7545B 12-Bit Buffered Multiplying Digital to Analog Converter R FB R OUT1 12-BIT MULTIPYING DAC V REF AGND 12 7545B WR CS INPUT DATA LATCHES V DD DGND 12 DB11-DBO Memory BLOCK DIAGRAM FEATURES: DESCRIPTION: • RAD-PAK® patented shielding against natural space radiation • Total dose hardness: - > 50 krad (Si), depending upon space mission • Excellent single event effects - SELTH: > 120 MeV/mg/cm2 - SEUTH: > 120 MeV/mg/cm2 • Package: - 20 pin RAD-PAK® Flat Pack - 20 pin RAD-PAK® DIP • Low gain temperature coefficient: - 5 ppm/°C typ. • Fast interface timing • Single +5 V to +15 V supply Maxwell Technologies’ 7545B is a 12-bit CMOS-buffered multiplying DAC with internal data latches, which features a greater than 50 krad (Si) total dose tolerance, depending upon space mission. The 7545B features a WR pulse width of 100 ns which allows interfacing to a much wider range of fast 8-bit and 16-bit microprocessors. It is loaded by a single 12-bit wide word under the control of the CS and WR inputs; tying these control inputs low makes the input latches transparent allowing unbuffered operation of the DAC. The 7545B is particularly suitable for single supply operations and applications with wide temperature variations. Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit or space mission. In a GEO orbit, RAD-PAK® provides greater than 50 krad (Si) radiation dose tolerance. This product is available with screening up to Class S. 08.01.14 Rev 2 (858) 503-3300- Fax: (858) 503-3301- www.maxwell.com All data sheets are subject to change without notice 1 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter TABLE 1. 7545B PINOUT DESCRIPTION SYMBOL DESCRIPTION 1 OUT 1 Output Current 2 AGND Analog Ground 3 DGND Digital Ground 4 DB 11 Data Bit 11 (MSB) 5 DB 10 Data Bit 10 6 DB 9 Data Bit 9 7 DB 8 Data Bit 8 8 DB 7 Data Bit 7 9 DB 6 Data Bit 6 10 DB 5 Data Bit 5 11 DB 4 Data Bit 4 12 DB 3 Data Bit 3 13 DB 2 Data Bit 2 14 DB 1 Data Bit 1 15 DB 0 Data Bit 0 (LSB) 16 CS Chip Select (Active Low) 17 WR Write (Active Low) 18 VDD Digital Supply Voltage 19 VREF Reference Input 20 RFB Feedback Resistance Memory PIN TABLE 2. 7545B ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL MIN MAX UNIT VDD to DGND -- -0.3 17 V Digital Input Voltage to DGND -- -0.3 VDD + 0.3 V VRFB, VREF to DGND -- -- 25 V VPIN1 to DGND -- -0.3 VDD + 0.3 V -- -0.3 VDD + 0.3 V PD -- 450 mW 2.75 grams AGND to DGND Power Dissipation to 75 °C Weight Mass Thermal Impedance — Flat Package JC JC -- 6.08 °C/W -- 6.04 °C/W Operating Temperature -- -55 125 °C Storage Temperature Range TS -65 150 °C Thermal Impedance — DIP Package 08.01.14 Rev 2 All data sheets are subject to change without notice 2 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter TABLE 3. DELTA LIMITS PARAMETER VARIATION IDD ±10% TABLE 4. 7545B SPECIFICATIONS (VDD = +5 V ±10%, TA = -55 TO 125 °C UNLESS OTHERWISE NOTED) TEST SYMBOL TEST CONDITION SUBGROUPS MIN MAX UNIT 1, 2, 3 12 -- Bits RES Relative Accuracy RA VDD = 5V 1, 2, 3 -1/2 1/2 LSB Differential Nonlinearity DNL 12-Bit Monotonic TMIN to TMAX VDD = 5V 1, 2, 3 -1 1 LSB DAC Register Loaded with 1111 1111 1111; VDD = 5V 1, 2, 3 -4 4 LSB 1, 2, 3 -5 5 ppm/°C VDD = +/-5% 1, 2, 3 -0.004 0.004 %/% To 1/2LSB; OUT1 Load = 100, DAC Output Measured from Falling Edge of WR. CS = 0V 1, 2, 3 -- 2 µs AE Gain Error1 Gain Temperature Coefficient2 TCAE Power Supply Rejection PSRR Output Current Settling Time2 tSL Feed through Error FT 1, 2, 3 Reference Input Resistance (Pin 19 to Ground) RIN 1, 2, 3 10 25 K Digital Input High Voltage4 VIH 1, 2, 3 2.4 -- V Digital Input Low Voltage4 VIL 1, 2, 3 -- 0.8 V Digital Input Leakage Current IIN VIN = 0 V or VDD 1, 2, 3 -10 10 µA Digital Input Capacitance2 CIN DB0 - DB11; WR, CS 1, 2, 3 -- 20 pF DB0 - DB11 = 0 V, WR, CS = 0V 1, 2, 3 -- 70 pF DB0 - DB11 = VDD, WR, CS = 0V 1, 2, 3 -- 200 9, 10, 11 380 -- Output Capacitance2 COUT1 5 (typical) mV p-p Chip Select to Write Setup Time3 tCS Chip Select to Write Hold Time3 tCH 9, 10, 11 0 -- Write Pulse Width3 tWR 9, 10, 11 400 -- Data Setup Time3 tDS 9, 10, 11 210 -- Data Hold Time3 tDH 9, 10, 11 10 -- Supply Current from VDD IDD All Digital Inputs VIL or VIH 1, 2, 3 -- 2 mA All Digital Inputs 0 or VDD 1, 2, 3 -- 100 µA tCS > tWR, tCH > 0 Memory Resolution nS 1)Measured using feedback resistor 2) Guaranteed by design 3) Not Tested 4)Tested by application of signal 08.01.14 Rev 2 All data sheets are subject to change without notice 3 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter TABLE 5. 7545B SPECIFICATIONS (VDD = +15 V ±10%, TA = -55 TO 125 °C UNLESS OTHERWISE NOTED) TEST SYMBOL TEST CONDITION Subgroups MIN MAX UNIT Relative Accuracy RA VDD = 15V 1, 2, 3 -1/2 1/2 LSB Differential Nonlinearity DNL 12-Bit Monotonic TMIN to TMAX VDD = 15V 1, 2, 3 -1 1 LSB DAC Register Loaded with 1111 1111 1111 VDD = 15V 1, 2, 3 -4 4 LSB 1, 2, 3 -5 5 ppm/°C VDD = 5% 1, 2, 3 -0.004 0.004 %/% To 1/2LSB; OUT1 Load = 100, DAC Output Measured from Falling Edge of WR. CS = 0V 1, 2, 3 -- 2 µs AE Gain Error1 Gain Temperature Coefficient2 TCAE Power Supply Rejection PSRR Output Current Settling Time2 tSL Feed through Error FT 1, 2, 3 Reference Input Resistance (Pin 19 to Ground) RIN 1, 2, 3 10 25 K Digital Input High Voltage4 VIH 1, 2, 3 13.5 -- V Digital Input Low Voltage4 VIL 1, 2, 3 -- 1.5 V Digital Input Leakage Current IIN VIN = 0 V or VDD 1, 2, 3 -10 10 µA Digital Input Capacitance2 CIN DB0 - DB11; WR, CS 1, 2, 3 -- 15 pF DB0 - DB11 = 0 V, WR, CS = 0V 1, 2, 3 -- 70 pF DB0 - DB11 = VDD, WR, CS = 0V 1, 2, 3 -- 150 9, 10, 11 95 -- COUT1 mV p-p Chip Select to Write Setup Time3 tCS Chip Select to Write Hold Time3 tCH 9, 10, 11 0 -- Write Pulse Width3 tWR 9, 10, 11 95 -- Data Setup Time3 tDS 9, 10, 11 80 -- Data Hold Time3 tDH 9, 10, 11 5 -- Supply Current from VDD IDD All Digital Inputs VIL or VIH 1, 2, 3 -- 2 mA All Digital Inputs 0 or VDD 1, 2, 3 -- 100 µA tCS > tWR, tCH > 0 Memory Output Capacitance2 5 (typical) nS 1) Measured using feedback resistor 2) Guaranteed by design 3) Not tested 4)Tested by application of signal 08.01.14 Rev 2 All data sheets are subject to change without notice 4 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter FIGURE 1. WRITE CYCLE TIMING DIAGRAM FIGURE 2. MODE SELECTION TABLE Memory MODE SELECTION WRITE MODE: CS and WR low, DAC responds to data bus (DB0 - DB11) inputs HOLD MODE: Either CS or WR high, data bus (DB0 DB11) is locked out; DAC holds last data present when WR or CS assumed high state. 08.01.14 Rev 2 All data sheets are subject to change without notice 5 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter Memory 20 PIN RAD-PAK® DUAL IN LINE PACKAGE DIMENSION SYMBOL MIN NOM MAX A -- 0.202 0.230 b 0.014 0.018 0.026 b2 0.045 0.050 0.065 c 0.008 0.010 0.018 D -- 1.000 1.060 E 0.220 0.290 0.310 eA 0.300 BSC eA/2 0.150 BSC e 0.100 BSC L 0.125 0.145 0.155 Q 0.015 0.045 0.070 S1 0.005 0.025 -- S2 0.005 -- -- N 20 Note: All dimensions in inches 08.01.14 Rev 2 All data sheets are subject to change without notice 6 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter Memory 20 PIN RAD-PAK® FLAT PACKAGE DIMENSION SYMBOL MIN NOM MAX A 0.128 0.141 0.154 b 0.015 0.017 0.022 c 0.003 0.005 0.009 D 0.472 0.480 0.488 E 0.287 0.295 0.303 E1 -- -- 0.333 E2 0.155 0.160 -- E3 0.030 0.068 -- e 0.050 BSC L 0.370 0.380 0.390 Q 0.026 0.034 0.045 S1 0.005 0.007 -- N 20 Note: All dimensions in inches 08.01.14 Rev 2 All data sheets are subject to change without notice 7 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter Important Notice: These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts. Memory 08.01.14 Rev 2 All data sheets are subject to change without notice 8 ©2014 Maxwell Technologies All rights reserved. 7545B 12-Bit Buffered Multiplying Digital to Analog Converter Product Ordering Options Model Number 7545B RP F X Option Details Feature S = Maxwell Class S B = Maxwell Class B I = Industrial (testing @ -55°C, +25°C, +125°C) E = Engineering (testing @ +25°C) Package D = Dual In-line Package (DIP) F = Flat Pack Radiation Feature RP = RAD-PAK® package Base Product Nomenclature 12-Bit Buffered Multiplying Digital to Analog Converter Memory Screening Flow 08.01.14 Rev 2 All data sheets are subject to change without notice 9 ©2014 Maxwell Technologies All rights reserved.