7545B - DAC, 12 Bit, Buffered Multiplying

7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
R FB
R
OUT1
12-BIT MULTIPYING
DAC
V REF
AGND
12
7545B
WR
CS
INPUT DATA LATCHES
V DD
DGND
12
DB11-DBO
Memory
BLOCK DIAGRAM
FEATURES:
DESCRIPTION:
• RAD-PAK® patented shielding against natural space radiation
• Total dose hardness:
- > 50 krad (Si), depending upon space mission
• Excellent single event effects
- SELTH: > 120 MeV/mg/cm2
- SEUTH: > 120 MeV/mg/cm2
• Package:
- 20 pin RAD-PAK® Flat Pack
- 20 pin RAD-PAK® DIP
• Low gain temperature coefficient:
- 5 ppm/°C typ.
• Fast interface timing
• Single +5 V to +15 V supply
Maxwell Technologies’ 7545B is a 12-bit CMOS-buffered multiplying DAC with internal data latches, which features a
greater than 50 krad (Si) total dose tolerance, depending upon
space mission. The 7545B features a WR pulse width of 100
ns which allows interfacing to a much wider range of fast 8-bit
and 16-bit microprocessors. It is loaded by a single 12-bit wide
word under the control of the CS and WR inputs; tying these
control inputs low makes the input latches transparent allowing unbuffered operation of the DAC. The 7545B is particularly
suitable for single supply operations and applications with
wide temperature variations.
Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, RAD-PAK® provides greater than 50
krad (Si) radiation dose tolerance. This product is available
with screening up to Class S.
08.01.14 Rev 2
(858) 503-3300- Fax: (858) 503-3301- www.maxwell.com
All data sheets are subject to change without notice
1
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
TABLE 1. 7545B PINOUT DESCRIPTION
SYMBOL
DESCRIPTION
1
OUT 1
Output Current
2
AGND
Analog Ground
3
DGND
Digital Ground
4
DB 11
Data Bit 11 (MSB)
5
DB 10
Data Bit 10
6
DB 9
Data Bit 9
7
DB 8
Data Bit 8
8
DB 7
Data Bit 7
9
DB 6
Data Bit 6
10
DB 5
Data Bit 5
11
DB 4
Data Bit 4
12
DB 3
Data Bit 3
13
DB 2
Data Bit 2
14
DB 1
Data Bit 1
15
DB 0
Data Bit 0 (LSB)
16
CS
Chip Select (Active Low)
17
WR
Write (Active Low)
18
VDD
Digital Supply Voltage
19
VREF
Reference Input
20
RFB
Feedback Resistance
Memory
PIN
TABLE 2. 7545B ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
MIN
MAX
UNIT
VDD to DGND
--
-0.3
17
V
Digital Input Voltage to DGND
--
-0.3
VDD + 0.3
V
VRFB, VREF to DGND
--
--
25
V
VPIN1 to DGND
--
-0.3
VDD + 0.3
V
--
-0.3
VDD + 0.3
V
PD
--
450
mW
2.75
grams
AGND to DGND
Power Dissipation to 75
°C
Weight
Mass
Thermal Impedance — Flat Package
JC
JC
--
6.08
°C/W
--
6.04
°C/W
Operating Temperature
--
-55
125
°C
Storage Temperature Range
TS
-65
150
°C
Thermal Impedance — DIP Package
08.01.14 Rev 2
All data sheets are subject to change without notice
2
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
TABLE 3. DELTA LIMITS
PARAMETER
VARIATION
IDD
±10%
TABLE 4. 7545B SPECIFICATIONS
(VDD = +5 V ±10%, TA = -55 TO 125 °C UNLESS OTHERWISE NOTED)
TEST
SYMBOL TEST CONDITION
SUBGROUPS
MIN
MAX
UNIT
1, 2, 3
12
--
Bits
RES
Relative Accuracy
RA
VDD = 5V
1, 2, 3
-1/2
1/2
LSB
Differential Nonlinearity
DNL
12-Bit Monotonic TMIN to TMAX
VDD = 5V
1, 2, 3
-1
1
LSB
DAC Register Loaded with 1111
1111 1111; VDD = 5V
1, 2, 3
-4
4
LSB
1, 2, 3
-5
5
ppm/°C
VDD = +/-5%
1, 2, 3
-0.004
0.004
%/%
To 1/2LSB; OUT1 Load = 100,
DAC Output Measured from Falling Edge of WR. CS = 0V
1, 2, 3
--
2
µs
AE
Gain Error1
Gain Temperature Coefficient2
TCAE
Power Supply Rejection
PSRR
Output Current Settling Time2
tSL
Feed through Error
FT
1, 2, 3
Reference Input Resistance
(Pin 19 to Ground)
RIN
1, 2, 3
10
25
K
Digital Input High Voltage4
VIH
1, 2, 3
2.4
--
V
Digital Input Low Voltage4
VIL
1, 2, 3
--
0.8
V
Digital Input Leakage Current
IIN
VIN = 0 V or VDD
1, 2, 3
-10
10
µA
Digital Input Capacitance2
CIN
DB0 - DB11; WR, CS
1, 2, 3
--
20
pF
DB0 - DB11 = 0 V, WR, CS = 0V
1, 2, 3
--
70
pF
DB0 - DB11 = VDD, WR, CS = 0V
1, 2, 3
--
200
9, 10, 11
380
--
Output Capacitance2
COUT1
5 (typical)
mV p-p
Chip Select to Write Setup
Time3
tCS
Chip Select to Write Hold Time3
tCH
9, 10, 11
0
--
Write Pulse Width3
tWR
9, 10, 11
400
--
Data Setup Time3
tDS
9, 10, 11
210
--
Data Hold Time3
tDH
9, 10, 11
10
--
Supply Current from VDD
IDD
All Digital Inputs VIL or VIH
1, 2, 3
--
2
mA
All Digital Inputs 0 or VDD
1, 2, 3
--
100
µA
tCS > tWR, tCH > 0
Memory
Resolution
nS
1)Measured using feedback resistor
2) Guaranteed by design
3) Not Tested
4)Tested by application of signal
08.01.14 Rev 2
All data sheets are subject to change without notice
3
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
TABLE 5. 7545B SPECIFICATIONS
(VDD = +15 V ±10%, TA = -55 TO 125 °C UNLESS OTHERWISE NOTED)
TEST
SYMBOL
TEST CONDITION
Subgroups
MIN
MAX
UNIT
Relative Accuracy
RA
VDD = 15V
1, 2, 3
-1/2
1/2
LSB
Differential Nonlinearity
DNL
12-Bit Monotonic TMIN to TMAX
VDD = 15V
1, 2, 3
-1
1
LSB
DAC Register Loaded with 1111
1111 1111
VDD = 15V
1, 2, 3
-4
4
LSB
1, 2, 3
-5
5
ppm/°C
VDD = 5%
1, 2, 3
-0.004
0.004
%/%
To 1/2LSB; OUT1 Load = 100,
DAC Output Measured from Falling Edge of WR. CS = 0V
1, 2, 3
--
2
µs
AE
Gain Error1
Gain Temperature Coefficient2
TCAE
Power Supply Rejection
PSRR
Output Current Settling Time2
tSL
Feed through Error
FT
1, 2, 3
Reference Input Resistance
(Pin 19 to Ground)
RIN
1, 2, 3
10
25
K
Digital Input High Voltage4
VIH
1, 2, 3
13.5
--
V
Digital Input Low Voltage4
VIL
1, 2, 3
--
1.5
V
Digital Input Leakage Current
IIN
VIN = 0 V or VDD
1, 2, 3
-10
10
µA
Digital Input Capacitance2
CIN
DB0 - DB11; WR, CS
1, 2, 3
--
15
pF
DB0 - DB11 = 0 V, WR, CS = 0V
1, 2, 3
--
70
pF
DB0 - DB11 = VDD, WR, CS = 0V
1, 2, 3
--
150
9, 10, 11
95
--
COUT1
mV p-p
Chip Select to Write Setup
Time3
tCS
Chip Select to Write Hold Time3
tCH
9, 10, 11
0
--
Write Pulse Width3
tWR
9, 10, 11
95
--
Data Setup Time3
tDS
9, 10, 11
80
--
Data Hold Time3
tDH
9, 10, 11
5
--
Supply Current from VDD
IDD
All Digital Inputs VIL or VIH
1, 2, 3
--
2
mA
All Digital Inputs 0 or VDD
1, 2, 3
--
100
µA
tCS > tWR, tCH > 0
Memory
Output Capacitance2
5 (typical)
nS
1) Measured using feedback resistor
2) Guaranteed by design
3) Not tested
4)Tested by application of signal
08.01.14 Rev 2
All data sheets are subject to change without notice
4
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
FIGURE 1. WRITE CYCLE TIMING DIAGRAM
FIGURE 2. MODE SELECTION TABLE
Memory
MODE SELECTION
WRITE MODE:
CS and WR low, DAC responds to data
bus (DB0 - DB11) inputs
HOLD MODE:
Either CS or WR high, data bus (DB0 DB11) is locked out; DAC holds last data
present when WR or CS assumed high
state.
08.01.14 Rev 2
All data sheets are subject to change without notice
5
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
Memory
20 PIN RAD-PAK® DUAL IN LINE PACKAGE
DIMENSION
SYMBOL
MIN
NOM
MAX
A
--
0.202
0.230
b
0.014
0.018
0.026
b2
0.045
0.050
0.065
c
0.008
0.010
0.018
D
--
1.000
1.060
E
0.220
0.290
0.310
eA
0.300 BSC
eA/2
0.150 BSC
e
0.100 BSC
L
0.125
0.145
0.155
Q
0.015
0.045
0.070
S1
0.005
0.025
--
S2
0.005
--
--
N
20
Note: All dimensions in inches
08.01.14 Rev 2
All data sheets are subject to change without notice
6
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
Memory
20 PIN RAD-PAK® FLAT PACKAGE
DIMENSION
SYMBOL
MIN
NOM
MAX
A
0.128
0.141
0.154
b
0.015
0.017
0.022
c
0.003
0.005
0.009
D
0.472
0.480
0.488
E
0.287
0.295
0.303
E1
--
--
0.333
E2
0.155
0.160
--
E3
0.030
0.068
--
e
0.050 BSC
L
0.370
0.380
0.390
Q
0.026
0.034
0.045
S1
0.005
0.007
--
N
20
Note: All dimensions in inches
08.01.14 Rev 2
All data sheets are subject to change without notice
7
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
Important Notice:
These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies
functionality by testing key parameters either by 100% testing, sample testing or characterization.
The specifications presented within these data sheets represent the latest and most accurate information available to
date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no
responsibility for the use of this information.
Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems
without express written approval from Maxwell Technologies.
Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts.
Memory
08.01.14 Rev 2
All data sheets are subject to change without notice
8
©2014 Maxwell Technologies
All rights reserved.
7545B
12-Bit Buffered Multiplying
Digital to Analog Converter
Product Ordering Options
Model Number
7545B
RP
F
X
Option Details
Feature
S = Maxwell Class S
B = Maxwell Class B
I = Industrial (testing @ -55°C,
+25°C, +125°C)
E = Engineering (testing @ +25°C)
Package
D = Dual In-line Package (DIP)
F = Flat Pack
Radiation Feature
RP = RAD-PAK® package
Base Product
Nomenclature
12-Bit Buffered Multiplying Digital
to Analog Converter
Memory
Screening Flow
08.01.14 Rev 2
All data sheets are subject to change without notice
9
©2014 Maxwell Technologies
All rights reserved.
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