33C108 - 5.0V SRAM, 1Mb (128kb x 8) - Obsolete

33C108
1 Megabit (128K x 8-Bit)
CMOS SRAM
33C108
Memory
Logic Diagram
FEATURES:
DESCRIPTION:
• RAD-PAK® Technology radiation-hardened against natural
space radiation
• 128K x 8 bit organization
· Total dose hardness:
- > 100 krad (Si), depending upon space mission
• Excellent Single Event Effect
· - SELTH: > 101 MeV/mg/cm2
Maxwell Technologies’ 33C108 high-density 1Megabit SRAM
microcircuit features a greater than 100 krad (Si) total dose
tolerance, depending upon space mission. Using Maxwell’s
radiation-hardened RAD-PAK® packaging technology, the
33C108 realizes a high density, high performance, and low
power consumption. Its fully static design eliminates the need
for external clocks, while the CMOS circuitry reduces power
consumption and provides higher reliability. The 33C108 is
equipped with eight common input/output lines, chip select
and output enable, allowing for greater system flexibility and
eliminating bus contention. The 33C108 features the same
advanced 128K x 8-bit SRAM, high-speed, and low-power
demand as the commercial counterpart.
· - SEUTH: = 3 MeV/mg/cm2
•
•
•
•
•
•
•
- SEU saturated cross section: 6E-9 cm2/bit
Package:
- 32-Pin RAD-PAK® flat pack
Fast access time:
- 20, 25, 30 ns maximum times available
Single 5.0V + 10% power supply
Fully static operation
- No clock or refresh required
Three state outputs
TTL compatible inputs and outputs
Low power:
- Standby: 60 mA (TTL); 10 mA (CMOS)
- Operation: 180 mA (20 ns); 170 mA (25 ns);
160 mA (30 ns)
Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, RAD-PAK® provides greater than 100
krad (Si) radiation dose tolerance. This product is available
with screening up to Class S.
03.28.08 Rev 3
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com
All data sheets are subject to change without notice
1
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
TABLE 1. PINOUT DESCRIPTION
PIN
SYMBOL
DESCRIPTION
12-5, 27, 26, 23, 25, 4,
28, 3, 31, 2
A0-A16
29
WE
Write Enable
22
CS
Chip Select
24
OE
Output Enable
13-15, 17-21
I/O 1-I/O 8
32
VCC
Supply Voltage
16
VSS
Ground
1, 30
NC
No Connection
Address Inputs
Data Inputs/Outputs
PARAMETER
SYMBOL
MIN
MAX
UNIT
VCC
-0.5
7.0
V
VIN, VOUT
-0.5
VCC +0.5
V
Power Dissipation
PD
--
1.0
W
Storage Temperature
TS
-65
+150
°C
Operating Temperature
TA
-55
+125
°C
Voltage on VCC supply relative to VSS
Voltage on any pin relative to VSS
Memory
TABLE 2. 33C108 ABSOLUTE MAXIMUM RATINGS
TABLE 3. DELTA LIMITS
PARAMETER
VARIATION
ICC
±10% of stated vaule in Table 6
ISB
±10% of stated vaule in Table 6
ISB1
±10% of stated vaule in Table 6
03.28.08 Rev 3
All data sheets are subject to change without notice
2
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
TABLE 4. 33C108 RECOMMENDED OPERATING CONDITIONS
(VCC = 5.0+ 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE NOTED)
PARAMETER
Supply Voltage
Ground
SYMBOL
MIN
MAX
UNIT
VCC
4.5
5.5
V
VSS
0
0
V
Input High Voltage
1
VIH
2.2
VCC+0.3
V
Input Low Voltage
2
VIL
-0.3
0.8
V
--
6.04
°C/W
SYMBOL
TEST
CONDITIONS
MAX
UNITS
CIN
VIN = 0 V
ΘJC
Thermal Impedance
1. VIH (max) = VCC +2.0V ac (pulse width < 10 ns) for I < 20 mA
2. VIL (min) = -2.0V ac(pulse width < 10 ns) for I < 20 mA
TABLE 5. 33C1408 CAPACITANCE
PARAMETER
Input Capacitance1
CS, OE, WE
A0 - A16
Memory
(f = 1.0 MHZ, VCC = 5.0 V, TA = 25 °C)
pF
7
7
Input / Output Capacitance1
COUT
VI/O = 0 V
8
pF
1. Guaranteed by design.
TABLE 6. 33C108 DC ELECTRICAL CHARACTERISTICS
(VCC = 5.0V + 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE SPECIFIED)
PARAMETER
SYMBOL CONDITION
SUBGROUPS
MIN
MAX
UNIT
Input Leakage Current
ILI
VIN = VSS to VCC
1, 2, 3
-2
2
µA
Output Leakage Current
ILO
CS=VIH or OE=VIH or WE=VIL,
VOUT =VSS to VCC
1, 2, 3
-2
2
µA
Output Low Voltage
VOL
IOL = 8mA
1, 2, 3
--
0.4
V
Output High Voltage
VOH
IOH = -4mA
1, 2, 3
2.4
--
V
Operating Current
-20
-25
-30
ICC
Min cycle, 100% Duty, CS=VIL, IOUT=0mA,
VIN = VIH or VIL
1, 2, 3
----
180
170
160
Standby Power Supply
Current
ISB
CS = VIH, Min Cycle
1, 2, 3
--
60
mA
Standby Power Supply
Current - CMOS
ISB1
CS > VCC - 0.2V; VIN > VCC - 0.2V
or VIN < 0.2V
1, 2, 3
--
10
mA
03.28.08 Rev 3
mA
All data sheets are subject to change without notice
3
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
TABLE 7. 33C108 AC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0+ 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE NOTED)
PARAMETER
MIN
TYP
MAX
UNITS
Input Pulse Level
0.0
--
3.0
V
Output Timing Measurement Reference Level
--
--
1.5
V
Input Rise/Fall Time
--
--
3.0
ns
Input Timing Measurement Reference Level
--
--
1.5
V
UNIT
TABLE 8. 33C108 AC CHARACTERISTICS FOR READ CYCLE
(VCC = 5.0V + 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE SPECIFIED)
PARAMETER
SUBGROUPS
Read Cycle Time
-20
-25
-30
tRC
9, 10, 11
Address Access Time
-20
-25
-30
tAA
Chip Select Access Time
-20
-25
-30
tCO
Output Enable to Output Valid
-20
-25
-30
tOE
Chip Enable to Output in Low-Z
-20
-25
-30
tLZ
Output Enable to Output in Low-Z
-20
-25
-30
tOLZ
Chip Deselect to Output in High-Z
-20
-25
-30
tHZ
Output Disable to Output in High-Z
-20
-25
-30
tOHZ
MIN
TYP
MAX
20
25
30
----
----
----
----
20
25
30
----
----
20
25
30
----
----
10
12
14
----
3
3
3
----
----
0
0
0
----
----
5
6
8
----
----
5
6
8
----
ns
9, 10, 11
Memory
SYMBOL
ns
9, 10, 11
ns
9, 10, 11
9, 10, 11
ns
9, 10, 11
ns
9, 10, 11
ns
9, 10, 11
03.28.08 Rev 3
ns
ns
All data sheets are subject to change without notice
4
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
TABLE 8. 33C108 AC CHARACTERISTICS FOR READ CYCLE
(VCC = 5.0V + 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE SPECIFIED)
PARAMETER
SYMBOL
SUBGROUPS
Output Hold from Address Change
-20
-25
-30
tOH
9, 10, 11
Chip Select to Power Up Time
-20
-25
-30
tPU
Chip Select to Power Down Time
-20
-25
-30
tPD
MIN
TYP
MAX
3
5
6
----
----
----
0
0
0
----
----
10
15
20
----
UNIT
ns
9, 10, 11
ns
9, 10, 11
ns
Memory
TABLE 9. 33C108 FUNCTIONAL DESCRIPTION
CS
WE
OE
MODE
I/O PIN
SUPPLY CURRENT
H
X1
X1
Not Select
High-Z
ISB, ISB1
L
H
H
Output Disable
High-Z
ICC
L
H
L
Read
DOUT
ICC
L
X1
Write
DIN
ICC
L
1. X = don’t care.
TABLE 10. 33C108 AC CHARACTERISTICS FOR WRITE CYCLE
(VCC = 5.0V + 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE SPECIFIED)
PARAMETER
SYMBOL
SUBGROUPS
Write Cycle Time
-20
-25
-30
tWC
9, 10, 11
Chip Select to End of Write
-20
-25
-30
tCW
Address Setup Time
-20
-25
-30
tAS
MIN
TYP
MAX
20
25
30
----
----
14
15
17
----
----
0
0
0
----
----
ns
9, 10, 11
ns
9, 10, 11
03.28.08 Rev 3
UNIT
ns
All data sheets are subject to change without notice
5
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
TABLE 10. 33C108 AC CHARACTERISTICS FOR WRITE CYCLE
(VCC = 5.0V + 10%, TA = -55 TO +125 °C, UNLESS OTHERWISE SPECIFIED)
PARAMETER
SUBGROUPS
Address Valid to End of Write
-20
-25
-30
tAW
9, 10, 11
Write Pulse Width (OE High)
-20
-25
-30
tWP
Write Recovery Time
-20
-25
-30
tWR
Write to Output in High-Z
-20
-25
-30
tWHZ
Write Pulse Width (OE Low)
-20
-25
-30
tWP1
Data to Write Time Overlap
-20
-25
-30
tDW
End Write to Output Low-Z
-20
-25
-30
tOW
Data Hold from Write Time
-20
-25
-30
tDH
MIN
TYP
MAX
14
15
17
----
----
14
15
17
----
----
0
0
0
----
----
----
5
5
6
----
----
20
25
30
----
9
10
11
----
----
----
6
7
8
----
0
0
0
----
----
UNIT
ns
9, 10, 11
ns
9, 10, 11
ns
9, 10, 11
ns
9, 10, 11
Memory
SYMBOL
ns
9, 10, 11
ns
9, 10, 11
ns
9, 10, 11
ns
FIGURE 1: TIMING WAVEFORM OF READ CYCLE(1)
03.28.08 Rev 3
All data sheets are subject to change without notice
6
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
FIGURE 2: TIMING WAVEFORM OF READ CYCLE (2)
VOL levels.
4.
At any given temperature and voltage condition, tHZ(max) is less than tLZ(min) both for a given device and from device to device.
5.
6.
Transition is measured + 200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested.
Device is continuously selected with CS = VIL.
7. Address valid prior to coincident with CS transition low.
8. For common I/O applications, minimization or elimination of bus contention condition is necessary during read and write cycle.
FIGURE 3: TIMING WAVEFORM OF WRITE CYCLE(1)
03.28.08 Rev 3
All data sheets are subject to change without notice
7
©2008 Maxwell Technologies
All rights reserved.
Memory
Read Cycle Notes:
1. WE is high for read cycle.
2. All read cycle timing is referenced form the last valid address to the first transition address.
3. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit condition and are not referenced to VOH or
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
FIGURE 4: TIMING WAVEFORM OF WRITE CYCLE(2)
Memory
FIGURE 5: TIMING WAVEFORM OF WRITE CYCLE (3)
WRITE CYCLE NOTE:
1.
2.
All write cycle timing is referenced from the last valid address to the first transition address.
A write occurs during the overlap of a low CS and a low WE. A write begins at the latest transition among CS going low and
WE going low: A write ends at the earliest transition among CS going high and WE going high. t is measured from beginning of write to the end of write.
t is measured from the later of CS going low to end of write.
t is measured from the address valid to the beginning of write.
t is measured form the end of write to the address change. TWR applied in case a write ends as CS, or WR going high.
WP
3.
4.
5.
CW
AS
WR
03.28.08 Rev 3
All data sheets are subject to change without notice
8
©2008 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) CMOS SRAM
6.
7.
8.
9.
10.
33C108
If OE, CS and WE are in the Read Mode during this period, the I/O pins are in the output low-Z state. Inputs of opposite
phase of the output must not be applied because bus contention can occur.
For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write
cycle.
IC CS goes low simultaneously with WE going low or after WE going low, the outputs remain high impedance state.
D is the read data of the new address.
When CS is low: I/O pins are in the output state. The input signals in the opposite phase leading to the output should
not be applied.
OUT
Memory
03.28.08 Rev 3
All data sheets are subject to change without notice
9
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
Memory
32 Pin Wide Rad-Pak® Flat Package
03.28.08 Rev 3
All data sheets are subject to change without notice
10
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
Memory
32 Pin Rad-Pak® Flat Package
03.28.08 Rev 3
All data sheets are subject to change without notice
11
©2008 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) CMOS SRAM
33C108
Important Notice:
These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies
functionality by testing key parameters either by 100% testing, sample testing or characterization.
The specifications presented within these data sheets represent the latest and most accurate information available to
date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no
responsibility for the use of this information.
Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems
without express written approval from Maxwell Technologies.
Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts.
Memory
03.28.08 Rev 3
All data sheets are subject to change without notice
12
©2008 Maxwell Technologies
All rights reserved.
33C108
1 Megabit (128K x 8-Bit) CMOS SRAM
Product Ordering Options
Model Number
33C108
RP
FX
X
-XX
Option Details
Feature
20 = 20 ns
25 = 25 ns
30 = 30 ns
Screening Flow
Monolithic
S = Maxwell Class S
B = Maxwell Class B
I = Industrial (testing @ -55°C,
+25°C, +125°C)
E = Engineering (testing @ +25°C)
Package
F1 = Wide Flat Pack
F2 = Flat Pack
Radiation Feature
RP = RAD-PAK® package
Base Product
Nomenclature
1 Megabit CMOS SRAM
03.28.08 Rev 3
All data sheets are subject to change without notice
Memory
Access Time
13
©2008 Maxwell Technologies
All rights reserved.
Similar pages