Silicon Protection Arrays Bi-Directinal ESD Protection Array RoHS Pb GREEN SP1002 Lead-free/Green Series Description Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 610004-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1002-01 (SC70-3) 1 NC t -PXDBQBDJUBODFPGQ' (TYP) I/O to I/O t -PXMFBLBHFDVSSFOUPG ç"."9 BU7 t &4%QSPUFDUJPOPGL7 DPOUBDUEJTDIBSHFL7 air discharge, (Level 4, IEC61000-4-2) t 4NBMMQBDLBHFTBWFT board space t &'5QSPUFDUJPO IEC61000-4-4, 40A OT 2 Functional Block Diagram Applications SP1002-01 SP1002 Lead-free/Green Series Specifications are subject to change without notice. t $PNQVUFS1FSJQIFSBMT t -$%1%157T t .PCJMF1IPOFT t 4FU5PQ#PYFT t %JHJUBM$BNFSBT t %7%1MBZFST t %FTLUPQT/PUFCPPLT t .11.1 8 Electronics Designers Guide www.littelfuse.com ©2008 Littelfuse Silicon Protection Arrays Bi-Directinal ESD Protection Array Absolute Maximum Ratings Symbol Parameter Value Units 2 A IP Peak Current (tp TOP Operating Temperature °C TSTOR Storage Temperature °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Storage Temperature Range °C °C °C Electrical Characteristics (TOP = 25°C) Parameter Voltage Drop Symbol VD Standoff Voltage V Leakage Current ILEAK VC Clamp Voltage1 ESD Withstand Voltage VESD Test Conditions Min Typ IR=10mA 6.0 7.0 Diode Capacitance 1 2 Units V IR 6.0 VR V μA IPP=1A, tp 9.2 V IPP=2A, tp 11.2 V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) Reverse Bias=0V 1 Max kV 6 CD Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals Application Example MultiMedia Device MultiMedia Device 2 x SP1002-01 Audio Out L Audio In L Audio Out R Audio In R SCART MultiMedia Application of SP1002-01 www.littelfuse.com ©2008 Littelfuse 9 Electronics Designers Guide SP1002 Lead-free/Green Series Specifications are subject to change without notice. Silicon Protection Arrays Bi-Directinal ESD Protection Array Soldering Parameters Reflow Condition Pre Heat 1Co'SFFBTTFNCMZ - Temperature Min (Ts(min)) ¡$ - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak ¡$TFDPOENBY TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) oTFDPOET Peak Temperature (TP) °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C Part Numbering System Product Characteristics SP XXXX XX X T G G= Green Silicon Protection Array T= Tape & Reel Series Package Number of Channels Part Marking System Lead Plating .BUUF5JO Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material .PMEFE&QPYZ Flammability UL94-V-0 /PUFT 1. All dimensions are in millimeters 2. Dimensions include solder plating. XXX XXX %JNFOTJPOTBSFFYDMVTJWFPGNPMEnBTINFUBMCVSS Product Series "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" Number of Channels #MPJTGBDJOHVQGPSNPMEBOEGBDJOHEPXOGPSUSJNGPSNJFSFWFSTFUSJNGPSN 1BDLBHFTVSGBDFNBUUFmOJTI7%* Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. 41+5( 4$ #9 SP1002 Lead-free/Green Series Specifications are subject to change without notice. 10 Electronics Designers Guide www.littelfuse.com ©2008 Littelfuse Silicon Protection Arrays Bi-Directinal ESD Protection Array Package Dimensions B Solder Pad Layout 1.30 [0.0512] 3 e e 1.90 [0.0748] D A2 A A1 MO-203 Issue A L Inches Min Max Min Max A 0.80 1.10 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 B 0.006 0.012 c 0.08 0.010 D 0.089 E e 0.90 [0.0354] C 3 Millimeters 2 1 SC70-3 Pins JEDEC 0.65 [0.0256] 0.70 [0.0276] E HE Package 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Embossed Carrier Tape & Reel Specification - SC70-3 PO Dimensions ØD t Symbol F W E P2 AO A1 BO B1 ØD1 K1 P Min Max Min Max ' P2 0.077 0.081 D 1.40 1.60 D1 1.00 0.049 P0 4.10 0.161 W 40.0 +/- 0.20 7.70 P 4.10 0.161 0.090 0.098 B0 1.00 Ref B1 K0 ©2008 Littelfuse 8.10 A0 A1 www.littelfuse.com Inches E 10P0 KO Millimetres 3FG 0.090 1.90 Ref 1.10 0.098 0.074 K1 0.60 Ref 3FG t 0.27 max 0.010 11 Electronics Designers Guide SP1002 Lead-free/Green Series Specifications are subject to change without notice.