for this device include 5 Pin Hybrid Package with surface mount, solder
dip option available. These packages have a shield effect to cut off ambient light as they are designed for high density
mounting applications.
Therefore absolute maximum ratings, recommended operating conditions, electrical specifications and performance
characteristics are identical for all units. Any exceptions, due to packaging variations and limitations, are as noted.
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Standards
The following specifications have been included in the manufacturing of this product:
Military Compliance Specifications
MIL-PRF-19500 – General Specification for Discrete Semiconductor Devices
IECQ – M1077
Military Compliance Standards
MIL-STD-202 – Test Method Standard Electronic and Electrical Component Parts
MIL-STD-883 – Test Method Standard Microcircuits
MIL-STD-750 – Test Methods for Semiconductor Devices
ISO 9001:2008 – Manufacturing of Optocouplers and Optoelectronic components.
Single Channel Schematic
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Selection Guide Package Styles and Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Isocom Part Number and Options
Commercial
Defense Screen Level
Space Screen Level
Standard Gold Plate Finish
Solder Dipped
5 pin
Hybrid
1
CH390
CH390/L2
CH390/L2S
Gold Plate
Option 20
Functional Diagrams
CH390
10 pin Hybrid
1 Channel
Device Marking
ISOCOM
XXXXXXX
XXXX
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Manufacturer
Isocom Part Number
Date Code (XX year XX week)
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Outline Drawings
Absolute Maximum Ratings
TA = 25°C U.O.S.
Storage Temperature
Operating Temperature
Lead Soldering Temperature
Input-to-Output Isolation Voltage
-65°C to +150°C
-55°C to +125°C
260°C 1.6mm from case for 10S
1000VDC
Input Diode
Peak Forward Current
Average Forward Current
Reverse Voltage
20mA
10mA
5V
≤ 1 mS duration, 500pps
Output Transistor
Supply Voltage
Average Current
Power Dissipation
0.5V to 20V
40mA
50mW
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Electrical Characteristics
TA = 25°C U.O.S.
Parameter
Symbol
Current Transfer Ratio
(see notes 4&5)
CTR
Logic low output voltage
(see note 4)
Logic high output current
Logic high supply current
Logic low supply current
(see note 4)
Input forward voltage (see
note 4)
Input-Output Insulation
Leakage Current (see note
7 & 13)
Input reverse breakdown
(see note 4)
Propagation Delay
H-L (see note 4)
Propagation Delay
L-H (see note 4)
Common Mode Transient
Immunity at Logic High
Output (see note 4, 10 &12)
Common Mode Transient
Immunity at Logic Low
Output (see note 4, 10 &12)
Test Conditions
Vcc =4.5V, Vo=0.4V, IF = 0.5mA
Type
Vcc =4.5V, Vo=0.4V, IF = 1.6mA
300
200
700
1000
IoH
ICCH
ICCL
Vcc =5V, Vo=0.4V, IF = 5mA
Vcc =4.5V, IF = 0.5mA, IoL=1.5mA
Vcc =4.5V, IF = 5mA, IoL=10mA
IF = 2µA, Vo= Vcc=5.5V
IF = 0, Vcc=18V
Vcc=18V, IF = 1.6mA
200
-
VF
IF = 1.6mA
II-O
Max
Units
-
%
-
%
600
0.1
0.12
0.001
0.1
1.4
0.4
0.4
250
40
4
%
V
V
µA
µA
mA
-
1.45
1.9
V
RH=45%, t=5S,
VI-O= 1500vdc
-
-
1.0
µA
VBR
IR = 10µA
5
-
-
V
tPHL
RL = 4.7KΩ, Vcc = 5V,IF =0.5mA
RL = 680Ω, Vcc = 5V,IF = 5mA
RL = 4.7KΩ, Vcc = 5V,IF =0.5mA
RL = 680Ω, Vcc = 5V,IF = 5mA
Vcc =5V, IF = 0mA,
Vcm =50Vp-p, RL = 2.2KΩ
500
35
3
8
-1000
100
12
60
60
-
µS
µS
µS
µS
V/µS
Vcc =5V, IF = 1.6mA,
Vcm =50Vp-p, RL = 2.2KΩ
-500
-1000
-
V/µS
VOL
tPLH
CMH
CML
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Min
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Typical Characteristics
TA = 25°C
Parameter
Resistance
Capacitance
Input Capacitance
Temperature Coefficient
of Forward Voltage
Input-Input Insulation
Leakage Current
Resistance
Capacitance
Symbol
RIO
CIO
CIN
VF
TA
II-I
RI-I
CI-I
Test Conditions
V10 = 500Vdc
f = 1MHz
f = 1MHz, VF = 0
IF = 1.6mA
Notes
4&8
4&8
4
1
Min
-
Type
1012
1.5
60
-1.8
Max
-
45% Relative Humidity
VII = 500Vdc, t = 5S
VII = 500Vdc
f = 1MHz
9
-
0.6
-
Units
Ω
pF
pF
mV/°
C
nA
9
9
-
1012
1
-
Ω
pF
Notes:
1. The ground pin should be the most negative voltage at the detector side. Keeping VCC as low as possible, but greater
than 2.0V, will provide lowest total IOH over temperature.
2. Output power is collector output plus one fourth of total supply power. Derate at 1.66mW/°C above 110°C.
3. Derate IF at 0.33mA/°C above 110°C.
4. Each channel.
5. Current Transfer Ratio is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times
100%.
6. IOHX is the leakage current resulting from channel to channel optical crosstalk. IF = 2µA for channel under test. For all
other channels, IF = 10mA.
7. Input pins are shorted together, and output pins are shorted together.
8. Measured between the LED anode and cathode shorted together and pins at output shorted together.
9. Measured between adjacent input pairs shorted together.
10. CMH is the maximum tolerable common mode transient to assure that the output will remain in a high logic state (i.e.,
VO > 2.0V).
11. CML is the maximum tolerable common mode transient to assure that the output will remain in the logic low state (i.e.,
VO< 0.8V).
12. In applications where dV/dt may exceed 50,000V/µS (such as a static discharge), a series resistor, RCC, should be
included to protect the detector IC’s from destructively high surge currents. The recommended value is
RCC =
1V
kΩ
0.6IF(mA)
13. This is a momentary withstand test, not an operating condition.
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Electrical Characteristics
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GROUP TESTING to MIL-STD 750
GROUP
Group A
SG1
SG2
SG3
SG4
Group B
SG 1
SG 2
SG 3
TEST
MIL-STD-750
Visual inspection & mechanical
dimensions
DC static test at 25°C
DC static test at 125°C and ‐55°C
Dynamic test at 25°C
Method 2071
Physical dimensions
Solderability
Resistance to solvents
Thermal Shock
Electrical measurement
Bond strength
Acc. steady‐state operation life
Method 2066
Method 2026
Method 1022
Method 1056 Cond. B,
25 cycles
Method 1051, 100
cycles, -55/+125°C
Method 1071, Cond. H
(fine), Cond. C (gross)
pre and post
2075
Method 2037, Cond. D
Method 2017
Method 1037, 1042,
Cond D, Tab.5-5
Method 1071, Cond. H
(fine), Cond. C (gross)
pre and post
Method 2037, Cond. D
Method 1027
Electrical measurement
Bond strength
pre and post
Method 2037, Cond. D
Thermal Shock
Method 1056, Cond. B,
25 shocks
Method 1051, Cond. C,
‐55/+125°C , 25 cycles
(total 45 cycles
including screening)
Method 1071, Cond. H
(fine), Cond. C (gross)
Method 1021
pre and post
Method 2016,
non‐operating, 1500 G,
0.5 ms, 5 blows in each
orientation (X1,Y1,Z1)
Method 2056
Method 2006, at a peak
level of 5000 G
pre and post
Temperature cycling
Hermetic seal fine and gross leak
SG 4
Electrical measurement
Decap internal visual inspection
Bond strength
Die shear
Intermittent operation life
Hermetic seal fine and gross leak
SG 5
Group C
SG 2
Temperature cycling
Hermetic seal fine and gross leak
SG 3
Moisture resistance
Electrical measurement
Mechanical shock
Vibration
Constant acceleration
SG 6
Electrical measurement
Steady state operating life Not
required as B5 is available on same
lot
yes
yes
yes
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READ AND
RECORD
yes
yes
yes
yes
yes
yes
yes
yes
yes
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100% SCREENING to MIL-STD 750
TEST
MIL-STD-750
Internal Visual
2072
READ AND RECORD?
Sealing
(Fine Leak)
(Gross Leak)
Temp Cycling
Const. Acceler
PIND
Radiography
Initial Electrical
HTRB
Interim Electrical
Burn-In
Final Electrical
PDA
(Fine Leak)
(Gross Leak)
1071, Condition H1
1071, Condition C
1051, Condition
B‐55/+125°C, 20 Cycles.
2006, 5000G, Y1 only.
2052, Condition A
2076
125°C, ‐55°C, 25°C
1039
25°C only
1039
125°C, ‐55°C, 25°C
Max. 5%, pre/post B1
electrical and delta at RT
only
1071, Condition H1
1071, Condition C
Solder Dip
Fine Leak
Gross Leak
1071, Condition H1
1071, Condition C
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R&R
R&R
R&R
Calculate & R
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